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INDEX
 Introduction
 Basics
 Features
 Chipset
 Asus Rampage-2
 Internal Representation of core i7
 Intel processors ratings
 Compare i3,i5 & i7
 Conclusion
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INTRODUCTION
 The Intel Penryn micro architecture, which included the Core
2 family of processors, was the first mainstream Intel
microarchitecture based on the 45nm fabrication process. This
allowed Intel to create higher-performance processors that
consumed similar or less power than previous-generation
processors.
 The Intel Nehalem microarchitecture that encompasses the
Core i7 class of processors uses a 45nm fabrication process for
different processors in the Core i7 family. Besides using the
power consumption benefits of 45nm, Intel made some dramatic
changes in the Nehalem microarchitecture to offer new features
and capabilities in the Core i7 family of processors.
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BASICS
 A quad core processor consists of four cores. Quad core
technology is a type of technology that includes two separate
dual-core dies, where dual-core means a CPU that includes two
complete execution cores per physical processor, installed
together in one CPU package. In this setup cores 1 and 2 would
share a memory cache, and core 3 and 4 another cache.
Communication between core 1 and 2 and core 3 and 4 using
QPI(Quick Path Interconnect)
 In computer architecture, 64-bit integers, memory addresses, or
other data units are those that are at most 64 bits (8 octets) wide.
Also, 64-bit CPU and ALU architectures are those that are based
on registers, address buses, or data buses of that size.
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FEATURES
1. New Platform Architecture
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 The previous Intel microarchitectures for a single processor system included three
discrete components: a CPU; a Graphics and Memory Controller Hub (GMCH), also
known as the Northbridge(a very high speed devices); and an I/O Controller Hub
(ICH), also known as the Southbridge. The GMCH and ICH combined are referred
to as the chipset.
 In the older Penryn architecture, the front-side bus (FSB) was the interface for
exchanging data between the CPU and the Northbridge. If the CPU had to read or
write data into system memory or over the PCI Express bus, then the data had to
traverse over the external FSB. In the new Nehalem microarchitecture, Intel moved
the memory controller and PCI Express controller from the Northbridge onto the
CPU die, reducing the number of external data bus that the data had to traverse.
These changes help increase data-throughput and reduce the latency for memory and
PCI Express data transactions. These improvements make the Core i7 family of
processors ideal for test and measurement applications such as high-speed design
validation and high-speed data record and playback.
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2. Higher-Performance Multiprocessor Systems with QPI
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Not only was the memory controller moved to the CPU for Nehalem
processors, Intel also introduced a distributed shared memory
architecture using Intel Quick Path Interconnect (QPI). QPI is the new
point-to-point interconnect for connecting a CPU to either a chipset or
another CPU. It provides up to 25.6 GB/s of total bidirectional data
throughput per link.
Intel’s decision to move the memory controller in the CPU and
introduce the new QPI data bus has had an impact for single-processor
systems. However, this impact is much more significant for
multiprocessor systems.
 Nehalem-based multiprocessor system each CPU has access to local
memory but they also can access memory that is local to other CPUs via
QPI transactions. For example, one Core i7 processor can access the
memory region local to another processor through QPI either with one
direct hop or through multiple hops.

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3. CPU Performance Boost via Intel Turbo Boost Technology
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 Clock Speed 1.2 GHz (slowest) & 3.5 Ghz (fastest) or 3.9GHz via
Turbo Boost Technology.
 To provide a performance boost for lightly threaded applications and
to also optimize the processor power consumption, Intel introduced a
new feature called Intel Turbo Boost. Intel Turbo Boost is an
innovative feature that automatically allows active processor cores to
run faster than the base operating frequency when certain conditions
are met.
 Intel Turbo Boost is activated when the OS requests the highest
processor performance state. The maximum frequency of the specific
processing core on the Core i7 processor is dependent on the number
of active cores, and the amount of time the processor spends in the
Turbo Boost state depends on the workload and operating
environment.
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4. Improved Cache Latency with Smart L3 Cache
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 32 KB L1 instruction and 32 KB L1 data cache per core.
 256 KB L2 cache (combined instruction and data) per core.
 8 MB L3 (combined instruction and data) shared by all cores.
 Cache is a block of high-speed memory for temporary data storage located on
the same silicon die as the CPU. If a single processing core, in a multicore
CPU, requires specific data while executing an instruction set, it first searches
for the data in its local caches (L1 and L2). If the data is not available, also
known as a cache-miss, it then accesses the larger L3 cache. In an exclusive L3
cache, if that attempt is unsuccessful, then the core performs cache snooping –
searches the local caches of other cores – to check whether they have data that
it needs. If this attempt also results in a cache-miss, it then accesses the slower
system RAM for that information. The latency of reading and writing from the
cache is much lower than that from the system RAM, therefore a smarter and
larger cache greatly helps in improving processor performance.
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5. Optimized Multithreaded Performance through Hyper-
Threading
 Each of the four cores can process up to two threads simultaneously, so the processor
appears to the OS as eight CPUs.
 Hyper-threading (officially termed Hyper-Threading Technology or HTT) is an Intel
technology used to improve parallelization of computations performed on PC
microprocessors.
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 Intel introduced Hyper-Threading Technology on its processors in 2002. Hyper-
threading exposes a single physical processing core as two logical cores to allow
them to share resources between execution threads and therefore increase the
system efficiency. Because of the lack of OSs that could clearly differentiate
between logical and physical processing cores, Intel removed this feature when it
introduced multicore CPUs. With the release of OSs such as Windows Vista and
Windows 7, which are fully aware of the differences between logical and physical
core, Intel brought back the hyper-threading feature in the Core i7 family of
processors.
 Hyper-Threading Technology benefits from larger caches and increased memory
bandwidth of the Core i7 processors, delivering greater throughput and
responsiveness for multithreaded applications.
 Hyper-threading allows simultaneous execution of two execution threads on the
same physical CPU core.
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6. Higher Data-Throughput via PCI Express 2.0 and DDR3 Memory
Interface
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 The new processors feature the PCI Express 2.0 data bus, which doubles the data
throughput from PCI Express 1.0.
 The memory is directly connected to the processor.
 Three channel memory: each channel can support one or two DDR3 RAM’s.
Motherboards for Core i7 have four or six RAM slots.
 DDR3 RAM (double-data-rate three random access memory ) is a random
access memory technology used for high speed storage of the working data in the
computer.
 The benefit of DDR3 is the ability to run its I/O bus at four times the speed of the
memory cells it contains, thus enabling faster bus speeds and higher peak
throughput than earlier memory technologies.
 The DDR3 standard allows for chip capacities of 512 megabits to 8 gigabits,
effectively enabling a maximum memory module size of 16 gigabytes.
 There is a significant reduction in power consumption. It needs only 1.5V
compared to 1.8V for DDR2.
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7. SOCKET
A cpu socket or processor socket providing both power and offering
a way to transfer data from the processor to the rest of the PC.
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 The core i7 uses an LGA1366(Socket B) and is incompatible with the previous
versions
 LGA stands for land grid array and consists of a socket with pins on which the
processor is placed. PGA, on the other hand, places the pins on the processor,
which are then inserted in a socket with appropriately placed holes. Intel uses the
former while AMD uses the latter.
 Intel supposedly decided to switch to an LGA socket because it provides a
larger contact point, allowing, for example, higher clock frequencies. The
LGA setup provides higher pin densities, allowing more power contacts and thus
a more stable power supply to the chip.
 Intel gives its LGA sockets names based on the number of pins. LGA 1366, for
example, has 1366 individual pins on the socket.
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8. Processor thermal solution using ATS heat sink

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 In electronic systems, a heat sink is a passive heat exchanger that cools a device
by dissipating heat into the surrounding medium.
 In computers, heat sinks are used to cool central processing units or graphics
processors
 The processor has a Thermal Design Power of 130W and will slow itself down if
the power is exceeded.
 The Thermal Design Power (TDP) (sometimes called Thermal Design Point)
represents the maximum amount of power the cooling system in a computer is
required to dissipate
 The cost per piece is Rs. 47,000 in lots of 1000 units.
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CHIPSET
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 A chipset is a group of integrated circuits, or chips, that are
designed to work together, and are usually marketed as a single
product.
 In personal computers based on Intel Pentium-class microprocessors,
the term often refers to a specific pair of chips on the motherboard:
the northbridge and the southbridge.
 The northbridge links the CPU to very high-speed devices,
especially main memory and graphics controller
 The southbridge connects to lower-speed peripheral buses (such as
PCI or ISA).
 In many modern chipsets, the southbridge actually contains some
on-chip integrated peripherals, such as Ethernet, USB, and audio
devices. A chipset is usually designed to work with a specific family
of microprocessors. Because it controls communications between the
processor and external devices, the chipset plays a crucial
role in determining system performance.
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 The northbridge typically handles communications among the CPU, RAM,
AGP or PCI Express, and the southbridge. Some northbridges also contain
integrated video controllers, also known as a Graphics and Memory
Controller Hub (GMCH) in Intel systems.
 The southbridge is a chip that implements the "slower" capabilities of the
motherboard. Because the southbridge is further removed from the CPU, it is
given responsibility for the slower devices on a typical microcomputer.
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 Asus's ROG series motherboards have an unparalleled reputation
within the overclocking community and their Rampage II
Extreme motherboard is the next step. Based on ICH10R chipsets,
this ATX board is ready to host the newest LGA1366 Core i7
processors for ultimate powerful performance.
 High end motherboard intended mainly for the gamers with the
best features of graphics and overclocking.
 Provides ultra-realistic graphics and high-impact, professional
gaming performance.
 Up to 12GB of DDR3 1333 RAM can be installed in triple channel
mode providing increased performance. Get even more
performance – up to 1800Mhz – through overclocking.
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 Overclocking is the process of forcing a computer component to
run at a higher clock rate (more clock cycles per second) than it
was designed for or was designated by the manufacturer, usually
practiced by personal computer enthusiasts in order to increase
the performance of their computers.
 Operating voltages may also be changed (increased), which can
increase the speed at which operation remains stable.
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Brand
Desktop
Code Name
Cores Process Date
Laptop
Code name
Cores Process Date
Core i7
Bloomfield
Lynnfield
Gulftown
Sandy Bridge
Sandy Bridge-
E
(3rd)Ivy Bridge
Haswell
4
4
6
4
4/6
4
4
45 nm
45 nm
32 nm
32 nm
32 nm
22 nm
22 nm
November 2008
September 2009
July 2010
January 2011
November 2011
April 2012
June 2013
Clarksfield
Arrandale
Sandy Bridge
Sandy Bridge
Ivy Bridge
4
2
4
2
2
45 nm
32 nm
32 nm
32 nm
22 nm
September
2009
January 2010
January 2011
February
2011
May 2012
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 Core i7 (Business and HighEnd)
 Core i5 (Mainstream Consumers)
 Core i3 (Entry- Level)
 Celeron
 Pentium
 DMI and Integrated GPU
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 Threads : 4, 2-4, 8 Simultaneous Threads resp.
 Cache : 3-4 MB, 3-8 MB, 4-8 MB resp.
 Hyper-Threading Technology
 TurboBoost Technology
 Heat and Energy Efficient
 MicroAcrcitecture
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 In a test performed on a leaked hardware, the core i7
outperformed the currently fastest core2 extreme
processor.
 It has got the advantages of High Performance, Big
Cache Size, Very Fast, Highly Overclockable, Quite
Cooling and Power Efficient.
 Some of the disadvantages include the requirement of
newer motherboards, sensitive to higher voltage and
cost.
 The technology keeps on improving as the need for
faster and high end applications increases. The 8
core version is about to be released soon.
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