The most significant cost driver for multi-chip printed circuit boards (MCPCBs) is the dielectric substrate located between the copper traces and metal heatsink. The dielectric substrate is the insulating medium between the two conducting elements. Introducing competition between suppliers of the dielectric substrate, such as between Laird, Bergquist, Dupont, Uniplus, Iteq, and Insulectro, is the most effective way to reduce costs for this important component of MCPCBs.

1. Cost Drivers For MCPCBs
Dielectric Substrate
The # 1 cost component of the MCPCB is the dielectric substrate between the copper traces and the
metal heatsink / core.
Definition
An insulating medium which occupies the region between two conductors. In this case, the copper
circuits and the metal core heat sink.

2. Cost Drivers For MCPCBs (cont.)
Introducing competition
The most effective way to reduce cost of dielectric is to introduce competition:
 Laird
 Bergquist
 Dupont
 Uniplus
 Iteq
 Insulectro
 Plus future innovators