1. IMAPS Advanced Technology Workshop on
Military, Aerospace, Space
and Homeland Security:
Packaging Issues and Applications
Renaissance Harbor Place Hotel
Baltimore, Maryland 21202
March 12 - 14, 2003
COTS Approach to Military
Microprocessor MCMs
By Tom Terlizzi
Aeroflex
March 12, 2003

2. Outline
1. Background-COTS: A Double Edged Sword?
2. Design and Development of a Robust MCM Technology
3. High Performance 64 Bit MIPSTM Microprocessor Platform
4. Where are we going?
5. Summary
6. Conclusions

3. Background: COTS: A Double Edged Sword?
• GOAL: Take advantage of technological advances in the
commercial and industrial component environment.
• Reduce costs at both the component and system level.
• Gain access to, “Cutting Edge Technology!”
• Reduce component and system lead times.
• REALITY: Accelerated exposure to component
obsolescence for major OEM’s and a new acronym DMS
(Diminished Manufacturing Sources).
• COTS products Life Cycles prove to be incompatible with military program Life
Cycles and funding requirements; obsolescence increases.

4. Background: COTS: A Double Edged Sword?
Percentage of U.S. Semiconductor Production Designated for Military
Use By $ Value
35%
30%
25%
20%
15%
10%
5%
0%
1955 1975 1995 *2005
Source “Revolution in Miniature”
Braun & MacDonald
(*2005 Estimate 0.3% ICE Walt Lahti)

5. Background: COTS: A Double Edged Sword?

7. The B52 will almost 90 Years Old here

8. It Used to Be That The Pilots
Were Older Than The Planes

9. Now The Planes Are Older Than The
Parents And Grandparents Of The Pilots

10. Design and Development of 1608 MCM
1. Conservative HTCC Package Technology
2. Electrical Analysis
3. Thermal Analysis
4. Mechanical Analysis

11. Electrical Analysis

12. Thermal Analysis

13. Thermal Analysis

14. Thermal Analysis

15. Mechanical Analysis

16. Thin Film Interposer
R4400 1 mil Aluminum
Die wire Bonds from
R4400
Microprocessor
die to the thin
film interposer
1 mil Gold
Thin film wires from
on the thin film
ceramic interposer to
“picture the cofired
frame” ceramic
package- two
tier bonding
shelf

17. MIPS uP with L2 Cache
280 Lead CQFP (F10)
MILESTONES
• 1993: Introduced (256K of L2 cache)
• 1994: 1st obsolescence; uP die
• 1995: 2nd obsolescence; memory die
• 1996: Introduced (1M of L2 Cache)
• 1997: 3rd obsolescence; uP die
Introduced window frame
• 1998: LRIP Production Orders
EOL of R4400 uP (die banking)
• 1999: R4400 production; Prototype of
RM5271 based part (2M of L2)
• 2000/2001:Continued R4400 production
1608-XX & 1638-XX
•EMD Phase of RM5271 part
4430SC-F10 & 4431SC-F10
•2002/2003 Continued R4400 & 5271
5271SC-F10 production

18. MIPS uP Standard Products
208 Lead CQFP MILESTONES
(F17 or F24)
• Feb 1997: Announce MIPS Roadmap based
on QED RM52XX & RM7000 family
• April 1997: 1st Design Win for 5260PC-F17
• Oct 1997: Ship 5260PC-F17 Prototype parts
• Jan 1998: 1st Design Win for 5270PC-F24
• June 1998: Ship 5270PC-F24 Mil-Temp parts
LRIP for Mil-Screened 5260PC-F17
• Sept 1998: 1st Design Win for 7000SC-F24
• Nov 1998: Ship 7000PC-F24 Mil-Temp parts
• Jan 1999: Ship 1st 5260PC-F17 Mil-Screened
• Balance 1999: Design wins for 7000SC-F17
5260PC 5270PC • 2000/2002: Production Phase 5260PC-F17
7000SC 7000ASC 7000SC-F17
•2003 7000ASC 1st Design Win

19. Our Partner -MIPS Technologies, Inc.
Licensees its Intellectual Property (IP) and cores for high
performance cost-effective 32- and 64-bit processors
Encouraging innovative development, diversity, multisourcing and
competitive pricing
Over 37 chip-design teams currently at work
Slide Source: MIPS Technologies Inc.

20. MIPS RISC Processors
Worldwide
New performance standards with MIPS32TM and MIPS64TM which are
fully MIPS IVTM and MIPS VTM compatible
Broadest architectural alliance for 32/64 bit cores
Only embedded 64-bit architecture in volume production
The most compact / powerful cores:
MIPS per square millimeter
MIPS per dollar
Best Watts/MIPS
MIPS products are commercially available from 10 sources including
PMC-Sierra, IDT,LSI, NKK, NEC & Philips
Slide Source: MIPS Technologies Inc.

21. MIPS: Scalable Products
R12000 R9000X2
R7000 MIPS-IV
R5400
R10000
R5260
R5230
R5000
Licensees: R8000
R4700
IDT R4650 MIPS-III
Performance
LSI Logic R4640
R4600
NEC
R4400 R4300 R4102
Philips R4101
Toshiba R4200
R4100
MR4010
PMC-SIERRA
R33700 MIPS-II
R4000 R33500 R1900
R3900 TR4101
MR4001
R6000
R3081
R3051
R3000 R33000 R33050 MIPS-I
1988 1990 1992 1994 1996 1998 2003
Time
Slide Source: MIPS Technologies Inc.
.

22. MIPS Development Tools
24 Operating
Systems
15 Compilers
17 Debuggers n
t hals!
re too
Mo 0
13 Simulation Tools 17
41 Other Software
Tools
67 Hardware plus, many
Development Tools
plus, many
other companies ...
other companies ...

23. Aeroflex MIPS uP Evaluation Products
179 Pin Adapter MILESTONES
• May 1997: RM5260 Commercial parts available
208 PQUAD only
• July 1997: 1st 5260PC Adapter shipped to OEM
• Oct 1997: RM5270 Commercial parts available
208 PQUAD only
• Jan 1998: 1st 5260PC Adapter shipped to OEM
• May 1998: RM7000 Commercial parts available
5260PC-P10 302 SBGA only
5270PC-P10 • Sept 1998: 1st 7000SC Adapter shipped to OEM
7000SC-P10 • Aug 1999: RFP to build 7000SC to 223 PGA
7000SC-P11
• Nov 1999: 1st 7000SC to 223 PGA adapter shipped
7000ASC-P11
• Dec 2000 1st 7000ASC to 223 PGA
adapter shipped

24. Evaluation Products
(Pin-out equivalent to R4400, R4700 & R5000 PGA)
ACT-5260PC-P10-POD
ACT Part Numbers
ACT-5260PC-P10-POD
ACT-5270PC-P10-POD
ACT-527XPC-P10-POD
ACT-7000SC-P11-POD
ACT-7000ASC-P11-POD

25. The MIPS Architecture
A Partnership for Success
Aeroflex Circuit Technology Support Partners
• MIPS MCM Architecture PMC-SIERRA
• High-Performance / High- • MIPS Architecture
Reliability Screening Utilization of advanced • High-end CPU Design
processor technology • Core & Derivative Designs
• ( MIL-883)
Early access to future
Competencies
• High-end Integrated L2 • Die Source
processor information
& L3 Cache MCM Designs • Technical Support
• Integrated Products • MIPS Processor Sales
w/Configurable Peripherals
• High Density Flash / SRAM / MIPS
SDRAM / EEPROM MCMs Real Time evaluation
of new processors • MIPS Hardware / Software Design
• Market & Infrastructure High-Rel performance • MIPS RISC Microprocessor
Development feedback Development Board Designer &
• Sales / Service / Technical Derivative design input Supplier
Support For MIL/Aero market • Technical Support / Training

26. Where are we going?
• Continue to support and expand our MIPS Roadmap
Currently offering 5 families of MIPS Microprocessors
Featuring MIPS III, MIPS IV & MIPS IV Superset Architecture
• Exploring new packaging solutions
Chip on Board Flip Chip BGA Chipscale Packages
• Offer Integrated Products
Single Board Computers (SBC)
ACT-7000BM: PMC Bootable MIPS PCI Mezzanine Card
NEW STAR MVP® : Family of Militarized VMEbus SBC’s
• COTS at the board level
Qualification of the equipment function not the components
• Pursue additional strategic agreements with commercial
technology leaders
Expand our cutting edge philosophy to products
• Evolve with the changing definition of COTS

27. PMC-Sierra MPD Roadmap
0.1u
Core Performance (MHz)
1500 RM9000xx
0.13u
RM9000xx
RM9000xx ts
0.13u
ed Produc
1000
RM9000x2 Integrat
RM9000
RM7000D
0.13u
0.13u RM7000C
RM7000B RM7065C
500 0.18u 0.18u D)
sA
RM7000A RM7065A
ucts (S y
ar d Prod Early Design
RM5261A Stand Late Design
RM5231A Available
2000 2001 2002 2003 2004

28. RM7000 Product Comparison
Feature RM7000A RM7000B RM7000C
Maximum Core 400 500 600
Frequency (MHz)
Max SysAD Bus 125 125 200
Frequency (MHz)
External Cache 8MB 8MB 64MB
Vectored 10 10 10
Interrupts
Recommended GT64120A GT6424x GT6424x
System GT961xxA Atlantis
Controller
Package 304 TBGA 304 TBGA 304 TBGA
Drop-In Replacements

29. ACT Product Roadmap ACT-9000X2
ACT-9000X2
1G
64-Bit High ACT-7000CSCL3
Production ACT-7000CSCL3
Performance (Dhrystone MIPS)
Production Performance
Planned
Planned ACT-7000CSC
ACT-7000ASC
ACT-7000ASC ACT-7000CSC
550
Potential
Potential ACT-7000SC
ACT-7000SC
ACT-5271SC 64-Bit Mid-Range
ACT-5271SC
450 Performance
ACT-5270PC
ACT-5270PC ACT-5261PC
ACT-5261PC ACT-5261APC
ACT-5261APC
350 ACT-5231PC
ACT-5260PC
ACT-5260PC ACT-5231PC
32-Bit Entry Level
250 Performance
ACT-5230PC
ACT-5230PC
1998 1999 2000 2001 2002 2003 2004
Product
Progression

30. NEW STAR VII MVP ACT7000SC with
TOP SIDE cavity down
“commercial foot-
print”

31. ACT-7000BM PMC MODULE
PMC
Header
32MB
SDRAM
RM7000
PCI CPU
Bridge
I/O Control
10/100 FPGA
Ethernet 8MB
FLASH
Mezzanine PCI Bus
Connectors 64-Bit

32. ACT Military and Hi-Rel MIPS Products
Avionics Systems
ACT designs & Assembly
Military & Hi-Rel MIPS Advanced MCM Smart Munitions
products for use in Technology
high-performance
demanding environments The Customer
Military
ACT Applications Industrial
ACT Applications
Technology
Technology Partner
Driver Resources
Driver
Performance ACT & MIPS High-performance
PMC-SIERRA
Design Military & Hi-Rel drives features processors
Products that leverage off
high volume markets Derivative
Volume provides
ensuring a viable architectural products
source of supply viability Software Hardware

33. Summary
• COTS is here to stay…The definition continues to change
• The markets for semiconductor devices are driven
exclusively by commercial and consumer industries
New product are being designed to perform in commercial or
industrial temperature ranges only
• The military will no longer have dedicated component
sources…Military spending accounts for only 0.3% of total US
semiconductor sales projected in 2005
• Component obsolescence presents a serious challenge
to both Component Manufactures and OEM’s
• Component obsolescence will issue will only increase

34. Conclusions
• COTS is here to stay...
• “Military MCM,” suppliers can develop a successful
strategy to support typical military Product Life Cycles.
• Component suppliers must be flexible and able to adapt:
the market is constantly changing…
New IC sources and new semiconductor technology
Die Shrinks
Evolving packaging technology
“Alphabet soup of new fabless companies”
With “A Proactive Approach” a MCM
Suppliers can be successful in the COTS world

35. “You’re
Not
Getting
Older
Your’re
getting
Better”