CCI TECHNOLOGY
One Stop Technology Solution
Provider
CCI’s InP/InGaAsP
Technology
CCI offers Indium Phosphide (InP)
Photonics & Optoelectronics Inte-
grated Circuit Technology and En-
gineering Consulting Capture Create
and Contracting Ser-
vices in InGaAs on
Innovate
InP, Si Process Tech-
nology, R&D, WLP,
Chip Design, Chip
Design, Development, Reliability
Engineering, QC, InP Material Char-
acterization, InP Microelectronic
Assembly Packaging. Capture Create Innovate
CCI focuses on integrated optical
transmitters and transceivers in
InP, LEDs. CCI also invites oppor-
tunities for OC-768 (40Gbs) system CCI TECHNOLOGY
components such as transim-
Dr. Rajan Subramanian, Ph.D
pedence amplifiers (TIA), postam- Murphy, Texas, USA.
plifiers, laser drivers, multiplexer/
demultiplexer parts, clock multi-
plier units and clock-and-data re-
Cell Phone: 469-323-3345
covery circuits. Off: 972-836-6735
E-mail: drraj@ccicloud.com
www.ccicloud.com
CCI’s Consulting and Contracting
services portfolio includes various
III-V process technologies such as
InP, InGaAs, GaN, GaAs (pHEMT,
MESFET), InGaAsP & HBT. Tel: 469 323 3345

CCI’s Indium Phosphide (InP) Technology Services
process improvements to
CCI’s InP Services: CCI’s Expertise & Services: high volume manufacturing.
III-V Process Technology, Compound • Perform die level characteriza-
Semiconductor Wafer Foundry Proc- • InP Optical Transmitters De- tion of InP devices.
esses, Device Testing vices, Receivers, LED Process • Design, develop and implement
Characterization; Packaging Technology reliability characterization of
• InP Wafer Fab & Assembly
Process Sustaining Engineering
• InP Characterization and Reli-
ability Engineering
• Indium Phosphide(InP), Re-
search and Development (R&D)
Assembly - Wafer Level Packaging • Transfer InP Manufacturing
Au, 3D TSV, Processes, Production Lines,
Copper Flip Chip and Facility
Power Packaging InP semiconductor devices
• InP “turn-key” Manufacturing
Integrated Solution Provider-MOCVD, MBE • Develop software and hardware
Design Services: needed to efficiently implement
Indium Phosphide (InP), Compound static and dynamic charac-
MMIC, MMW, MCM (Multichip
Semiconductor Wafer Fabrication terization of InP semiconductor
Module) Actives & Passives
2”, 3”, 4”(100mm), Processes: devices
Die Level, Emerging Tech-
nologies and Products Con- • Develop and Sustain Robust • Design of experiments (DOE)
sulting Service Plasma Etch, Lithography and • Statistical Process Control (SPC)
Deposition Production • SPC software (JMP) and Auto-
Processes for InP/GaAs High matic Data Collection Systems
Manufacturing Product lines. • Database Query Tools:
• Production Tool Startup, Oracle, SAP, Spotfire, Access
CCI TECHNOLOGY • Process Qualification, • Fab Metrology Equipments &
Dr.Rajan Subramanian, Ph.D • Identify and Troubleshoot Material Characterization :
Murphy, Texas, USA. Problems, SEM, TEM, Auger, XRD,
• Design and Support Yield SIMS, RBS, Hall, CD, CV,
Enhancement Programs, Ellipsometry,
Phone: 469-323-3345 • Establish Cost and Cycle • Failure analysis techniques and
Off: 972-836-6735 Time Improvements, • process control techniques,
E-mail: drraj@ccicloud.com • Characterize and release • Root cause Investigation of
Www.ccicloud.com
Yield Issues