Светодиды, упаковка

1. Micro Components Ltd. (MCL) Rusnano Forum 10/2009 MCL ALOX™

2. Electronic Packaging

3. LED Supply Chain Light Engine Luminair/ Lighting fixture - MCL

4. The Problem - Thermal Management Note the high portion (56%) of temp. related failures Note how critical is thermal performance on The LED overall performance

6. The Packaging & Substrates World Cost Performance ALOX™ : A Disruptive Nano Packaging Technology Laminate substrates Ceramic HTCC/LTCC substrates ALOX TM substrates Highest Cost/Performance value

7. High Power Multilayer ALOX (BGA, LGA, attach to heat-sink) 200-350µm Mostly Aluminum Heat Sink Area Heavy Aluminum Layer

8. ALOX TM - Nanotechnology Internal Aluminum Layer – Ground / Power Aluminum via Al 2 O 3 modified Copper Metalization Solder mask CORE Typical 0.1- 0. 3 mm Blind Via/ Thermal via Multilayer Interconnect Substrate Nano Porous Composite

9. Aluminum Blind / Thermal via Aluminum Oxide (ALOX) Cu plating Cross Section Photo

10. The Heart of the Technology - ALOX™ Anodizing process: (Nano Pores SEM Photography) ALOX™ genuine Nano-Technology Need control of Pores Critical for ALOX properties and performance

11. Selective Oxidation of Aluminum Substrate ALOX™via Formation Concept 4. Anodize unprotected aluminum (conversion to non - conducting aluminum oxide) 5. Strip Resist 1. Aluminum Layer 2. Mask 3. Pattern the Mask -

14. RGB Strip Lighting-Up

15. BLU Coupon Lighting

16. Main Area of Application: Substrates for High Power Modules Such as various DC/DC converters for mobile electronics 10mm

18. ALOX™: Wide Application Platform Technology ALOX™ Enhanced CSP: Thermal, Higher density & Performance BGA / FC & W/B High Pin Count Thermal Our Focus application area: Power LEDs, LED Arrays Power Modules , Boards RF modules, CPUs

19. HB LED Forecast HB-LED Substrates market (est.) : $600 mil. (2009)  >$1.5 b (2012)

20. High Brightness (HB) LED Market MCL strategy is to focus first on the High Brightness (HB) LED Business

21. Corporate Summary Business: Microelectronics Packaging Technology Products: Special Packaging Solutions; IP Technology Licenses Major Applications: HB LEDs , High Power Electronics ; Portables Primary Market: High Power and HB LEDs devices and modules Technology : ALOX™ ; Innovative Substrate Fabrication Technology Patents: 24 patents; 8 patents families; 7 Granted US and International, Key Attributes: High Thermal Performance; High Density and Better Form factor; Low Cost

25. Thank You Micro Components Ltd www.mcltek.com Dr. Uri Mirsky, CEO Tel: 972-4-644 2666 Fax: 972-4-644 2665 mobile: 972-52-2477629 [email_address] Direct Contact : Disclaimer This document may contain some forward looking statements which involve known and unknown risks, delays, uncertainties and other factors not under the Company's control which may cause actual results, performance or achievements of the Company to be materially different from the results, performance or expectations implied by these forward-looking statements. The Company gives no warranty and accepts no responsibility for the accuracy or the completeness of the material, and reserves the right at any time to make changes, as it deems appropriate. This document is MCL confidential