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D.Naveen Kumar et al Int. Journal of Engineering Research and Applications www.ijera.com
ISSN : 2248-9622, Vol. 4, Issue 3( Version 1), March 2014, pp.594-597
www.ijera.com 594 | P a g e
Comparison and Digital Circuit Analysis Based on Low Power
Subthreshold Dual Mode Logic
D.Naveen Kumar, Ms.M.S.Sheeba
Department of E.C.E Sathyabama University Chennai, Tamilnadu, India
Department of E.C.E Sathyabama University Chennai, Tamilnadu, India
Abstract
In this brief, we propose new low power techniques such as Variable body bias method. This technique reduces
the leakage power by increasing the body to source voltage of the sleep transistor in the design. By reducing the
leakage power overall power of the design is reduced. The proposed logic switches between the active mode and
sleep mode. To reduce the leakage current in sleep mode, the body to source voltage of the sleep transistor
increased. To increase the voltage of Sleep transistor another transistor is connected to it. Average power and
delay are the parameters compared between proposed logic to their CMOS and Dual Mode Logic counter parts
in 180-nm process.
Keywords- Subthreshold , Dual Mode Logic, Variable Body Biasing
I. INTRODUCTION
Reduction of power consumption became a
primary focus in VLSI Design technology. Usage of
huge mobile applications on a single device for long
period also a reason to reduce power consumption of
the devices. In VLSI designs power, speed and area
are the most often used measures for determining the
performance of the VLSI designs. Recently, digital
subthreshold circuit design also became a promising
method for ultra low power applications. Reduction
in static power or dynamic power reduces the total
power of the device. The different techniques are
proposed to reduce the power consumption. But the
various leakage power of the transistor plays a major
role in power consumption. Reducing the leakage
power benefits the total power consumption than
reducing the static and dynamic powers without
reducing their performance. The proposed logic can
be operated in two modes: Sleep mode and active
mode. The most common CMOS logic family uses to
design the logic circuits along with a couple of
transistors as header and footer. These transistors are
connected as a new technique to vary the body effect
of the transistor in two different modes.
"CMOS" refers to both a particular style of
digital circuitry design and the family of processes
used to implement that circuitry on integrated circuits
(chips). CMOS circuitry dissipates less power than
logic families with resistive loads. Since this
advantage has increased and grown more important,
CMOS processes and variants have come to
dominate, thus the vast majority of modern integrated
circuit manufacturing is on CMOS processes.
Another logic which comes under subthreshold
leakage currents is the Dual Mode Logic .The basic
DML gate architecture is composed of a standard
CMOS gate and an additional transistor M1, whose
gate is connected to a global clock signal, as shown
in Fig (1.1).
The basic Dual Mode Logic (DML) gate
architecture is composed of a standard CMOS gate
and an additional transistor M1, whose gate is
connected to a global clock signal. DML allow
operation in two functional modes: static mode and
dynamic mode. To operate the gate in dynamic mode,
the Clock (Clk) is assigned, allowing two distinct
phases: precharge and evaluation. During the
precharge phase, the output is charged to high/low,
depending on the topology of the DML gate. In the
consequent evaluation phase, the output is evaluated
according to the values at the gate inputs.
Fig 1.1: DML (a) type-A topology (b) type-B
topology
The DML topologies are of two types,
marked as, Type A and Type B. Type A has an added
RESEARCH ARTICLE OPEN ACCESS
D.Naveen Kumar et al Int. Journal of Engineering Research and Applications www.ijera.com
ISSN : 2248-9622, Vol. 4, Issue 3( Version 1), March 2014, pp.594-597
www.ijera.com 595 | P a g e
p-MOS transistor that precharges the output to a
logical “1” during the precharge phase. Type B has
an added n-MOS that precharges the output to a
logical “0”. Dynamic logic gates are often
implemented using a footer, which an additional
transistor (optional). The Clk should be fixed high for
Type A and constantly low for Type B topology.
Chapter II explains the proposed method and chapter
III shows the simulation results and chapter IV gives
the conclusion.
.
II. PROPOSED METHOD
In the proposed method we introduce a new
leakage power reduction technique named as
“Variable Body Biasing”. Normally, we have leakage
power during idle (sleep) mode. By reducing the
leakage power the total power dissipation of the
technique is reduced. Thus to operate a logic design
in sleep and active modes, a logic is used to control
the design. In this proposed method we added the
header (M1) and footer (M2) transistors between the
pull-up network and pull-down network. By using
these transistors the circuit forms as a conventional
sleep transistor method.
Fig 2.1: Variable Body Bias method
To reduce the leakage current in the sleep
mode we ensured that threshold voltage of the sleep
transistor is increased, we added a PMOS (M3) and
an NMOS (M4) transistor as shown in the Fig2.1
during sleep mode PMOS (M2) is OFF so the body to
source voltage of the pull up PMOS (M1) is higher
than in the active mode.
The figure shown in the Fig 2.2 is a sleep
transistor without variable body bias technique. Here
the transistor source terminal is connected to the Vdd
and drain terminal is connected to the virtual Vdd
above the pull up network. When the sleep signal(S’)
is low the transistor is turned ON so the circuit will
work normally. But when sleep signal(S’) is high the
transistor is turned OFF but a small leakage current
flows through the transistor which is subthreshold
leakage causes power dissipation.
Fig 2.2: sleep transistor without variable body
biasing transistor.
Fig 2.3: sleep transistor with variable body biasing
The figure 2.3 shows the variable body
biasing technique which avoids the subthreshold
leakage current during idle mode. As the drain
terminal of M3 transistor is connected to body (fourth
terminal of the transistor) of the transistor M1, when
the sleep signal(S’) is low the circuit works normally
but when the sleep signal(S’) is high the M3
transistor is OFF which causes to increase the
threshold voltage of the transistor M1. Hence the M1
transistor is turned off fully no current flows through
the circuit.
For a turned off single transistor leakage
current (Isub0) can be expressed as follows
𝐼𝑠𝑢𝑏0 = 𝐴𝑒
1
𝑛𝑉 𝜃
𝑉𝑔𝑠0−𝑉 𝑡𝑕0−𝛾𝑉 𝑠𝑏0+𝜂 𝑉 𝑑𝑠0
(1
− 𝑒
−𝑉 𝑑𝑠0
𝑉 𝜃 )
Where
𝐴 = 𝜇0 𝐶0𝑥
𝑊
𝐿 𝑒𝑓𝑓
𝑉𝜃
2
𝑒1.8
n is the subthreshold swing coefficient and Vθ is the
thermal voltage. Vgs, Vth0, Vsb and Vds are the gate-to-
source voltage, the zero-bias threshold voltage, the
source-to-base voltage and the drain-to-source
voltage, respectively. γ is the body-bias effect
coefficient, and η is the Drain Induced Barrier
Lowering (DIBL) coefficient. µ0 is zero-bias
D.Naveen Kumar et al Int. Journal of Engineering Research and Applications www.ijera.com
ISSN : 2248-9622, Vol. 4, Issue 3( Version 1), March 2014, pp.594-597
www.ijera.com 596 | P a g e
mobility, Cox is the gate-oxide capacitance, W is the
width of the transistor, and Leff is the effective
channel length. From the equation we see that
leakage current (Isub0) decreases as Vsb0 increases.
As a result of Body effect, Vth also increases which
lowers the performance. During the active mode, the
performance is improved when the transistor (M3) is
ON which makes the Vth of the pull up transistor
(M1) lower again. The same operation is applicable
for the pull down transistors (M2 and M4).
III. SIMULATION RESULTS
The proposed logic is designed using three
consecutive NAND and NOR gates and compared
propagation delay and average power with the CMOS
and DML logic families. The design is carried out in
180nm Tanner EDA tools. The proposed method
works in active mode (sleep signal is 1) and shows
undetermined value during sleep mode (sleep signal
is 0).
1) Design of three consecutive NAND gates using
proposed method:
Fig 3.1: Three consecutive NAND gates using
Proposed method
Fig 3.2: Output waveforms of three consecutive
NAND gates using proposed method
2) Design of three consecutive NOR gates using
proposed method:
Fig 3.3: Three consecutive NOR gates using
Proposed method
Fig 3.4: Output waveforms of three consecutive
NOR gates using proposed method
Table 1: Comparison of Average Power and Delay
Logic Circuit Average
Power(mw)
Delay(sec)
CMOS NAND 0.67 2.25
DML Type A NAND 0.28 2.12
DML Type B NAND 0.25 2.14
Proposed NAND 0.07 1.76
Logic Circuit Average
Power(mw)
Delay(sec)
CMOS NOR 0.67 1.89
DML Type A NOR 0.23 1.59
DML Type B NOR 0.36 1.58
Proposed NOR 0.10 1.34
D.Naveen Kumar et al Int. Journal of Engineering Research and Applications www.ijera.com
ISSN : 2248-9622, Vol. 4, Issue 3( Version 1), March 2014, pp.594-597
www.ijera.com 597 | P a g e
Fig 3.5: Comparison of power (mw)
Fig 3.6: Comparison of delay
IV. CONCLUSION
The proposed design technique for
minimizing the leakage power must be developed
along with the device scaling. To reduce the standby
leakage power, this paper has presented design
technique that generates the optimal Body scaling
during standby mode. Miniaturization of CMOS
technology achieving high performance has resulted
in increase of leakage power dissipation. We have
presented an efficient methodology for reducing
leakage power. Our Variable Body Biasing approach
shows improved results in terms of static power and
dynamic power. It gives the CMOS circuit designers
another option in designing integrated circuits more
efficiently. These designs carried out in 180nm
technology Tanner EDA tools.
REFERENCES
[1] A.Wang, B.H.Calhoun, and
A.P.Chandrakasan, “Subthreshold Design
for Ultra Low-Power Systems.” Springer,
2006.
[2] A.Wang and A.Chandrakasan, “A 180mV
FFT Processor Using Subthreshold Circuit
Techniques,” in IEEE International Solid-
State Circuits Conference Digest of
Technical Papers, 2004, pp.292–529.
[3] M. Alioto, “Ultralow power VLSI circuit
design demystified and explained: A
tutorial,” IEEE Trans. Circuits Syst. I, vol.
59, no. 1, pp. 3–29, Jan. 2012.
[4] B.Zhai, S.Pant, L.Nazhandali, S.Hanson,
J.Olson, A.Reeves, M.Minuth,
R.Helfand,T.Austin, D.Sylvester, and
D.Blaauw, “Energy-Efficient Subthreshold
Processor Design,”IEEE Transactions on
Very Large Scale Integration (VLSI)
Systems,vol.17,no.8,pp.1127–1137,
aug2009.
[5] B. Zhai, S. Hanson, D. Blaauw, and D.
Sylvester, “Analysis and mitigation of
variability in subthreshold design,” in Proc.
Int. Symp. Low Power Electron. Design,
Aug. 2005, pp. 20–25.
[6] B. Zhai, L. Nazhandali, J. Olson, A. Reeves,
M. Minuth, R. Helfand, S. Pant, D. Blaauw,
and T. Austin, “A 2.60 pJ/Inst subthreshold
sensor processor for optimal energy
efficiency,” in Symp. VLSI Circuits, Dig.
Tech. Papers, 2006, pp. 154–155.
[7] C. H. I. Kim, H. Soeleman, and K. Roy,
“Ultra-Low-Power DLMS Adaptive Filter
for Hearing Aid Applications,” IEEE
Transactions on Very Large Scale
Integration (VLSI) Systems,
vol.11,no.6,pp.1058–1067,2003.
[8] D. Bol, R. Ambroise, D. Flandre, and J. D.
Legat, “Analysis and minimization of
practical energy in 45 nm subthreshold logic
circuits,” in Proc. IEEE Int. Conf. Comput.
Design, Oct. 2008, pp. 294–300.
[9] D. Markovic, C. C. Wang, L. P. Alarcon,
and J. M. Rabaey, “Ultralowpower design in
near-threshold region,” Proc. IEEE, vol. 98,
no. 2, pp. 237–252, Feb. 2010.
[10] M.Kulkarni, “A Reduced Constraint Set
Linear Program for Low-Power Design of
Digital Circuits,” Master‟s thesis, Auburn
University, Dept. of ECE, Auburn,
Alabama, Dec.2010.
[11] M.Seok, S.Hanson, Y.S.Lin, Z.Foo, D.Kim,
Y.Lee, N.Liu, D.Sylvester, and D.Blaauw,
“The Phoenix Processor: a 30pW Platform
for Sensor Applications,” in Proceedings of
IEEE Symposium on VLSI Circuits, 2008,
pp.188–189.
[12] N. Verma, J. Kwong, and A. P.
Chandrakasan, “Nanometer MOSFET
variation in minimum energy subthreshold
circuits,” IEEE Trans. Electron Devices, vol.
55, no. 1, pp. 163–174, Jan. 2008.
[13] R. Swanson and J. Meindl, “Ion-implanted
complementary MOS transistors in low-
voltage circuits,” IEEE J. Solid-State
Circuits, vol. 7, no. 2, pp. 146–153, Apr.
1972.
[14] R.Vaddi, S.Dasgupta, and R.P.Agarwal,
“Device and Circuit Design Challenges in
the Digital Subthreshold Region for Ultra
low-Power Applications,” VLSI Design,
vol.2009, pp.1–14,Jan.2009.
0
0.5
1
NAND NOR
0
2
4
CMOS DML TYPE
A
DML TYPE
B
PROPOSED
NAND NOR

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  • 1. D.Naveen Kumar et al Int. Journal of Engineering Research and Applications www.ijera.com ISSN : 2248-9622, Vol. 4, Issue 3( Version 1), March 2014, pp.594-597 www.ijera.com 594 | P a g e Comparison and Digital Circuit Analysis Based on Low Power Subthreshold Dual Mode Logic D.Naveen Kumar, Ms.M.S.Sheeba Department of E.C.E Sathyabama University Chennai, Tamilnadu, India Department of E.C.E Sathyabama University Chennai, Tamilnadu, India Abstract In this brief, we propose new low power techniques such as Variable body bias method. This technique reduces the leakage power by increasing the body to source voltage of the sleep transistor in the design. By reducing the leakage power overall power of the design is reduced. The proposed logic switches between the active mode and sleep mode. To reduce the leakage current in sleep mode, the body to source voltage of the sleep transistor increased. To increase the voltage of Sleep transistor another transistor is connected to it. Average power and delay are the parameters compared between proposed logic to their CMOS and Dual Mode Logic counter parts in 180-nm process. Keywords- Subthreshold , Dual Mode Logic, Variable Body Biasing I. INTRODUCTION Reduction of power consumption became a primary focus in VLSI Design technology. Usage of huge mobile applications on a single device for long period also a reason to reduce power consumption of the devices. In VLSI designs power, speed and area are the most often used measures for determining the performance of the VLSI designs. Recently, digital subthreshold circuit design also became a promising method for ultra low power applications. Reduction in static power or dynamic power reduces the total power of the device. The different techniques are proposed to reduce the power consumption. But the various leakage power of the transistor plays a major role in power consumption. Reducing the leakage power benefits the total power consumption than reducing the static and dynamic powers without reducing their performance. The proposed logic can be operated in two modes: Sleep mode and active mode. The most common CMOS logic family uses to design the logic circuits along with a couple of transistors as header and footer. These transistors are connected as a new technique to vary the body effect of the transistor in two different modes. "CMOS" refers to both a particular style of digital circuitry design and the family of processes used to implement that circuitry on integrated circuits (chips). CMOS circuitry dissipates less power than logic families with resistive loads. Since this advantage has increased and grown more important, CMOS processes and variants have come to dominate, thus the vast majority of modern integrated circuit manufacturing is on CMOS processes. Another logic which comes under subthreshold leakage currents is the Dual Mode Logic .The basic DML gate architecture is composed of a standard CMOS gate and an additional transistor M1, whose gate is connected to a global clock signal, as shown in Fig (1.1). The basic Dual Mode Logic (DML) gate architecture is composed of a standard CMOS gate and an additional transistor M1, whose gate is connected to a global clock signal. DML allow operation in two functional modes: static mode and dynamic mode. To operate the gate in dynamic mode, the Clock (Clk) is assigned, allowing two distinct phases: precharge and evaluation. During the precharge phase, the output is charged to high/low, depending on the topology of the DML gate. In the consequent evaluation phase, the output is evaluated according to the values at the gate inputs. Fig 1.1: DML (a) type-A topology (b) type-B topology The DML topologies are of two types, marked as, Type A and Type B. Type A has an added RESEARCH ARTICLE OPEN ACCESS
  • 2. D.Naveen Kumar et al Int. Journal of Engineering Research and Applications www.ijera.com ISSN : 2248-9622, Vol. 4, Issue 3( Version 1), March 2014, pp.594-597 www.ijera.com 595 | P a g e p-MOS transistor that precharges the output to a logical “1” during the precharge phase. Type B has an added n-MOS that precharges the output to a logical “0”. Dynamic logic gates are often implemented using a footer, which an additional transistor (optional). The Clk should be fixed high for Type A and constantly low for Type B topology. Chapter II explains the proposed method and chapter III shows the simulation results and chapter IV gives the conclusion. . II. PROPOSED METHOD In the proposed method we introduce a new leakage power reduction technique named as “Variable Body Biasing”. Normally, we have leakage power during idle (sleep) mode. By reducing the leakage power the total power dissipation of the technique is reduced. Thus to operate a logic design in sleep and active modes, a logic is used to control the design. In this proposed method we added the header (M1) and footer (M2) transistors between the pull-up network and pull-down network. By using these transistors the circuit forms as a conventional sleep transistor method. Fig 2.1: Variable Body Bias method To reduce the leakage current in the sleep mode we ensured that threshold voltage of the sleep transistor is increased, we added a PMOS (M3) and an NMOS (M4) transistor as shown in the Fig2.1 during sleep mode PMOS (M2) is OFF so the body to source voltage of the pull up PMOS (M1) is higher than in the active mode. The figure shown in the Fig 2.2 is a sleep transistor without variable body bias technique. Here the transistor source terminal is connected to the Vdd and drain terminal is connected to the virtual Vdd above the pull up network. When the sleep signal(S’) is low the transistor is turned ON so the circuit will work normally. But when sleep signal(S’) is high the transistor is turned OFF but a small leakage current flows through the transistor which is subthreshold leakage causes power dissipation. Fig 2.2: sleep transistor without variable body biasing transistor. Fig 2.3: sleep transistor with variable body biasing The figure 2.3 shows the variable body biasing technique which avoids the subthreshold leakage current during idle mode. As the drain terminal of M3 transistor is connected to body (fourth terminal of the transistor) of the transistor M1, when the sleep signal(S’) is low the circuit works normally but when the sleep signal(S’) is high the M3 transistor is OFF which causes to increase the threshold voltage of the transistor M1. Hence the M1 transistor is turned off fully no current flows through the circuit. For a turned off single transistor leakage current (Isub0) can be expressed as follows 𝐼𝑠𝑢𝑏0 = 𝐴𝑒 1 𝑛𝑉 𝜃 𝑉𝑔𝑠0−𝑉 𝑡𝑕0−𝛾𝑉 𝑠𝑏0+𝜂 𝑉 𝑑𝑠0 (1 − 𝑒 −𝑉 𝑑𝑠0 𝑉 𝜃 ) Where 𝐴 = 𝜇0 𝐶0𝑥 𝑊 𝐿 𝑒𝑓𝑓 𝑉𝜃 2 𝑒1.8 n is the subthreshold swing coefficient and Vθ is the thermal voltage. Vgs, Vth0, Vsb and Vds are the gate-to- source voltage, the zero-bias threshold voltage, the source-to-base voltage and the drain-to-source voltage, respectively. γ is the body-bias effect coefficient, and η is the Drain Induced Barrier Lowering (DIBL) coefficient. µ0 is zero-bias
  • 3. D.Naveen Kumar et al Int. Journal of Engineering Research and Applications www.ijera.com ISSN : 2248-9622, Vol. 4, Issue 3( Version 1), March 2014, pp.594-597 www.ijera.com 596 | P a g e mobility, Cox is the gate-oxide capacitance, W is the width of the transistor, and Leff is the effective channel length. From the equation we see that leakage current (Isub0) decreases as Vsb0 increases. As a result of Body effect, Vth also increases which lowers the performance. During the active mode, the performance is improved when the transistor (M3) is ON which makes the Vth of the pull up transistor (M1) lower again. The same operation is applicable for the pull down transistors (M2 and M4). III. SIMULATION RESULTS The proposed logic is designed using three consecutive NAND and NOR gates and compared propagation delay and average power with the CMOS and DML logic families. The design is carried out in 180nm Tanner EDA tools. The proposed method works in active mode (sleep signal is 1) and shows undetermined value during sleep mode (sleep signal is 0). 1) Design of three consecutive NAND gates using proposed method: Fig 3.1: Three consecutive NAND gates using Proposed method Fig 3.2: Output waveforms of three consecutive NAND gates using proposed method 2) Design of three consecutive NOR gates using proposed method: Fig 3.3: Three consecutive NOR gates using Proposed method Fig 3.4: Output waveforms of three consecutive NOR gates using proposed method Table 1: Comparison of Average Power and Delay Logic Circuit Average Power(mw) Delay(sec) CMOS NAND 0.67 2.25 DML Type A NAND 0.28 2.12 DML Type B NAND 0.25 2.14 Proposed NAND 0.07 1.76 Logic Circuit Average Power(mw) Delay(sec) CMOS NOR 0.67 1.89 DML Type A NOR 0.23 1.59 DML Type B NOR 0.36 1.58 Proposed NOR 0.10 1.34
  • 4. D.Naveen Kumar et al Int. Journal of Engineering Research and Applications www.ijera.com ISSN : 2248-9622, Vol. 4, Issue 3( Version 1), March 2014, pp.594-597 www.ijera.com 597 | P a g e Fig 3.5: Comparison of power (mw) Fig 3.6: Comparison of delay IV. CONCLUSION The proposed design technique for minimizing the leakage power must be developed along with the device scaling. To reduce the standby leakage power, this paper has presented design technique that generates the optimal Body scaling during standby mode. Miniaturization of CMOS technology achieving high performance has resulted in increase of leakage power dissipation. We have presented an efficient methodology for reducing leakage power. Our Variable Body Biasing approach shows improved results in terms of static power and dynamic power. It gives the CMOS circuit designers another option in designing integrated circuits more efficiently. These designs carried out in 180nm technology Tanner EDA tools. REFERENCES [1] A.Wang, B.H.Calhoun, and A.P.Chandrakasan, “Subthreshold Design for Ultra Low-Power Systems.” Springer, 2006. [2] A.Wang and A.Chandrakasan, “A 180mV FFT Processor Using Subthreshold Circuit Techniques,” in IEEE International Solid- State Circuits Conference Digest of Technical Papers, 2004, pp.292–529. [3] M. Alioto, “Ultralow power VLSI circuit design demystified and explained: A tutorial,” IEEE Trans. Circuits Syst. I, vol. 59, no. 1, pp. 3–29, Jan. 2012. [4] B.Zhai, S.Pant, L.Nazhandali, S.Hanson, J.Olson, A.Reeves, M.Minuth, R.Helfand,T.Austin, D.Sylvester, and D.Blaauw, “Energy-Efficient Subthreshold Processor Design,”IEEE Transactions on Very Large Scale Integration (VLSI) Systems,vol.17,no.8,pp.1127–1137, aug2009. [5] B. Zhai, S. Hanson, D. Blaauw, and D. Sylvester, “Analysis and mitigation of variability in subthreshold design,” in Proc. Int. Symp. Low Power Electron. Design, Aug. 2005, pp. 20–25. [6] B. Zhai, L. Nazhandali, J. Olson, A. Reeves, M. Minuth, R. Helfand, S. Pant, D. Blaauw, and T. Austin, “A 2.60 pJ/Inst subthreshold sensor processor for optimal energy efficiency,” in Symp. VLSI Circuits, Dig. Tech. Papers, 2006, pp. 154–155. [7] C. H. I. Kim, H. Soeleman, and K. Roy, “Ultra-Low-Power DLMS Adaptive Filter for Hearing Aid Applications,” IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol.11,no.6,pp.1058–1067,2003. [8] D. Bol, R. Ambroise, D. Flandre, and J. D. Legat, “Analysis and minimization of practical energy in 45 nm subthreshold logic circuits,” in Proc. IEEE Int. Conf. Comput. Design, Oct. 2008, pp. 294–300. [9] D. Markovic, C. C. Wang, L. P. Alarcon, and J. M. Rabaey, “Ultralowpower design in near-threshold region,” Proc. IEEE, vol. 98, no. 2, pp. 237–252, Feb. 2010. [10] M.Kulkarni, “A Reduced Constraint Set Linear Program for Low-Power Design of Digital Circuits,” Master‟s thesis, Auburn University, Dept. of ECE, Auburn, Alabama, Dec.2010. [11] M.Seok, S.Hanson, Y.S.Lin, Z.Foo, D.Kim, Y.Lee, N.Liu, D.Sylvester, and D.Blaauw, “The Phoenix Processor: a 30pW Platform for Sensor Applications,” in Proceedings of IEEE Symposium on VLSI Circuits, 2008, pp.188–189. [12] N. Verma, J. Kwong, and A. P. Chandrakasan, “Nanometer MOSFET variation in minimum energy subthreshold circuits,” IEEE Trans. Electron Devices, vol. 55, no. 1, pp. 163–174, Jan. 2008. [13] R. Swanson and J. Meindl, “Ion-implanted complementary MOS transistors in low- voltage circuits,” IEEE J. Solid-State Circuits, vol. 7, no. 2, pp. 146–153, Apr. 1972. [14] R.Vaddi, S.Dasgupta, and R.P.Agarwal, “Device and Circuit Design Challenges in the Digital Subthreshold Region for Ultra low-Power Applications,” VLSI Design, vol.2009, pp.1–14,Jan.2009. 0 0.5 1 NAND NOR 0 2 4 CMOS DML TYPE A DML TYPE B PROPOSED NAND NOR