18. Leading the Change by simplifying the Single Component Application
Enter on Modular Solution and Lead the Offer by Availability in New Projects
Q3FY18
Press-fit connection
on Snap-In capacitors
size range.
ALF*
Q3FY19
Axial Press-fit Axial
SMD
horizontal
application
concept.
FEE*
Q4FY19
Axial Press-fit
crown using
vertical
application
concept.
FEH*
FY20
Lytic Press-fit
modular concept
solution
Assembly Press-fit
adjustable Heat sink
bank solutions.
MEH*
Press-Fit, SMD and MODULAR
ROADMAP for Non-Selective Soldering and Modular
19. Rectangular Electrolytic ALR & AMR
• Size – rectangular shape provides 27% more efficiency +
good CV technology
• Use of single component increases reliability
• Low profile when horizontal
• Incredible heat sinking capability – stackable form
• Stability across temperature – superior low temp impedence
• High Altitude capability – 80,000 feet
• Launch ALR & AMR Sep 2018
21. Ceramic platform market overview
• Still tight marketing
• 100V or in eventually 80V rated voltage
• there is NO double digit µF for the 48V available
capacitance
[µF]
Volt
[V]
Dielectric
Murata 4.7 80 X7R
TDK 4.7 100 X7S
KEMET 2.2 100 X7R
TY 2.2 100 X7R
Syfer 0.22 100 X7R
Vishay 0.1 100 X7R
23. Polymer capacitor
• Nominal 54V
• Polymer derating 80%for Vr > 10V
• Required rated voltage must be > 67,5V
• Offer 75V rated
• Requirement 48V is 70V/100msec
• Test 10uF/75V
• Major concern is a short due over voltage
• Ripple current capability
26. Ripple current capability at 200kHz@54V
• Consider maximum ambient temperature
• Component does not distinguish between T_rise & T_amb
27. Wrap up
• 48V is established
• Ceramic offering 2.2uF/100V
• NEW inductor offerings for automotive
• majority is lytic
• Axial crown solution
• Pressfir technologies
• Lifetime calculation
• Working on Polymer
28. Thank You!
Axel Schmidt
Field application Engineer
Cell +49 172 89 25 284
email: AxelSchmidt@kemet.com
Hermann-Köhl-Str. 2
86899 Landsberg am Lech
Germany
www.kemet.com