3D Packaging and TSV Technologies -- Market Research Database

www.memsjournal.com | mr@memsjournal.com | Copyright 2016 MEMS Journal, Inc. | All rights reserved. | Proprietary and confidential.
MARKET RESEARCH DATABASE
3D Packaging and TSV Technologies
Overview and Database Features
July 2016

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3D Packaging and TSV Technologies Database | Market Research Database| mr@memsjournal.com
Copyright 2016 MEMS Journal, Inc. | All rights reserved. | Proprietary and confidential. | www.memsjournal.com
Confidentiality and Disclaimer Notice
The content of this document is for information purposes only and is not intended to provide
tax, legal or investment advice. You should not fully rely on any material contained in this
document and should seek independent advice wherever necessary. Any decisions you make
based upon any information contained in this document are your sole responsibility. The
information does not constitute a solicitation of any order to buy or sell any securities.
For further questions, please contact us at info@memsjournal.com.

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Background
MEMS Journal has conducted the largest industry survey on emerging opportunities
and challenges for 3D packaging and TSV technologies.
This survey includes most of the players in the semiconductor ecosystem including,
but not limited to, MEMS and sensor technology companies.
During the course of this study, we’ve reached out to 3,500+ individuals and have
received more than 570 responses.
Each respondent has provided us with approximately one page of feedback on their
existing 3D packaging and TSV projects, as well as their specific current challenges.
We are now making the results of this survey available as a market research and
intelligence database.
This information will be useful for companies which are developing strategic plans
and roadmaps for their next generation products and services. The database will also
be useful for sales and business development people as a source of new leads.

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Background
This market research database provides the following benefits:
• market research and intelligence data around the topic of advanced packaging
including 3D packaging, TSV, and WLP technologies
• more than 570 pages of direct feedback from the key industry participants who have
outlined their needs and priorities as related to core product and service offerings
• new business leads for your sales and business development team; the database
includes contact information for all of the survey participants it is easy to get in touch
with them directly to discuss business and partnership opportunities.
• vital competitive and market intelligence for your strategy development and
roadmap efforts; we’ve spent 24+ months to conduct this survey and you will get all
of the results to instantly obtain an advantage in the marketplace

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Background
Each individual included in this database has addressed the following questions:
• What does your company do and how does it relate to 3D packaging and TSVs?
• What types of companies are your main customers? Which companies are your
main suppliers?
• What is your personal involvement (vs. your company or organization in general)
with 3D packaging technologies and/or processes? What about with TSV processes
and/or technologies?
• For your ongoing 3D packaging and/or TSV projects, what are the main challenges
(business and/or technical) that you are encountering? What’s causing most of your
challenges and why?
• Are you personally a buyer or a seller of 3D packaging or TSV technologies or
services? Which specific 3D packaging technologies or services do you primarily buy
or sell?

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Database features
Database includes such details as:
• First and last name
• Email address
• Phone number
• Job title
• Company/organization name
• Details about companies’ and individuals’
3D packaging and TSV project needs and requirements
Database features:
• Number of responses/contacts: 570
• Format: Excel spreadsheet
• Feedback from companies such as Apple, Intel, IBM,
Samsung, TSMC, Microsoft, Dow, Broadcom, TI
• Rate per response/contact (w/email and phone): $5.25
Enterprise license: $2,995

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Database sample screenshot #1

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Database features
• Email address
• Phone number
• Job title
Database features:

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Get ahead of the competition -- get the database!
Click here to order the
enterprise license of this
market research database.
For further questions,
please contact us at
info@memsjournal.com.

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About Us
For more information, please email us at info@memsjournal.com

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About MEMS Journal, Inc.
• MEMS Journal was founded in 2003
• 35 full-time and part-time staff, headquartered in Southfield, Michigan
• Largest MEMS publication worldwide, with 34,800+ subscribers, growing quickly
• Published over 9,800 stories, interviews, and articles and have reviewed more than 26,000
patents and patent applications
• Main focus is on MEMS and sensors technologies
• Services include:
– Strategic planning (focus and positioning, marketplace perception, competitive analysis,
roadmap development)
– Market research and intelligence (technology scouting and assessment, system and
component teardowns, patent/IP analysis)
– Event organization and management (organize 4-5 events and sponsor 20-25 events per
year)
– Marketing and advertising (brand building, lead generation)
– Content development (whitepapers, presentations, reports)

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Market intelligence services
For questions or more information, please email us at info@memsjournal.com.

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Market intelligence services
For questions or more information, please email us at info@memsjournal.com.

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Some of our other market research reports

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Some of our recent conferences and workshops

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Contact us
MEMS Journal, Inc.
2000 Town Center, Suite 1900
Southfield, Michigan 48075
info@memsjournal.com
248.792.9618 (office phone)
http://www.memsjournal.com

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Database features
• Email address
• Phone number
• Job title
Database features:

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Get ahead of the competition -- get the database!
Click here to order the
enterprise license of this
market research database.
For further questions,
please contact us at
info@memsjournal.com.

3D Packaging and TSV Technologies -- Market Research Database

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3D Packaging and TSV Technologies -- Market Research Database