3. 3
Logic Values
• Logic values = {0, 1}
• A logic value, 0 or 1, is called as BInary DigiT or BIT.
• Physical states representing bits in digital
technologies:
4. 4
Encoding Bits
• Information can be encoded using:
– Current, Voltage, Phase, Frequency
• Digital systems use two voltage levelsvoltage levels for encoding
bits.
– LOW: A signal close to the GND
– HIGH: A signal close to the VCC
5. 5
Encoding Bits
• Positive logic
– High: 1 and Low: 0
– Our convention in this course
• Negative logic
– High: 0 and Low: 1
6. 6
Logic Gates
• Gates are basic digital devices.
– A gate takes one or more inputs and produces an output.
– Inputs are either 0 or 1.
• Although they may have very different values of voltage.
– Output is either 0 or 1.
– A logic gate’s operation is fully described by a truth table.
7. 7
Logic Families – What is inside of a logic gate?
• A logic family is a collection of different integrated-
circuit chips that have similar input, output, and
internal circuit characteristics, but that perform
different logic functions.
• Logic gates are made from transistors.
– TTL (Transistor-Transistor Logic) family gates are made from
bipolar transistors.
– CMOS (Complementary Metal Oxide Semiconductor) family
logic gates are made from MOS transistors.
8. 8
MOS Transistors – N-type MOSFET
• OFF (open circuit) : when gate is logical zero
• ON (short circuit) : when gate is logical one
• Passes a good logical zero
• Degrades a logical one
9. 9
MOS Transistors – P-type MOSFET
• OFF (open circuit) : when gate is logical one
• ON (short circuit) : when gate is logical zero
• Passes a good logical one
• Degrades a logical zero
19. 19
CMOS Electrical Characteristics
• Digital analysis works only if circuits are operated in
specs:
– Power supply voltage
– Temperature
– Input-signal quality
– Output loading
• Must do some “analog” analysis to prove that circuits
are operated in spec.
– Fan-out specs
– Timing analysis (setup and hold times)
– Analysis involves only consequences of V = IR (static)
and q = CV (dynamic)
22. 22
Logic Levels
• Typical transfer characteristic of a CMOS inverter:
– LOW input level: < 2.4 Volt
– HIGH input level: > 2.6 Volt
• Transfer characteristic depends on power-supply
voltage, temperature and output loading.
23. 23
Logic Levels
• Should use more conservative specifications for LOW
and HIGH
– VILmax: max input voltage guaranteed to be recognized as a LOW level
• 30% of VCC
– VOLmax: max output voltage in the LOW level
• GND + 0.1 V
– VOHmin: min output voltage in the HIGH level
• VCC – 0.1 V
– VIHmin: min input voltage guaranteed to be recognized as a HIGH level
• 70% of VCC
25. 25
DC Noise Margins
• DC noise margin is a measure of how much noise it
takes to corrupt a worst-case output voltage into a
value that may not be recognized properly by an input.
– Noise Margin Low = VILmax – VOLmax
= 1.35– 0.1 = 1.25 V
– Noise Margin High = VOHmin – VIHmin
= 4.4– 3.15 = 1.25 V
26. 26
Input Currents
• CMOS gate inputs consume very little current, only the
leakage current of the two transistors’ gates.
– IIH: max current that flows into the input in HIGH state
– IIL: max current that flows into the input in LOW state
27. 27
DC Output Loading
• An output must sink
current from a load when
the output is in the LOW
state.
• An output must source
current to a load when
the output is in the HIGH
state.
28. 28
DC Output Loading Specs
• VOLmax and VOHmin are specified for certain output-current
values, IOLmax and IOHmax.
– IOLmax: max current that output can sink in the LOW state while
still maintaining an output voltage no greater than VOLmax
– IOHmax: max current that output can source in the HIGH state
while still maintaining an output voltage no less than VOHmin
29. 29
DC Output Loading - Output-voltage Drops
• Resistance of “off” transistor is > 1 Megaohm, but
resistance of “on” transistor is nonzero,
– Voltage drops across “on” transistor, V = IR
• For “CMOS” loads, current and voltage drop are
negligible.
• For TTL inputs, LEDs, terminations, or other resistive
loads, current and voltage drop are significant and must
be calculated.
• If too much load, output voltage will go outside of valid
logic-voltage range.
– VOHmin, VIHmin
– VOLmax, VILmax
30. 30
Fan-in
• The number of inputs that a gate can have in a
particular logic family is called the logic family’s fan-in.
– You could design a CMOS NAND or NOR gates with a very
large number of inputs.
– In practice, additive “on” resistance of series transistors
limits the fan-in of CMOS gates – Lower speed.
• Max fan-in = 4 for NOR, 6 for NAND
3-input NAND gate
7-input NAND gate using
4-input NAND gates
31. 31
Fan-out
• The fan-out of a gate is the number of inputs that the
gate can drive without exceeding its worst-case loading
specifications.
– Characteristics of the gate’s output
– Characteristics of the inputs that it is driving
• DC fan-out: The number of inputs that an output can
drive with the output in a constant state (high or low).
• AC fan-out: The ability of an output to charge or
discharge the stray capacitance associated with the
inputs that it drives.
– If the capacitance is too large, the transition from low to high
(or vice versa) may be too slow, causing improper system
operation.
32. 32
DC Fan-out Calculation
• LOW state: The sum of the IIL values of the driven
inputs may not exceed IOLmax of the driving output.
• HIGH state: The sum of the IIH values of the driven
inputs may not exceed IOHmax of the driving output.
Low State Fan-out=
20 μA/1 μA= 20
High State Fan-out=
20 μA/1 μA= 20
33. 33
AC Loading
• AC loading has become a critical design factor as
industry has moved to pure CMOS systems.
– CMOS inputs have very high impedance, DC loading is
frequently negligible (low fan-outs).
– CMOS inputs and related packaging and wiring have significant
capacitance.
– Time to charge and discharge capacitance is a major
component of delay.
• Gate’s speed and power consumption depend on the AC
characteristics of the gate and its load.
34. 34
Transition Time
• The amount of time that the output of a logic circuit
takes to change from one state to another is called the
transition time.
– tR : rise time – time to chage from low to high
– tF : fall time – time to chage from high to low
35. 35
Transition Time
• The rise and fall times of a CMOS output depend
mainly on
– “on” transistor resistance
– capacitive load
• Capacitive load = Stray capacitance = AC load
– Output circuits: A gate’s output transistors, internal wiring,
packaging
– The wiring that connects an output to other inputs
– Input circuits: A gate’s input transistors, internal wiring,
packaging
36. 36
Propagation Delay
• The propagation delay is the amount of time that it takes for a
change in the input signal to produce a change in the output signal.
– tPHL : high-to-low propogation time
– tPLH : low-to-high propogation time
– tPD : propogation delay; tPD= max (tPHL, tPLH)
• tPD determines the gate speed
37. 37
Power Consumption
• Static power consumption: Power consumption when the
circuit’s output is not changing
– Very low static power consumption for CMOS circuits
• Attractive for low-power applications
• Power consumption due to the leakage currents
• Dynamic power consumption: Power consumption when
the circuit’s output is in transition
PD = (CPD + CL) x (VCC)2
x f
– PT : Dynamic power consumption
– VCC: Power-supply voltage
– f: Transition frequency of the output signal
– CPD : Power-dissipation capacitance – Specified by the device
manufacturer and around 20-24 pF
C : Load capacitance
38. CMOS Logic Family
• 4000 series
– First commercially successful CMOS family
– Fairly slow and not easy to interface to TTL
• CMOS device part number: 74FAMnn or 54FAMnn
– HC/HCT: High speed CMOS/ High speed CMOS, TTL
compatible
– FCT/FCT-T: Fast CMOS/ Fast CMOS, TTL compatible
– VHC/VHCT: Very high speed CMOS/ Very high speed CMOS,
TTL compatible
39. CMOS-TTL Interface
• DC noise margin
– CMOS outputs driving TTL inputs: Ok
– TTL outputs driving CMOS inputs: CMOS device must be HCT,
VHCT or FCT
• Fan-out
– TTL outputs driving CMOS inputs: Ok
– CMOS outputs driving TTL inputs: Limited
• Capacitive loading
– Increasing delay and power consumption
– All CMOS families have similar dynamic power consumption
– TTL outputs have lower dynamic power consumption