080930 Ipc 2152 Standard For Determining Current Carrying Capacity

•

5 j'aime•2,667 vues

ljh1680

Technologie Business

IPC Current Carrying Capacity Task Group (1-10b) August 2008 Michael R. Jouppi, Thermal Man, Inc., Task Group Chair ,[object Object],[object Object]

[object Object],[object Object],[object Object],[object Object],[object Object]

IPC-2152 ,[object Object],[object Object],[object Object],[object Object],Vision: Simple and Accurate Design Guidelines Standard for Determining Current Carrying Capacity in Printed Board Design

IPC-2152 ,[object Object],[object Object],[object Object],IPC-2152 is divided into two sections, a main document with simple charts and an appendix that discusses details that impact the temperature rise of a conductor and more.

IPC-2152 ,[object Object],[object Object],[object Object],IPC-2152 is based on industry standards test procedures and correlated computer simulations.

IPC-2152 ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],Current carrying capacity testing considered multiple environments, conductor width and thickness, PCB thickness and PCB materials.

IPC-2152 ,[object Object],[object Object],[object Object],[object Object],Conductors run hotter in a vacuum than in air by as much as 55% or more.

[object Object],[object Object],[object Object],[object Object],External conductors run hotter than internal traces in a still air environment . IPC-2152

[object Object],[object Object],[object Object],[object Object],[object Object],Conductors in thin PCBs run hotter than the same size conductor in thicker PCBs. IPC-2152

[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],For the same cross-sectional area a wider conductor (1 oz.) will run 15 to 20 percent cooler than a narrow conductor (3 oz). IPC-2152

[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],IPC-2152

[object Object],[object Object],[object Object],[object Object],[object Object],IPC-2152

[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],IPC-2152

[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],IPC-2152

[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],IPC-2152

[object Object],[object Object],[object Object],[object Object],IPC-2152

For more information … If you would like more information, contact IPC by e-mail at perrjo@ipc.org.

Contenu connexe

Tendances

Verilog HDL HasmukhPKoringa

Slide ghep kenh_so0126_384Kiem Phong

Pcb fabrication-processdagzhou

Chuong4 hoạt động định thờiĐinh Công Thiện Taydo University

VLSI Design- Guru.pptRam Pavithra Guru

io and pad ring.pdfquandao25

Transistor as a switchOmed Diyari

Study of vlsi design methodologies and limitations using cad tools for cmos t...Lakshmi Narain College of Technology & Science Bhopal

Proper Soldering processMachine shop ni Don Bosco

Full DDR Bank Power and Signal Integrity Analysis with Chip-Package-System Co...Ansys

Pcb Cost DriversTony Monaco

Setup and hold time violation in flip-flopsJong Hwan Shin

Stick DiagramKalyan Acharjya

Presentation 1.6-hdi-carbo-issuesJacob Mouw

Lecture19Dharmesh Goyal

Technical English for Engineers | Mechanical Engineer | Audit Course - III Yash Sawant

Code matlab mô phỏng dung lượng kênh truy ền reyleght trong kĩ thuật mimoPTIT HCM

Packaging of vlsi devicesAshu0711

Flux Cored Arc Weldingfaheem maqsood

Ciclotron dynamic 12000 h 2ωMuniz Rodrigues

Tendances (20)

Verilog HDL

Slide ghep kenh_so0126_384

Pcb fabrication-process

Chuong4 hoạt động định thời

VLSI Design- Guru.ppt

io and pad ring.pdf

Transistor as a switch

Study of vlsi design methodologies and limitations using cad tools for cmos t...

Proper Soldering process

Full DDR Bank Power and Signal Integrity Analysis with Chip-Package-System Co...

Pcb Cost Drivers

Setup and hold time violation in flip-flops

Stick Diagram

Presentation 1.6-hdi-carbo-issues

Lecture19

Technical English for Engineers | Mechanical Engineer | Audit Course - III

Code matlab mô phỏng dung lượng kênh truy ền reyleght trong kĩ thuật mimo

Packaging of vlsi devices

Flux Cored Arc Welding

Ciclotron dynamic 12000 h 2ω

En vedette

Ipc／whma a-620 b 簡介Yung Jui Chen 陳泳睿

Ipc簡介Yung Jui Chen 陳泳睿

Ipc／whma a-620 b 簡介Yung Jui Chen 陳泳睿

Ipc 國際電子工業聯接協會-服務概覽(2013-4-3)Yung Jui Chen 陳泳睿

Wire harness and cable assembly 不良而召回事件Yung Jui Chen 陳泳睿

如何上網搜尋資料Yung Jui Chen 陳泳睿

《獲利世代》導讀Bodylearning

Printed Circuit Board BasicsSierra Assembly

PCB Layout FundamentalsAnalog Devices, Inc.

Chapter13 pcb designVin Voro

En vedette (10)

Ipc／whma a-620 b 簡介

Ipc簡介

Ipc／whma a-620 b 簡介

Ipc 國際電子工業聯接協會-服務概覽(2013-4-3)

Wire harness and cable assembly 不良而召回事件

如何上網搜尋資料

《獲利世代》導讀

Printed Circuit Board Basics

PCB Layout Fundamentals

Chapter13 pcb design

Similaire à 080930 Ipc 2152 Standard For Determining Current Carrying Capacity

Reliability of Copper PTH for High Current ApplicationsEpec Engineered Technologies

IRJET - Numerical Analysis on Laminar Flow Forced Convection on a Channel wi...IRJET Journal

A Study on Stochastic Thermal Characterization of Electronic PackagesIJERA Editor

COMPARISON OF DUAL SOURCE TFET USING DIFFERENT DIELECTRIC MATERIALSIRJET Journal

DESIGN AND ANALYSIS OF COUNTER FLOW VORTEX TUBEIRJET Journal

Using Heavy Copper and EXTREME Copper in PCB Design and Fabrication for Maxim...Epec Engineered Technologies

Cable ampacity calculations iecJoe Khan

cable ampacity calculations- IECJoe Khan

ETAP - Ugs Underground Raceway SystemsHimmelstern

Heat transfer enhancement in fire tube boiler using hellically ribbed tubes.IRJET Journal

Comparative CFD Analysis of Shell and Serpentine Tube Heat ExchangerIRJET Journal

IRJET- Analytical Validation of Improvised Designs of a Busbar for Optimi...IRJET Journal

Chapter 7: Fluxtrol Induction Heating Case Studies and Success StoriesFluxtrol Inc.

A 2D MODELLING OF THERMAL HEAT SINK FOR IMPATT AT HIGH POWER MMW FREQUENCYcscpconf

Numerically and CFD studies on shell and tube heat exchangersIRJET Journal

Final 17213 basic electronics model answer formatHarshitParkar6677

IRJET- Experimental Analysis of Circular Perforated Fin Arrays by Forced Conv...IRJET Journal

Evaluation Performance ofan Annular Composite Fin by UsingMATLAB ProgrammingIJERA Editor

c4intercPaul Zucco

Thermal Artwork Transferring Machine for PCB ManufacturingIRJET Journal

Similaire à 080930 Ipc 2152 Standard For Determining Current Carrying Capacity (20)

Reliability of Copper PTH for High Current Applications

IRJET - Numerical Analysis on Laminar Flow Forced Convection on a Channel wi...

A Study on Stochastic Thermal Characterization of Electronic Packages

COMPARISON OF DUAL SOURCE TFET USING DIFFERENT DIELECTRIC MATERIALS

DESIGN AND ANALYSIS OF COUNTER FLOW VORTEX TUBE

Using Heavy Copper and EXTREME Copper in PCB Design and Fabrication for Maxim...

Cable ampacity calculations iec

cable ampacity calculations- IEC

ETAP - Ugs Underground Raceway Systems

Heat transfer enhancement in fire tube boiler using hellically ribbed tubes.

Comparative CFD Analysis of Shell and Serpentine Tube Heat Exchanger

IRJET- Analytical Validation of Improvised Designs of a Busbar for Optimi...

Chapter 7: Fluxtrol Induction Heating Case Studies and Success Stories

A 2D MODELLING OF THERMAL HEAT SINK FOR IMPATT AT HIGH POWER MMW FREQUENCY

Numerically and CFD studies on shell and tube heat exchangers

Final 17213 basic electronics model answer format

IRJET- Experimental Analysis of Circular Perforated Fin Arrays by Forced Conv...

Evaluation Performance ofan Annular Composite Fin by UsingMATLAB Programming

c4interc

Thermal Artwork Transferring Machine for PCB Manufacturing

Dernier

Connecting the Dots for Information Discovery.pdfNeo4j

A Glance At The Java Performance ToolboxAna-Maria Mihalceanu

React Native vs Ionic - The Best Mobile App FrameworkPixlogix Infotech

Microsoft 365 Copilot: How to boost your productivity with AI – Part one: Ado...Nikki Chapple

Transcript: New from BookNet Canada for 2024: BNC SalesData and LibraryData -...BookNet Canada

MuleSoft Online Meetup Group - B2B Crash Course: Release SparkNotesManik S Magar

Top 10 Hubspot Development Companies in 2024TopCSSGallery

Generative Artificial Intelligence: How generative AI works.pdfIngrid Airi González

Modern Roaming for Notes and Nomad – Cheaper Faster Better Strongerpanagenda

React JS; all concepts. Contains React Features, JSX, functional & Class comp...Karmanjay Verma

Accelerating Enterprise Software Engineering with PlatformlessWSO2

Why device, WIFI, and ISP insights are crucial to supporting remote Microsoft...panagenda

Microsoft 365 Copilot: How to boost your productivity with AI – Part two: Dat...Nikki Chapple

A Journey Into the Emotions of Software DevelopersNicole Novielli

Email Marketing Automation for Bonterra Impact Management (fka Social Solutio...Jeffrey Haguewood

Decarbonising Buildings: Making a net-zero built environment a realityIES VE

So einfach geht modernes Roaming fuer Notes und Nomad.pdfpanagenda

Microservices, Docker deploy and Microservices source code in C#Karmanjay Verma

Generative AI - Gitex v1Generative AI - Gitex v1.pptxfnnc6jmgwh

Time Series Foundation Models - current state and future directionsNathaniel Shimoni

Dernier (20)

Connecting the Dots for Information Discovery.pdf

A Glance At The Java Performance Toolbox

React Native vs Ionic - The Best Mobile App Framework

Microsoft 365 Copilot: How to boost your productivity with AI – Part one: Ado...

Transcript: New from BookNet Canada for 2024: BNC SalesData and LibraryData -...

MuleSoft Online Meetup Group - B2B Crash Course: Release SparkNotes

Top 10 Hubspot Development Companies in 2024

Generative Artificial Intelligence: How generative AI works.pdf

Modern Roaming for Notes and Nomad – Cheaper Faster Better Stronger

React JS; all concepts. Contains React Features, JSX, functional & Class comp...

Accelerating Enterprise Software Engineering with Platformless

Why device, WIFI, and ISP insights are crucial to supporting remote Microsoft...

Microsoft 365 Copilot: How to boost your productivity with AI – Part two: Dat...

A Journey Into the Emotions of Software Developers

Email Marketing Automation for Bonterra Impact Management (fka Social Solutio...

Decarbonising Buildings: Making a net-zero built environment a reality

So einfach geht modernes Roaming fuer Notes und Nomad.pdf

Microservices, Docker deploy and Microservices source code in C#

Generative AI - Gitex v1Generative AI - Gitex v1.pptx

Time Series Foundation Models - current state and future directions