Quick turn around PCB manufacture design rule

1. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
1. Purpose:
This document is illustrated to provide users with design guidelines as
reference during designing of a PCB
2. Scope:
The contents stated herein is evaluated and based on consideration
of our production capabilities for PCB. Design recommendations
had been stated herein, for users’ reference.
3. Responsibility:
• Existing process evaluation and improvement
• New process development (based on new/special design
requirement)
• PCB design check (based on capability recommendation)
Change
revision
A B C D E F
Contents New
Doc: KSMI-008 Rev. C
1

2. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
Contents
No Description Pg
1. Laminate type 7
2. Laminate size 7
3. Board cut 8
4. Circuits
5. NC Drill
b. Spacing between solder pads to land/ground 9
a. Minimum line width and spacing 9
c. Hole to track or land spacing 10
d. Outline to track location 10
e. V-cut Line to track and Land 11
f. Finished Track width tolerance 12
g. Finished track spacing tolerance 12
h. Annular ring 12
i. Dummy pattern 12
a. Drill stack 13
b. Drill direction 13
c. NC drill capability 13
Doc: KSMI-008 Rev. C
2

3. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
Contents
No Description Pg
5. NC Drill (Cont’d)
6. Solder mask
e. Hole to outline and tolerance 14
f. NC drill size 14
g. Hole edge to hole edge spacing 15
h. Hole to v-cut line spacing 15
i. Routing hole / slot 15
d. Hole position tolerance 13
a. Soldermask colour 16
b. Soldermask supplier 16
c. Soldermask thickness 16
d. Working panel size 17
e. Soldermask opening design 17
f. Soldermask opening 17
g. Soldermask mis-registration 18
h. Soldermask legends width, spacing and height 18
i. Soldermask bridge 19
j. LED soldermask opening and ground pad design 20
Doc: KSMI-008 Rev. C
3

4. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
Material Type Base Laminate Thickness (+/-)
1 0.2+/-0.038mm (Copper H/H,1/1oz)
2 0.25+/-0.038mm (Copper H/H,1/1oz)
3 0.36+/-0.05mm (Copper H/H,1/1oz)
4 0.41+/-0.05mm (Copper H/H,1/1oz)
5 0.51+/-0.064mm (Copper H/H,1/1oz)
6 0.61+/-0.064mm (Copper H/H,1/1oz)
7 0.71+/-0.064mm (Copper H/H,1/1oz)
8 0.8+/-0.1mm (Copper H/H,1/1oz)
9 0.9+/-0.1mm (Copper H/H,1/1oz)
10 1.0+/-0.1mm (Copper H/H,1/1oz)
11 1.2+/-0.13mm (Copper H/H,1/1oz)
12 1.5+/-0.13mm (Copper H/H,1/1oz)
1.0 Base Laminate Thickness Available
Standard Size Maximum Size Recommended Size
480mm x 580mm
(18.9” x 22.83”)
530mm x 630mm
(20.87” x 24.8”)
480mm x 580mm
(18.9” x 22.83”)
2.0 Laminate Size
Remark: If these circuits are solder pads, please add a 0.5mm spacing, as the solderpaste
may overflow to the board edge and cause short circuit.
Doc: KSMI-008 Rev. C
4

5. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
3.0 FR4 property according to IPC-4101
Item IPC-4101B/21(Normal Tg)) IPC-4101B/24(Middle Tg) IPC-4101B/26(High Tg)
Tg (DSC) >=1100C >=1500C >=1700C
Dk (@/MHZ) <=5.4 <=5.4 <=5.4
Df(@/MHZ) <=0.035 <=0.035 <=0.035
Absorb water T>=0.5mm,<=0.8% T>=0.5mm,<=0.8% T>=0.5mm,<=0.8%
Dielectric
breakdown
T>=0.5mm,40KV T>=0.5mm,40KV T>=0.5mm,40KV
Td(TGA) 300-3100c 300-3100c 300-3100c
Anti-CAF NO NO YES
CTI 175-225V 175-225V 175-225V
T2600c 10min 10min 5min
T2880c 1min 1min 0min
T3000c 0 0 0
Z-CTE(before Tg) 50-70ppm 50-70ppm 50-70ppm
Z-CTE(After Tg) 250-350ppm 250-350ppm 250-350ppm
Rohs
compliance
YES YES YES
Halogen free No,Br 18-21% No,Br 18-21% No,Br 18-21%
Doc: KSMI-008 Rev. C
5

6. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
Item Reinforcement Resin system UL/ANSI Tg
requirement
Flame retardant
Mechanism
1 CELLULOSE PAPER Phenolic XPC
(HB),XXXPC
NA N/A
2 CELLULOSE PAPER Phenolic FR1(V1),FR2
(V1)
NA Bromine/Chlorine
3 CELLULOSE PAPER Epoxy FR3(V1) NA Bromine/Chlorine
/Antimony oxide
4 Woven E-
glass,Surface
Cellulose paper,core
Epoxy/Phenolic CEM-1 1000C(min) Bromine/Antimon
y oxide
5 Woven E-
glass,Surface
Nonwoven E-galss
core
Epoxy CEM-3 NA Bromine
6 Woven E-Glass Epoxy G10 NA NA
7 Woven E-glass Difunctional
epoxy
Multifunctional
epoxy
FR4/21(V1) 1100C-1500C Bromine
8 Woven E-glass Epoxy,Hot
strength
rentention
FR5/23(V1) 1350C-1850C Bromine
9 Woven E-glass Epoxy,Multifuncti
onal Epoxy
FR4/25(V1) 1500C-2000C Bromine
10 Woven E-glass Epox
y ,Multifunctional
Epoxy
FR4/26(V1) 1700C-2200C Bromine
11 Woven E-galss Bismaleimide/Tri
azine(BT)
GPY/30(HB) 1700C-2200C Bromine
12 Woven E-glass Polymide GPY/40(HB) 2500C(min) NA
13 Woven E-glass Polymide/Epoxy GPY/42(HB) 2000C-2500C NA
4.0 Material composition instruction (Refer to IPC-4101)
Doc: KSMI-008 Rev. C 6

7. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
5.0 Board cut
AB
C D E
G
Item A
Min
(D/s)
0.38m
m
Max
(D/s)
2.8mm
Min
(ML)
0.6mm
Max
(ML)
2.8mm
ite
m
0.8mm<=T<=2.4
mm
2L<=L<=6L
0.4mm<=T<0.8mm
6L<L<=12L
FX
G
290X330mm<=FX
G<=508x610mm
290X330mm<=FXG
<=406x508mm
5.1 A&D are for delivery panel size length and width
5.2 The Minimum thickness and the maximum
thickness With finished board thickness
(Double side)
5.3 Working panel size base on thickness and layer
Doc: KSMI-008 Rev. C
7

8. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
6.0 Inner layer process capability (Unit: mm)
Doc: KSMI-008 Rev. C
8

9. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
7.0 Inner Circuits
Item HOZ ,1OZ COPPER 2OZ COPPER 3OZ COPPER 4OZ COPPER
A 4mil 7mil 10mil 12mil
B 4mil 6mil 8mil 10mil
C 4mil 7mil 10mil 12mil
D 4mil 7mil 10mil 12mil
Item HOZ ,1OZ COPPER 2OZ COPPER 3OZ COPPER 4OZ COPPER
E 8mil 8mil 8mil 10mil
G 5mil 8mil 10mil 12mil
F 6mil 8mil 10mil 10mil
7.1 Spacing design
A
B
C
D
E
F
G
7.2 Thermal pad design
Remark: Thermal Line must be keep 2 line minimum
Doc: KSMI-008 Rev. C
9

10. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
7.3 Spacing between copper to outline and V-cut line
Item A (Supplier)
A 15mil(min)
B 20mil(Normal)
A
B
A: Spacing between copper and outline
B. Spacing between copper and V-cut line
B
B formula:
300C V-cut: 0.27mm V-cut depth+10mil
450C V-cut :0.42mm V-cut depth+10mil
If A area have gold finger, need to be keep 20mil spacing from upper limited dimension
Layer HOZ ,1OZ
COPPER
2OZ COPPER 3OZ COPPER 4OZ COPPER
4L 6mil 8mil 10mil 12mil
6L 8mil 10mil 12mil 14mil
8L 8mil 10mil 12mil 14mil
10L 10mil 10mil 12mil 14mil
7.4 Annular ring manufacture
c c: Internal annual ring
Doc: KSMI-008 Rev. C
10

11. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
Supplier/L
ayer
4layer 6layer 8layer 10layer
A 7mil 8mil 9mil 10mil
7.5 Clearance
Hole
copper
a. Clearance
copper Normal line Isolated line
HOZ 0.8-1.0mil 1.5mil
1OZ 1.2-1.5mil 2.0mil
2OZ 2.4-2.8mil 3.5mil
3OZ 3.6-4.0mil 4.5mil
4OZ 5.2mil 6.0mil
7.6 Compensation
Doc: KSMI-008 Rev. C
11

12. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
8.0 NC drill capability
Doc: KSMI-008 Rev. C
12

13. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
9.0 Hole design
9.1 Blind hole capability
V figure
count-Sink
T figure
Count-
Sink
9.2 Count-Sink hole
Manual NC drill( After Routing process or punching process)
NC drill Machine (Before Routing or Punching process)
V-figure count sink hole: need to be provide Angle, depth, Count sink and hole diameter
T count sink hole: need to be provide count -sink hole size and count sink hole depth
Doc: KSMI-008 Rev. C
13

14. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
B
A
Item Dimension Tolerance
A 0.5-6.5mm +/-0.15mm
B 0.15mm-Finished
thickness
+/-0.25mm
a 600c,900c,1200c +/-50c
V-figure
9.2.1 Count-sink hole capability and tolerance
A
BB
Item Dimension Tolerance
A 0.5(min) +/-0.15mm
B 0.15mm to finished
thickness
+/-0.25mm
T-figure
a
Doc: KSMI-008 Rev. C
14

15. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
10.0 PTH+PANEL PLATING+ Pattern plating capability
Doc: KSMI-008 Rev. C
15

16. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
11.0 Outer circuit
Doc: KSMI-008 Rev. C
16

17. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
Item
Copper
2OZ 3OZ 4OZ
Line width 8mil 12mil 14mil
Line spacing 7mil 8mil 10mil
Spacing between line
to pads
7mil 8mil 10mil
Spacing between pads
to pads
7mil 8mil 10mil
11.1 Width and spacing of thick copper
11.2 Testing hole requirement
Doc: KSMI-008 Rev. C
17

18. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
11.3 Annual ring
Remark:
- Base copper: hole tolerance +/- 0.076 mm.
- HAL finishing: a) PTH hole without annual ring, easy peel off after HAL process.
Min. 4mil annual ring requirement.
b) PTH slot hole also easy peel off, suggest change NPTH.
11.4 Gold plating capability
Remark:
- Gold plating board, suggest the base copper is Hoz and plate to 1oz,
hole copper thickness to copper+ Nickel+ Gold=0.8mil(min).
- Gold plating is after solder mask process, the plating locations
must be have extension line to board edge.
Doc: KSMI-008 Rev. C
18

19. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
11.5 Patter plating and Etching
Doc: KSMI-008 Rev. C
19

20. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
11.6 E-test after etching
11.7 Impedance control
a
b
c Testing pin
instruction
Parameter be affected Impedance value:
a) Line width (Top and bottom, Under cut locations)
b) Copper thickness
c) Dielectric constant
d) Solder mask thickness
e) Line spacing (Differential impedance control)
f) Using polar software to calculate the impedance value
Doc: KSMI-008 Rev. C
20

21. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
12.0 Solder Mask
Supplier Type Color
Enernal 780 series,790 series Green/Blue/Red/Yellow/white/B
lack/Matt Green/Matt
black/Matt white
Tamura DSR2200 series Green/Blue/White/Black/Matt
Green/Matt Black
Taiyo PSM-800 series Green
Unires PSR-200 series Green
EMP EMP-110 Green
Coates XU501T-4MXLU Matt Green
Tamura halogen free solder
mask
DSR2200TT19BLHF,
DSR2200TT19GHF
Blue
Green
12.1 Type & Color
Remark: For Immersion Tin recommendation
 DSR2200( print 2 times) or resistance gold ink or PSR4000 ink.
Doc: KSMI-008 Rev. C
21

22. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
12.2 Maximum working panel size is 470mm x 610mm
12.3 Board thickness is 0.4mm ~ 2.8mm
12.4 Solder mask opening design require
A>=0.076mm
Solder pad
Solder mask opening
Circuits trace
a
a
a>=0.127mm(5mil)
12.5 Solder mask opening to circuits trace or ground copper spacing
12.6 Solder mask mis-registration capability: +/- 50um
Doc: KSMI-008 Rev. C
22

23. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
12.7 Solder mark marking print: Width, Spacing and Height
L U M I L E D S LL56.0238
A
Legends width>=0.2mm
Legends spacing A>=0.15mm
Legends Height B>=1.5mm
B
a a
A>=0.127mm
- If base copper is HOZ, A=0.1mm and Immersion tin finishing board solder mask bridge is 0.127mm
Copper ground
Solder mask opening
At ground copper,
solder mask bridge design
A>=0.127mm,
if for finishing is Immersion Tin, suggested the spacing is 0.25mm
12.8 Solder mask bridge
Doc: KSMI-008 Rev. C
23

24. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
Solder mask
CopperBase laminate
A
B C
Location Thickness (min)
A 0.4mil
B 0.2mil
C 0.4mil
12.9 Thickness
i) Print one time
a. Solder mask thickness on circuits knee:0.2mil(min)
b. Solder mask on circuits surface:0.4mil(min)
ii) Print two times
a. Solder mask thickness on circuits knee:0.4mil(min)
b. Solder mask thickness on circuits surface:0.6mil(min)
Doc: KSMI-008 Rev. C
24

25. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
12.10 Solder mask plugging hole
Doc: KSMI-008 Rev. C
25

26. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
12.11 Solder mask cover for not plugging hole
Doc: KSMI-008 Rev. C
26

27. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
13.0 Peel mask
13.1 Spacing between solder pad = > 12 mils.
13.2 Thickness
- Print 1 times = 3~8 mils
- Print 2 times = 5~15 mils
13.3 Print cover hole capability
- Nilon stencil = < 40 mils
- Aluminum stencil = < 72 mils
Remark: If hole size more than 72 mils, have to use tape to cover
13.4 Peel mask with relative surface treatment.
Number Surface treatment Peel mask
(Yes/No)
Cause and
replacement
1 HAL/HAL Lead
free
YES NA
2 OSP/Flux No Use higher temperature
tape
3 Immersion Gold YES NA
4 Gold plating YES NA
5 Immersion Tin NO Replace to higher
temperature tape
6 Immersion sliver NO Replace to higher
temperature tape
Doc: KSMI-008 Rev. C
27

28. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
14.0 Legend Print
14.1 Color = White, Black, Yellow and Red.
14.2 Printing mis-registration = +/- 0.15mm.
14.3 Maximum working panel size = 470mm x 610mm
14.4 Board thickness = 0.4mm ~ 3.2mm
14.5 Minimum width and spacing = 0.15mm
14.6 Marking print to solder mask opening.
A B C D
Solder mask opening
Copper pads
w
W=0.15mm
14.7 Marking print to outline and v-cut
A B C D
V-CUT Line
Outline with routing or punching
a
b
a. Width 0.5mm(min)
b. Width 0.25mm(min) for Routing profile
c. Width 0.3mm(min)) for Punching profile
Doc: KSMI-008 Rev. C
28

29. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
14.7 Marking print to hole
A B C D
Hole
a a>=0.15mm
A B C D 1.5mm
14.8 Marking height
AB
Copper
Legends
AB
Dielectric Legends
A B
OK
Dielectric
Not recommendedOK
Legends
14.9 Marking allocation print
Doc: KSMI-008 Rev. C
29

30. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
15.0 Carbon print
15.1 Type
Brend: Xiong Zhen PR-800
Carbon resistance: <15ohm/Sq.
15.2 Capability
Board thickness: 0.4 ~ 3.2mm
Minimum trace width: 0.25mm
Maximum board size: 406mm x 406mm
Mis-registration tolerance: +/-0.15mm
15.3 Carbon print pad design:
15.4 Carbon print pad spacing design:
Circuits pads
0.15mm(min)
Carbon pads design
A
A>=0.4mm
Carbon print to carbon print
Doc: KSMI-008 Rev. C
30

31. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
Carbon print to circuits pad
Carbon
A>=0.38mm
15.5 Carbon print pad with solder mask opening
Solder mask opening
Copper pad
0.1mm(min) (Recommendation : 0.2mm)
15.6 Carbon printing thickness
1 time: 0.5mil-1.5mil
2 times: 0.8mil-2.6mil
Doc: KSMI-008 Rev. C
31

32. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
16.0 Board finishing
16.1 Available finishing
- HAL leaded
- HAL lead free
- Immersion Gold
- Gold Plating
- Immersion silver
- Immersion Tin
- Entek = Cu-106A (OSP)
- WPF-21 (OSP)
- Shikoku F2 (OSP)
16.2 Capability
HAL finishing
Number Item capability
1 Maximum working panel size 470mmx620mm
2 Board thickness range 0.4-3.2mm
3 HAL thickness in hole 0.1mil-2mil
4 HAL thickness in surface 0.03mil-1.5mil
5 Minimum hole size with
HAL/HAL LF
0.35mm(Below will be have
solder ball)
6 HAL Composition Tin 63%,lead 37%,Melt
temperature 1830C
7 HAL Lead free compositions Tin:98.8%,Nickel:0.1-
0.8%,Copper:0.5-1.1%,Melt
temperature:2230C
Doc: KSMI-008 Rev. C
32

33. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
Number Item Capability
1 Working panel size 80x80mm to 470mmx620mm
2 Board thickness range 0.4mm-3.2mm
3 OSP thickness 0.2um-0.6um
4 OSP+ Gold finger WPF-21+Gold finger (Workable)
5
OSP finishing
Number item Capability
1 Maximum working panel size 470mmx620mm
2 Board thickness range 0.4mm-3.2mm
3 Gold thickness 1-3u’’
4 Nickel thickness 120u’’(min)
5 Not Availiable laminate NC drill board with FR1,R2,CEM-1
laminate, if have it, after immersion gold
process
6 Availiable solder mask Liquid photo imageable
Immersion gold
Doc: KSMI-008 Rev. C
33

34. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
Number Item Capability
1 Working panel maximum dimension 406x520mm(Dimension exceed,
add cut line)
2 Board thickness range 0.4mm-3.2mm
3 Gold thickness 10u’’-40u’’
4 Nickel thickness 120u’’(min)
5 Gold composition Hard Gold
6 Gold finger contact line (Removed) 2nd,Bellving ,Add it in inner)
7 HAL (Or HAL lead free)+ Gold finger Ok process
8 OSP+GOLD FINGER OK,CAN PROCESS, BUT should
be WPF+Gold finger
9 Immersion Tin+Gold finger A Reject/B OK/C OK
10 Immersion sliver+Gold finger Ok, process
11 Gold plating+ Gold finger OK,process
12 Immersion Gold+ Gold finger A Reject/B OK/C OK
Gold finger
Doc: KSMI-008 Rev. C
34

35. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
Num
ber
Item Capability
1 Working panel
size
76x127mm-
470x620mm
2 Board thickness
range
0.4mm-3.2mm
3 Sliver thickness 6-15u’’
4 Baking Before Immersion
sliver
Immersion silver
Num
ber
Item Capability
1 Working panel
size
150x100mm to
400x550mm
2 Board
thickness
range
0.4mm to
3.2mm
3 Tin thickness 30u’’-50u’’
4 Print solder
mask times
2times(DSR22
00)Immersion tin
Doc: KSMI-008 Rev. C
35

36. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
17.0 V-cut
17.1 Layout
V-cut Line
17.2 Remain thickness
Laminate Board thickness Remain thickness
FR4 Laminate 0.8mm+/-0.1mm 0.30mm
1.0mm+/-0.13mm 0.35mm
1.20mm+/-0.13mm 0.35mm
1.6mm+/-0.15mm 0.4mm
2.0mm+/-0.2mm 0.6mm
2.4mm+/-0.24mm 0.7mm
Doc: KSMI-008 Rev. C
36

37. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
Flow direction of
V-grooving
machine.
S1 S2Jump v-cut
S1:>8mm(min)
S2:>8mm(min)
S1 and S2 depth are not
achieve to normal remain
thickness
If customer do not accept
the enough depth, we can
add slot at this location (See
below )
Unit 1
Unit 2 Unit 3
V-cut line
Suggest to
Unit 1
Unit 2 Unit 3
17.3 Jump v-cut design
Doc: KSMI-008 Rev. C
37

38. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
17.4 Between board edge to v-cut line design
S: >/= 1.0mm
17.5 Design for auto-cut
7mm (min)
2mm (min)
V-cut guide hole size: Diameter 3.175mm (NPTH 3X)
V-cut guide hole to v-cut line spacing: 4mm (min)
Doc: KSMI-008 Rev. C
38

39. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
17.6 V-cut between punching line design
V-cut Line
Routing or punching slot
Not acceptable, because at Red location will be
cause Burrs
Recommended to
V-cut Line
Routing or punching slot
Minimum:0.5mm
Doc: KSMI-008 Rev. C
39

40. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
17.6 V-cut capability basic information
Number Item capability
1 Working panel dimension 80x80mm to 406mmx406mm
2 Board thickness range <=0.8mm to 3.2mm(V-cut on both
side),0.5-0.8mm(Single side V-cut)
3 Mis-registration on Top and
bottom
+/-0.1mm
4 Minimum V-cut spacing 4mm(min)
5 V-cut Angle 30+/-50c, 45+/-50c, 60+/-50c
Doc: KSMI-008 Rev. C
40

41. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
18.0 Profile
18.1 Routing
Number Item Capability
1 Working panel size 457mmx610mm
2 Routing bit size 0.7mm to 3.0mm
3 Internal radius R0.4mm to R1.6mm, Standard R1.0mm
4 NC drill to edge +/-0.127mm
5 Edging to edging +/-0.127mm
6 Routing Guide hole Minimum 2holes(NPTH) in delivery panel
7 Routing hole tolerance +/-0.127mm
8 Routing slot tolerance +/-0.127mm
9 NC drill (Hole or slot) to routing
edge spacing
15mil(min)
Board thickness:0.8mm-3.2mm
A: >4mm, b: <=12mm, C: >=26mm
Depth tolerance: L </= 56 MIL : +/-5MIL
L >56mil : +/-8mil
Leveling angle: 20-600C +/-50C
Doc: KSMI-008 Rev. C
41

42. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
18.2 Punching
Number Item Capability
1 Board thickness range 0.4mm-3.2mm
2 Maximum punching size 406x510mm
3 Minimum punching slot size 0.7mmx1.2mm
4 Punching Edge to hole in unit 1.2mm(min)
5 Minimum spacing between punching
slot to punching Edge
One board thickness
6 Punching Edge to Gold finger 35mil(min)
Punching outline tolerance
0 ~ 100mm: +/-0.1mm
101mm ~ 200mm: +/-0.2mm
200mm ~ 300mm: +/-0.25mm
Above 300mm: +/-0.3mm
Doc: KSMI-008 Rev. C
42

43. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
19.0 E-Test
19.1 Parameter
- Test voltage: 10V ~ 300V
- continuity test resistance: 5 ohm ~ 15K ohm
- Isolation resistance: 1M ohm ~ 100M ohm
- Maximum testing size: 457x 610mm
- Maximum probe points: 10224 points
- Minimum testing point size: 6 mils
- Minimum testing point pitch: 15 mils
Remark: E-test net list generate from customer Gerber file
Doc: KSMI-008 Rev. C
43

44. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
Doc: KSMI-008 Rev. C
44

45. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
Doc: KSMI-008 Rev. C
45

46. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
Doc: KSMI-008 Rev. C
46

47. Title:
Design Rule PCB
Instruction No:
KSMI-008
Rev:
C
Prepared By:
Engrg Dept / Jason LI
Date :
Apr -2014
Doc: KSMI-008 Rev. C
47