TeoSys Laser Micromachining Capabilities - Low Res Version

TeoSys Engineering LLC
Capabilities & Products

Introducing TeoSys Engineering LLC
g y g g
Precision Microfabrication, Laser Systems
and Integrated Automation Solutions

TeoSys Engineering, LLC
2138 Priest Bridge Ct. Ste. 10
Crofton, Maryland 21114
Tel: 410 451 8058
410-451-8058
Fax: 410-451-8059
www.teosys.com Emre Teoman
Dana Lee Church

TeoSys Engineering LLC Confidential

What Drives Us – What we like to do
• Finding new and innovative ways of applying lasers and laser solutions to resolve difficult, customer driven
applications.

• Finding and developing robust solutions where others could not.

• Demonstrating lasting and persistent value of our services to our clients and customers.

• Seeking to obtain complete customer satisfaction while maintaining a nurturing, creative and fulfilling work
environment.

Currently
installed
customer base.

We are global!

TeoSys Engineering LLC Confidential Page 2

Applications – Micro Hole Drilling
Micro-Hole Drilling In Ceramic
Deep Hole Boring
3.6um hole deep bored In Glass
36 h l d b d I Gl

In Glass

High Speed Micro Hole
Drilling in Stainless Steel Laser Hole Drilling
Hole Drilling in Silicon (Micro Hole Array)
(10um and 50um) (Ø 0.001”)


Applications – Deep Hole Drilling in 1MM thick glass slide
Deep Hole Boring
36 h l d b d I Gl

Hole Drilling in 1MM Soda Lime Glass
Close up view of intra-glass nozzle restriction

In Glass

Hole Drilling in 1MM Soda Lime Glass
(30um deep bore , 9um spout entrance and
30um spout exit) Example of Sub-surface
shaping.


Applications – Deep Hole Drilling in 1MM Thick Glass Slide
Hole Drilling in
Deep Hole Boring 1MM Soda Lime
36 h l d b d I Gl Glass
Gl
31.8um deep
bore drill thru
1MM Glass Slide

There is less than
3-4 microns of
taper throughout
the entire 1MM
of glass.

High aspect
ratios are
capable via our
intra-cavity gain
control in our
proprietary
excimer laser
technology.

Applications – 532nm Polyurethane film hole drilling
50um Exit holes in
Deep Hole Boring thin polyurethane
36 h l d b d I Gl Cheaper and
better capability
than using an
excimer which has
a higher
maintenance cost.

The software seen to
the l f i an example
h left is l
of how we measure
our parts.
All objective on the 4
p
piece turret are
calibrated to a NIST
traceable slide so that
we can guarantee
actually measurement
and tolerance
dt l
specifications.


Applications – 532nm Polyurethane film hole drilling
Deep Hole Boring Line scribe -- Laser entrance side
of the polyurethane (27 micron line
p y (
36 h l d b d I Gl
width)

Indicative of performance for thin
(25-125um) polyurethane
membrane micromachining using sing
diode pumped 532nm as a low cost
and fast micromachining solution.
Typically this application always
performed using an excimer laser.


Applications – Hole Drilling
High Speed Micro Hole
Drilling in Stainless Steel
(Ø 0.001”)

Hole Drilling in Silicon
(Ø 10um and Ø 50um)

Hole Drilling in Stainless
Steel Ø 50um through
0.007” thick material
(left).

Polymer (silicon) hole
drilling (right) using
193nm. Small holes are
Ø 10um and large holes
are Ø 50um.

Applications – Generic High-Speed Large Format Part Marking (Macro – Marking)

Slate

Plastic

Galvo based
motion control
utilizing all laser
wavelengths to
perform
traditional part
marking for
identification and
serialization.

Many materials
can be marked
using many
different
wavelengths.
l h
Anodized Metal


Applications – Micro-Marking / Inscription
Excimer marking
using line widths 100 um Inscription on
High Speed Inscriptions in Polyimide Diamond
down to 5 microns.
(Text,
(Text Logos and 2-D barcode)
Small feature micro
marking on
transparent media.

1mm Square Bounding Box

75 Micron tall characters
with 26 micron line
thickness (fully adjustable
via ICVA) internal to the
excimer laser.

2-D Barcodes on Metal


Capabilities – Micro Marking in the Very Small
Excimer marking using line widths
down to 5 microns. Spot overlap up
to 0.33µm in pulse synchronized
output mode This means that we
mode.
are guaranteed a spot at every
0.33µms.

Small feature micro marking on
transparent media.

Custom TeoSys user interface aids the operator in making small
marks without the knowledge of a CAD system interface.

“No prior experience necessary.”

Applications – Transparent Media Marking

Judged ‘Best Sample’

19.9um Kerf


Applications – Glass Marking & Precision Reticule Fabrication
PROJECT:
Marking custom glass optics with ultra low
g g p
debris micro-inscriptions


Applications – Glass Marking & Precision Reticule Fabrication
Second test, most samples had excessive Third Lot, all parts considered OK!
debris


Visible Glass Marking - TeoSys Recipe and Advantages
TeoSys Process Recipe
• Final sample set was run @193nm, high rep rate for
excimers,
excimers with high demagnification low fluence and
demagnification,
multiple internal (ICGC) and external spatial apertures to
control groove shape, reflectivity and translucence.
• No additional material or substances were used to enhance
inscription q
p quality.
y
• Groove shape is extremely important in controlling the
bright and dark field performance of the optic.
• Current marking times run from 12min to 35min, without
optimization. Faster speeds are p
p p probable with additional
process development.
Advantages
• TeoSys can GUARANTEE that this process will never
crack or d
k damage th substrate (unlike some other laser and deposition processes).
the b t t ( lik th l dd iti )
• The current process produces very little debris (all submicron in nature) and minimal recast.
• May not need post inscription cleaning of any kind. IPA wipes was the only post process used.
• None of the samples produced were post process treated in any way.
• The TeoSys inscriptions will not degrade, nor loose contrast and are totally insensitive to temperature,
humidity, or vibration (unlike other reticule constructions).

Capabilities – Part Marking for Identification
High Speed Precision STENT
Marking

Single pulse
implementation of
a 2D Data Matrix
barcode

Barcode i
B d is
readable via a
video microscope
display screen
using a Data
Matrix 2D
barcode scanner
device.
Data Matrix 2-D Barcode on Stent Leg

Applications –Channel Drilling 27um Kerf Lines on
Aluminum – Cross Pattern
Laser Ablation

25um Channel in Plastic
Excimer laser
Top Hat Shape – Strict Bottom Profile channel drilling for
microfluidics (left)
as well as thin film
ablation (right).
bl ti ( i ht)

Channel drilling for
tube bending
applications where
the entire wall is
removed (bottom 27um Lines on Aluminum
right). Using Back Lighting as
illumination


Applications – Channel Drilling Parameter Definition
Key Tube Cut Design Parameters
• Cut width (kerf)
• Spacing between groups
• Spacing within a group
• Number of groups
• Rotation between each line in a group

Varying of these parameters will result in successful flexibility for
the different tube diameters and flex requirements


Applications – Channel Drilling
Custom Motion
Systems and Fixtures

Tube cutting in proprietary
pattern.

Channel drilling in steel bar stock
using 532nm, frequency doubled
Nd:YAG laser.

Channel widths of 25um through
500ums which spans the gamut
between micromachining and
traditional mechanical machining.


Applications – Channel Drilling


Other Applications Laser Micro Molding
Laser
31mm
Microwelding Mold Master - Stainless

1mm
32 AWG 100 micron gears Polyimide on diamond
Stainless Tube on diamond Master

Custom Applications Completed Assemblies
Polyimide Fiber
Optic Print Head
Medical Sensor
Ablate Window
Paralyene and
Titanium Nitride


Custom Laser Systems Development – LMS 5000
Automated Part Loading , Drilling, Measurement
• Custom designed system to drill 50um Ø and Ejection in Laser Drilling System
holes in steel mini-cups comprised of Loads and Orients up to 6 Different Part Types
mostly nickel.

•Laser is an 1064nm Nd:YAG frequency
doubled to 532nm.

•Automation consists of a feeding
A t ti i t f f di
mechanism, transfer system, pick and
place tool, rotary index plate with 8
individual stations.

• Motion and laser system is integrated via
executive control software which also
provides for a simplified man machine
interface for production operators.


LMS-5000 Laser System Development 4. Parts put
onto the index
Parts Automation System plate in the
appropriate
1. Automatic part loading via rung system which alignment
gathers parts from a bin with a single orientation
ith orientation.
•Each part type
has a different
drill location

•The part is
rotated by the
index plate to
3. Parts are picked
the drill station
up via vacuum tool
where it is laser
and placed onto the
drilled
indexing plate at the
loading station

5. After drilling, the part rotates to the
measurement station where it is
measured
2. Parts are
rotated while
facing upwards
and roll down a
track where they
are placed onto a 6. Based on the
plate which measurement, the
t th
separates each part is then ejected
part from the into a good or a
other bad bin


• Motion system stage
LMS-5000 feedback for operator (axis
(Software & Control) position)

• Automatic generation of tool • Automatic calibration (in-
cut path programs based on situ) of the optical (
) p (flow)
)
user specified parameters measurement system
including the following: which measures hole
•Part type diameter
•Hole Diameter
•Stage Speed • Automatic statistical
•Trepan Number of process control – display
Passes and recording t status
d di to t t
•Laser Energy files
• Real time display of system
status bits
•Real time display of drilling
operation
• Operational modes such as
dry run and full auto drill

• In-Situ Measurement of the machining
features (hole diameter)

•Vertical distance between calipers,
horizontal distance and point to point
distance between horizontal and vertical
intersecting lines

• Bright field dark field illumination top
field, illumination,
and bottom illumination

• Camera switching for operator feedback
of multiple automation stations

Custom Systems’ Software – LMS-5000 – Integrated Automatic Inspection
• Diameter measurement via light extinction sensor made of dual laser diodes / photo detector combination
• Measure hole diameters with 1 micron resolution from 20um Ø through 75um Ø
• Basic hole positional information within 25um of true position
• Diameter measurement calculated within 500 s a d pos t o measurement within 1 seco d
a ete easu e e t ca cu ated t 500ms and position easu e e t t second.

• Incorporation of an Ophir
Profilometer to measure beam
profile

• Creation of 3rd order regression curve for calibration of photo detector
with actual hole diameters to create the relationship between diameter
and application flow rates.
• Ability to take real time measurements from instrument
• Status and feedback during operation


Custom Systems - LMS-1500, IR / Green Micromachining System (532nm and 1,064um)

Semi-Automatic
Parts Handling

High Speed Precision Rotary


Standard Systems – LMS-2500 - Heavy Duty Excimer Laser System
Heavy Duty T300, 193nm Deep UV 300 Hz High
Speed Excimer Laser with Power Output of 14-16mJ
per pulse at 100 Hz.
2x4” 1/4um accurate precision stages (X, Y, Z, U)
Automated Gas Handling. System
Two zoom levels
Integrated UV and Visible Imaging with projected
focusing reticule
Four Axis monochromatic illumination system


Standard Systems – LMS-650 Professional Excimer Laser System

• Heavy Duty T100 Laser.
• 193nm Deep UV 100-200 Hz Excimer Laser .
p
• 10 - 12mJ per pulse.
• 2x2” 1um accurate stages (X, Y automated
Axis).
• 1” 2um accurate manual z-stage.
• Manual Gas Handling
Handling.
• Integrated UV and Visible Imaging with
projected focusing reticule.
• Two Axis monochromatic illumination system
(Top and Bottom)

Exclusive Excimer System of Harvard Robotics Laboratory


Standard Systems – LMS-500 / 550
Desktop Excimer Laser System
• Heavy Duty T20 Laser.
• 193nm D
193 Deep UV 25 H E i
Hz Excimer L
Laser .
• 7 - 10mJ per pulse at 100 Hz.
• 2x1” 3um accurate stages (automated X, Y manual Z Axis).
• 1” 5um accurate manual Z-Stage.
• Manual Gas Handling.
u G s d g.

193nm Deep UV Laser Source
Fully Integrated
Desktop Portable Version LMS-550
User Friendly


LMS-550 – Fully Automated Wire Stripping


Custom Systems – UV Excimer Laser Integration
Custom Drilling System for Medical
Custom Systems Retrofitted Into Existing Applications
Automation Lines

• Integration of custom laser solutions into existing manufacturing
systems.
• Clean room class 1000
• System Controller with Advanced Burst Mode Power Leveling and
Smart
• Flow System
• Advanced Gas Cabinet with Tank Minder Feature
• Ultra-Stable Class I Enclosure


Custom Systems

Custom High Speed CO2 Pill
Drilling System

Generic Rapid
Release
Windows
In medication

Custom precision four beam Excimer
medical catheter drilling system


Offline NIST Traceable Measurement for Job Shop
The verification of each calibration constant was performed by measuring a known feature size using the NIST traceable
calibration slide:

The features size according to the documentation that came with the slide is 50 microns. The circles outlined in RED
indicate the measurements that we made using the calibration constant. We are good with this measurement.


Offline NIST Traceable Measurement

The final phase
of the calibration
and
measurement
portion of the
purchase order
was to password
p
protect the
calibration
constant.

This cal constant
is
i used f th
d for the
measurement
for both in-situ
and offline
metrology.

The screen to
the right
illustrates the
password
p
protection.


In-Situ NIST Traceable Measurement for Upgraded Laser with Inspection
New Laser System Station and Kinematic Tube
Catheter Drilling with In-Situ Holding Fixture
Measurement Setup

Handling Table

Fixture #2

New Magnetic Kinematic
Holding Fixture with
Aerodynamic Slug Ejection
Feature


In-Situ Measurement Implementation for Catheter Drilling
The idea of this The next phase of the work that TeoSys took upon itself to perform is the transition from 100% offline
view is to provide measurement to 100% on-line or in-situ , measurement. All measurement deliverables will be
100% collected during the drilling process itself. See below:
measurement
while actually
machining the
part. If the part is
left in-situ, we can
measure th the
actual exit
dimensions non-
destructively.

To the right is a
part that had just
been drilled and
what the
measurement of
the exit hole
would be.

This picture will
be one of the
deliverables as
verification of the
ifi ti f th
drilling process.


Software Engineering – Machine Vision Application
Micro Inspector: Post-process
Micro Operator: Custom Real Time Machine Vision System Measurement and Inspection Tool

Aligns part during Full video microscope capability
process andd Provides saving and loading of
compensates
for rotation previously processed images
error Allows images to be non-destructively
Halts process if pre- overlaid with user supplied text
programmed such as titl date, etc.
h title, d t t
conditions are
not met thereby Fully integrated with motion system
reducing for complete process inspection
improperly
processed parts
Notifies operator of
ifi f
processing
status

Micro View
Simple video microscope
capability
p y


Software Engineering – Proprietary Products
MicroMMI: Real Time Machine Vision System

• Multiple image processing algorithms (source code) available via
proprietary vision system language (Based on RS 274)
RS-274)
• Image processing source automatically generated via
MicroCaliper program and may be copied into MicroMMI editor
• Fully integrated with motion system for pre/post/in-processing
inspection, measurement and quality control
• Provides full in process laser and system control
in-process
• Provides an integrated development environment for operator to
single step, edit, and debug motion control programs written in
the vision system language

Allows operator
to make
measurements of
features within
the live video
image once the
software has
been calibrated
to the optics and
motion system

The machine vision prototyping
application will automatically
generate the machine vision PRG
programming syntax for each of the
commands that the user applies via
the user interface. This PRG code
can then be copied and pasted into
any PRG program that is capable of
running with MicroMMI.

In order to aid the engineers during experimentation, TeoSys has
provided an image and machine vision prototyping application, which
can be used to apply the various machine vision algorithms without
writing a single line of PRG code. This tuning program allows the
user to experiment with all of the machine vision commands before
p
actually using them in a PRG program. Due to the many variables
involved when using any kind of image processing, this user interface
was designed to provide a nondestructive method of testing which
image processing and measurement functions should be used for a
particular video stream. All of the functions that are available in this
prototyping interface are available via PRG programming commands
to the MicrOperator application so that they may be used in real-time
in a motion control program.


The geometrical Search tool is a very good tool to use when
searching for a pattern that moves around the master image,
changes intensity, suffers from blurring or defocusing, and for
patterns that reverse their contrast. Image number 1 was used to
train a fiducial pattern. The ROI was drawn around the fiducial
so that the ROI bounding box just enclosed the fiducial fully.
After the training was complete, a new image was loaded that
was a picture of the same fiducial but its location within the
master image had changed and it was severely defocused. The
geometrical search algorithm had no problem finding the
fiducial in picture number 2.

1. Original Fiducial Image Used to Train
Fiducial Pattern
The Search tool can be used to find a trained pattern within the
master iimage (fi ld of view) and make a d i i to continue
(field f i ) d k decision i
based on the presence or absence of the fiducial or on the
fiducial’s location. All patterns must have geometrical
characteristics that can be seen such as the fiducial above. The
pattern must be unique and different from the rest of the image.
It is best to have images that respond well to the Bi-Level
threshold. If the master image (or field of view) responds well to
the Bi-Level, then most characteristics should be able to be
found. 2. Image of Defocused and Moved
Fiducial

TeoSys Laser Micromachining Capabilities - Low Res Version

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