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Innovation Summit 2015 - 4 - CF3

  1. Need for compatibility and future-proof design CF3™
  2. Need for compatibility and future-proof design Wireless Interface 2G 3G 4G Application Processing Essential Connectivity Pin countFeatures CF3™ Future
  3. CF3™ concept definition Common Generations|Technologies Flexible Solder-down|Socket-able Form FixedSize Factor StandardFootprint
  4. 3 keys to CF3™ Miniaturization •  XY  dimension  convergence   22mm  x  23mm       •  Innova2ve  +  cost  compe22ve     packaging  technology  
  5. 3 keys to CF3™ RF PCB RF ComponentsRF Components Baseband PCB Baseband Components Miniaturization RF Components Baseband PCB Baseband Components Typical module layout >1,000mm2 ~500mm2CF3™ module layout [TOP VIEW] [SIDE VIEW]
  6. 3 keys to CF3™ RF PCB RF ComponentsRF Components Baseband PCB Baseband Components Main Board 1 Main Board 2 Frame Board 0.8mm 1.2mm Metal Can Solder Solder Miniaturization
  7. 3 keys to CF3™ Footprint •  Future-­‐proof  +  swappable     •  2  flexible  footprint  designs  
  8. 3 keys to CF3™ CORE PINS never change, guaranteed forward / backward compatibility EXAMPLE Reset pin will always be: •  Pin 11 •  Voltage: 1V8 •  Polarity: active-lowRES EXTENSION PINS enable additional features without impacting compatibility EXAMPLE GNSS antenna will always be on pin 38 in every CF3 module with GPS + Glonass Footprint CUSTOM PINS enable unique module-specific features EXAMPLE MIPI Debug may be on pins 2,8,9,10,60 in some modules
  9. 3 keys to CF3™ Footprint Essential Connectivity footprint TOTAL Core Ext. 28 38 66 Application Processing footprint TOTAL Core Ext. 62 95 157
  10. 3 keys to CF3™ Socket •  Common  socket  for  all  plaCorms     •  Rugged  enough  to  withstand  any     environmental  requirements  
  11. 3 keys to CF3™ Socket snap-in snap-out solder down Both options use the same board space
  12. CF3™ + AirPrime® embedded modules CF3™   Essential Connectivity: HL Series Application Processing: WP Series 2G 3G 4G 3G 4G
  13. CF3™ + AirPrime® embedded modules Wireless Interface 2G 3G 4G Application Processing Essential Connectivity Pin countFeatures CF3™
  14. PLATINUM  SPONSOR   GOLD  SPONSORS   Innovation Summit 2015
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