ELECTRONIC COOLING
PACKAGING STRATEGY
THERMO/MECHANICAL
ARCHITECTURE
1

2

ENCLOSURE PARTITIONING
Rear
Disk Bay
Motherboard & CPU Bay
Distribution Plenum &
Power Supply Bay
EISA Bay
Chassis
Front
DISTRIBUTION PLENIUM & POWER SUPPLY
Rear •CPU (Vent#1)
Disk (Vent#3)
Air Discharge
Cooling Fans(2 Typ.)
Motherboard & CPU (Vent#2)
Air Supply
Front 3

PREDICTED SYSTEM FLOW
PARTITIONING
FAN PERFROMANCE
4

PREDICTED SYSTEM FLOW
SYSTEM
POWER SUPPLY
5

AIR FLOW STUDIES
Motherboard & Memory
Disk Bay
CPU
6

MAXIMUM PREDICTED STEADY STATE
COMPONENT TEMPERATURES
7

CPU DAUGHTER CARD
CRITICAL COMPONENTS
1Augmented
Cooling Study
(2/40mm LOW NOISE FANS IN II)
8
1. See page 13

CPU DAUGHTER CARD ANCILLARY COOLING
FAN PERFORMANCE
FLOW RESISTANCE
9

CPU & Memory
CPU
Side 1
Side 2
10

SUMMARY OF RESULTS
11

COMMERCIAL AND MILITARY DESK SIDE
WORK STATION
Rear
Bezel
35 SCFM@20°C
Front
12

SOLID MODEL 2 VIEWS
13

FLOW TEST RESULTS
HARDWARE RESISTANCE
SYSTEM COOLING
14

COMPARISON OF RESULTS
T∞ < 30°C
FLOW RATE/SCFM
COMPNENT VENT NOISE MEASURES PREDICTED DIFF
(BELS) (scfm) (scfm) (%)
FAN SPEED (rpm) NA NA 2440.0 1960.0 24.0
CPU 1 NA 27.3 24.5 14.0
PS/PS + LEAKS 2 NA 8.4/1.6 10.0 0.0
DRIVES (2) 3 4.5 3.3 3.5 -6.0
FANS (2) NA 4.4 41.0 38.0 4.0
T∞> 40°C
FLOW RATE/SCFM
COMPNENT VENT NOISE MEASURES PREDICTED DIFF
(BELS) (scfm) (scfm) (%)
FAN SPEED (rpm) NA NA 3940.0 3780.0 4.0
CPU 1 NA 50.6 49.0 3.0
PS/PS + LEAKS 2 NA 15.7/3.0 20.0 -6.0
DRIVES (2) 3 4.5 6.2 7.0 -11.0
FANS (2) NA 5.7 76.0 76.0 0.0
T∞ = ambient temperature
15

MEASURE WORST CASE STEADY STATE
M
JUNCTION TEMPERATURES
16

17

PERFORMANCE SUMMARY
18