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1. ProductsProducts
Mag LayersMag Layers

2. Product OverviewProduct Overview
Multilayer Products:
Wire-wound Products:
EMI & Signal Products
Chip Bead, Common mode filter, Chip inductor
Bead Array
Telecom Products (on LTCC Tech.)
Antenna, Band pass filter, Low pass filter, BALUN,
Diplexer, Coupler, RF FEM modules
Power Inductors
VDSL Filter Modules

3. A
B
R
W
P
L
M
Effective Range of Noise Suppression
1MHz 10 MHz 100 MHz 1GHz
Low Speed Signal Line, Ringing Prevention(Audio
Signal, CMOS IC)
Medium Current Line (300mA to 1A)
High Speed Signal Line (LCD panel, Clock Signal,
RAM Bus)
Large Current Line (3A to 6A)
Bead Array (High Density Circuit)
General Signal Line (I/O Port)
Applications
GHz-Band Noise Suppression
Mag. Layers Products (1) ---
Ferrite Chip Beads

4. Mag. Layers Products (2) ---
Wire-wound Type Inductors
AL
MCD
MRT
SMI/SMC
HFC
MSCH
MSCDB
MSCDRI
MSCD
10 100 1000 10000 100000
Rated Current (mA)
ProductType

5. Products Roadmap
200620032002 20052004
EMI &
Signal
Ferrite Bead
Ferrite inductor
Bead array
HF inductor
2012 1608 1005
size reduction
With Design & Simulation Capability
Common Mode Filters
LC Filters
Power &
Signal
Dip type
SMD type without
& with shielding V core HCI
size reduction, power increase Super High Current
RF
Balun, Antenna, LP
Filter, BPF & HPF Balanced Filter
LTCC technology, Design, Simulation
Library, High Integration Density
Modules
WLAN, BT ModulesGPRS FEM
Modulization
Year

6. Multilayer Common Mode FiltersMultilayer Common Mode Filters
CMF-3216 series (70, 120, 160)
CMF-2012 series (90, 120, 160)
Co-fired CMF-2012
Co-fired CMF Array 3216

7. USB 2.0 Application IEEE 1394 Application
Common Mode Filter
Vcc
D+
D-
ESD Suppression
- Chip Varistor
Cable
Pair A
Cable
Pair B
Connector
Common Mode Filter
Common Mode Filter
CMF Application: USB2.0/ IEEE 1394CMF Application: USB2.0/ IEEE 1394
Additional app.. : LVDS, DVI, HDMI… (VGA Cards, LCD TV & Monitors)Additional app.. : LVDS, DVI, HDMI… (VGA Cards, LCD TV & Monitors)

8. Global USB Enabled Device and PC MarketGlobal USB Enabled Device and PC Market
Unit Thousand Source: In-Stat/MDR 2003
PC 分類
2004 (E) 2005 (F)
PC Total (M) 172 188
NB (M) 46 53
DT 及其他
(M)
126 135
Source: IDC 2004
1PC uses 1 USB 及 1 IEEE
1394 Controller IC ，
• Connects 4~8 USB Ports,
requires 4~8 CMF.
• LAN Port uses one CMF
• VGA Card uses 3~6
CMF
• LCD Monitor: use more
than 3 CMF
DSC, DV, DVR, MP3,
Game Players use CMF

9. Electrical Characteristics of Multi-layerElectrical Characteristics of Multi-layer
CMF- 3216 seriesCMF- 3216 series
CMF-3216-0120I-S1
CMF-3216-0070I-S1
CMF-3216-0160I-S1
CMF-3216 -series
10
100
1000
10000
1 10 100 1000
Frequency(MHz)
Impedance(Ohm)
70 Ohm 120 Ohm 160Ohm
CM Impedance
(at 100MHz)
120 ohm
70 ohm
RDC Rated current
0.8 ohm
1.1 ohm
400 mA
350 mA
Part Number Rated Voltage
160 ohm 1.3 ohm
300 mA
50 V
50 V
50 V

10. Size
minimizationType
Wire-wound
Multilayer
Single Mat’l
Multilayer
Co-fired
Cost
down
Soldering
convenience
DC
resistance
*
**
**
*
**
***
* ***
*
**
***
***
Characteristics ComparisonCharacteristics Comparison

11. High Current Molded Power Inductor
1.DC current (A) that will cause an approximate △T of 40℃
2.DC current (A) that will cause Lo to drop approximately 20%
INDUCTANCE Rdc HEAT RATING SATURATION
Lo(? H) (mΩ ) CURRENT CURRENT
@0A Max DC AMPS1
DC AMPS2
MMD-1205-R36 0.36 1.1 41 75
MMD-1205-R47 0.47 1.3 38 65
MMD-1205-R50 0.5 1.5 36 55
MMD-1205-R56 0.56 1.5 36 55
MMD-1205-R68 0.68 1.7 34 54
MMD-1204-R47 0.47 2 32 55
MMD-1204-R56 0.56 2.2 29 51
MMD-1204-R68 0.68 2.5 28 49
MMD-1004-R15 0.15 0.8 25 75
MMD-1004-R36 0.36 1.3 20 60
MMD-1004-R56 0.56 1.8 15 25
MMD-0603-R90 0.9 10 11 22
MMD-0603-1R0 1 10 11 22
PART NUMBER

12. High Current Power Inductor
Idc and Isat
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
0 10 20 30 40 50 60 70 80
DC BIAS(A)
INDUCTANCE(uH)
0
10
20
30
40
50
60
70
80
90
100
TEMP.
R50(INDUCTANCE)
R68(INDUCTANCE)
R50(TEMP.RISE)
R68(TEMP.RISE)

13. High Current Molded Power Inductor
Reliability TestReliability Test
1. Magnetic leakage test
2. High temperature resistance test for wires
3. Short circuit test for insulating-layer of
wires
4. High humidity test for molded coils
5. High temperature resistance test for
molded coils
6. Rust resistance test of molded coils
7. Vibration test
8. Current resistance test
9. Soldering test
10. Electrical resistance measurement
11. Efficiency test of molded coils (on-board
measurement)

14. 0.5 1 1.5 2 2.5
Frequency (GHz)
Graph 1
-60
-50
-40
-30
-20
-10
0
DB(|S[1,1]|)
zzz
DB(|S[2,1]|)
zzz
CIRCUIT
3D Layout
Simulation Result
Low Pass Filter

15. RF product lineup – Atheros a/b/gRF product lineup – Atheros a/b/g
S.W
BPF
BPF
BLN
2.4 & 5 GHz
2.4 & 5 GHz
On PCB
Tx:2.4 GHz
Tx:5 GHz
A5006
Diplexer
Diplexer
On PCB
On PCB
Rx:2.4 GHz
Rx:5 GHz
BPF
PA
MDR880J (Soshin) HHM1562B (TDK)LFB215G (muRata)
LPF
On PCB
DBA-7040-25GH3-A1DBA-7040-25GH3-A1
LTD-2012-2G4H3-A1LTD-2012-2G4H3-A1 LTB-2012-5G5H3-A1LTB-2012-5G5H3-A1 LTU-1608-5G5H3-A1

16. S.W
BLN
BLN
BLN
BLN
2.4 & 5 GHz
2.4 & 5 GHz
Tx:2.4 GHz
Tx:5 GHz
4330
Diplexer
Rx:2.4 GHz
Rx:5 GHz
LPF
On PCB
RF product lineup – Broadcom a/b/gRF product lineup – Broadcom a/b/g
HHM1732B1(TDK)
HHM1732B1(TDK)HHM1711D1(TDK)
HHM1711D1(TDK)
LFD212G45DP4A189
(Murata)
LFD212G45DP4A189
(Murata)
Diplexer
LTD-2012-2G4H3-A2
LTU-1608-2G4H3-A1LTU-1608-2G4H3-A1 LTU-1608-5G5H3-A1
LTD-2012-2G4H3-A2
LTU-1608-2G4H3-A1LTU-1608-2G4H3-A1
LTU-1608-5G5H3-A1
DBA-7040-25GH3-A1DBA-7040-25GH3-A1

17. RF product lineup – Conexant a/b/gRF product lineup – Conexant a/b/g
S.W
BBF
LPF
ISL36921
BLN
2.4 & 5 GHz
2.4 & 5 GHz
Tx:2.4 GHz
Tx:5 GHz
Diplexer
Diplexer
Rx:2.4 GHz
Rx:5 GHz
PA
MDR888J (Soshin)
DBF70A001(Soshin)
LTF1608L-F2R4H (Toko)
LDG0UQD3064 (NTK)
HHM1732B1(TDK)
LTD-2012-2G4H3-A1LTD-2012-2G4H3-A1 BBF-2520-2G4H3-A2
LTD-2012-2G4H3-A1LTD-2012-2G4H3-A1
LTL-1608-2G4H3-A1LTL-1608-2G4H3-A1 LTD-2012-5G5H3-A1
DBA-7040-25GH3-A1DBA-7040-25GH3-A1

18. RF product lineup – Marvell a/b/gRF product lineup – Marvell a/b/g
S.W
BPF
2.4 & 5 GHz
2.4 & 5 GHz
Rx:2.4 GHz
Rx:5 GHz
Diplexer
Diplexer
Tx:2.4 GHz
Tx:5 GHz
PA
MDR881J (Soshin)
MDR746 (Soshin)
HMD861H(Soshin)
MDR881J (Soshin)
WPSMLBLN001C(WTC)
LTD-2012-2G4H3-A3LTD-2012-2G4H3-A3 LTB-2520-2G4H3-A2
LTD-2012-2G4H3-A3LTD-2012-2G4H3-A3
LTB-2012-5G5H3-A2LTB-2012-5G5H3-A2 LTU-2012-2G4H3-A2LTU-2012-2G4H3-A2
BLN
BPF
IC
DBA-7040-25GH3-A1DBA-7040-25GH3-A1

19. I. Product Lineup for BT (CSR)I. Product Lineup for BT (CSR)
BLN
BLN
IC
2.4 GHz
Tx
Rx
S.W
LTA-XXXX-2G4H3-A1LTA-XXXX-2G4H3-A1
LTU-2012-2G4H3-
A3
BPF
MDR746F (Soshin)
MDR741F
LTB-2520-2G4H3-A4LTB-2520-2G4H3-A4
LTU-2012-2G4H2-A2LTU-2012-2G4H2-A2
HHM1517(TDK)
DEA252450BT (TDK)
LFB212G45BA1(muRata)
BBF-2520-2G4H3-A1BBF-2520-2G4H3-A1
BBF-2012-2G4H3-A1BBF-2012-2G4H3-A1

20. BasebandBaseband
ProcessorProcessor
LCD Module ApplicationLCD Module Application
Mobile CameraMobile Camera
CCD/CMOSCCD/CMOS
SensorSensor
Mobile Handheld SystemMobile Handheld System
Low Profile SMD Power Inductor LineLow Profile SMD Power Inductor Line
LED Backlight Circuit application
LDO Regulator Circuit application
P/N:MSCH3216C series
LxWxH:3.2x1.6x1.8mm;Inductance:1uH~100uH
P/N:MSCH2015C series
LxWxH:2x1.5x1.7mm;Inductance:1uH~22uH
P/N:MSD-0201 series
LxWxH:2.8x2.6x1.0mm;Inductance:2.2uH~22u
H
Charge ICCharge IC
Charge ICCharge IC

21. BTBT
BluetoothBluetooth
LCD ModuleLCD Module
Mobile Handheld SystemMobile Handheld System
GPSGPS
GPSGPS
LTCC Product LineLTCC Product Line
Audio JackAudio Jack
AudioAudio
LC Filter- LCF series
Linear Polarization
GPS Antenna
CBA-1205-1G5S2-A1
Bluetooth chip antenna
Balance Filter for CSR Solution
BBF-2012-2G4H6-A1
BBF-2520-2G4H6-A1

22. RFRF
BTBT
BluetoothBluetooth
USBUSB
RF ModuleRF Module
LCD ModulesLCD Modules
Mobile CameraMobile Camera
CCD/CMOSCCD/CMOS
SensorSensor
Mobile Handheld SystemMobile Handheld System
EMI Product LineEMI Product Line
Antenna Matching Circuit
HFI series
CMF series
MLI/MLB series
Matching Circuit-HFI series
MLI/MLB series