Simcenter FLOEFD EV Module Thermal Electrical Analysis

Simcenter FLOEFD for EV: Electronics cooling & Thermal management focus
Package Analysis
Battery Design Charging
e-Powertrain Thermal
Management
Bioheat Analysis
ECU and Computer
Design
PCB Electrical-Thermal-
Structural Design
Heat Pipe and Heat Sink
Joule Heating
Package Creator
BCI-ROM and
Thermal Netlist
Calibration
Page 2

Simcenter FLOEFD for EV: Electromagnetics and Structural focus
Electromagnetics
low frequency (MAGNET solver and mesher)
Structural
focus on electronics cooling
Page 3

Simcenter FLOEFD for EV: Inverter thermal-electrical-emag-structural-flow modeling
Page 4
Siemens offers an integrated workflow for CAD, electromagnetics, thermal
and structural design
DC
link
design
Busbar
design
Exploded view of Tesla Model S inverter*
*Ref: J. Reimers et al, “Automotive traction inverters: current status and future trends”, IEEE
Transactions in Vehicular technologies, Feb 2019
PCB
design
HyperLynx
FLOEFD Emag
FLOEFD Electrical Element
Simcenter FLOEFD Flow, Thermal, Radiation, Emag and Structural – All in one
Simcenter FLOEFD SmartPCB Thermal
Simcenter FLOEFD SmartPCB Structural

Page 5
Simcenter FLOEFD for EV: Battery focus
The new Battery compact model calculates the heat dissipation rate based on the electrical or electrical-
chemical characteristics of the battery cell. The obtained heat dissipation rate is applied to the cell. The state of
charge, voltage, current and the temperature distribution are predicted. Two models are supported: ECM
(equivalent circuit, 2nd and 3rd order) and ECTM (electro-chemical thermal model).
The battery model extraction capability can get ECM parameters from experimental data.

FLOEFD for EV: Motor ECU thermal-electrical management
Page 6
“I am using FLOEFD whenever I have
to deal with thermal management
questions.
I also have access to other tools but
FLOEFD provides a much easier and
faster way to create my projects.
The handling of complex geometry is
very good. And especially the
combination of Heat Transfer and
Electrical calculation (Joule Heating)
is unbeatable!”
“My colleagues working with other
tool need a day of scripting to get a
flux plot, in FLOEFD I can just do it
with one click automatically.”
FloEFD Meas. Error
T1 125.00 123.00 -1.63%
T2 181.00 181.00 0.00%
T3 156.10 156.20 0.06%
T4 156.80 157.30 0.32%
T5 156.10 156.20 0.06%
T6 157.50 157.50 0.00%
T7 159.50 158.90 -0.38%
T8 172.70 172.70 0.00%
T9 159.50 158.90 -0.38%
T10 172.70 172.70 0.00%
T11 188.80 188.20 -0.32%
T12 170.90 167.70 -1.91%
T13 155.30 156.20 0.58%
T14 154.70 155.10 0.26%
T15 170.70 172.80 1.22%
T16 170.60 165.90 -2.83%

Simcenter FLOEFD for EV: 1D Elements embedded in 3D CFD for better performance
Page 7
3D CFD 1D/3D
Mesh Count 194 000 3 200 000
Simulation time 9 min 396 min
Pressure Drop 22 038 Pa 19 859 Pa
Temperature Drop 0.338 K 0.318 K
44 times faster
3D CFD 1D/3D
Mesh Count 1 050 000 38 400
Simulation time 17 min 25 s
Pressure Drop 9912 Pa 11 377 Pa
Temperature Drop 0.039 K 0.041 K
41 times faster

Simcenter FLOEFD for EV: Use of ROM in system simulation
Page 8
BCI-ROM can be exported into FMU for further
1D simulation in Simcenter Amesim, Flomaster.
BCI-ROM can be exported into VHDL for further 1D
electrothermal simulation in Siemens EDA Хpedition
AMS, PartQuest Explore (System Vision Cloud).
PartQuest Explore live design:
https://explore.partquest.com/node/465264

Design Exploration and Optimizaition
What – If
Set variation to easily calculate several designs and find the best by yourself
with the help of comparing tool.
Goal Optimization
Set range of variation for a single input variable and find the best design with
the secant method (one parameter optimization).
DoE + Response Surface
Set range of variation for number of variables, create best-covering matrix of
design points and find optimum with the Response Surface interpolation
method.
External Optimizer
Connect to external optimization software to find the best design with the
help of 3rd party external optimizer.
Embedded HEEDS
Set range of variation for number of variables, create the target and run
sequential optimization with highly efficient SHERPA solver which
automatically finds the best algorithm.
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External Optimization with HEEDS
Page 10

Simcenter FLOEFD is tightly integrated with other Siemens tools
Page 11
NX/Solid Edge/Simcenter 3D
Simcenter
FLOEFD
MEASUREMENT
Simcenter T3STER/TERALED
PCB DESIGN
Хpedition
STRUCTURAL ANALYSIS
Simcenter 3D/NX NASTRAN
PCB ANALYSIS
HyperLynx
DESIGN EXPLORATION
Simcenter HEEDS
THERMAL-ELECTRICAL
Xpedition-AMS, SVC
CFD
Simcenter STAR-CCM+
ELECTROMAGNETIC
Simcenter MAGNET
Teamcenter
1D SYSTEM SIMULATION
Simcenter Flomaster/Simcenter Amesim

The new Simcenter FLOEFD EV module comprises various capabilities crucial for comprehensive multiphysics
(thermal-electrical-electromagnetics-structural) analysis of e-Powertrain and its components such as battery,
inverters, busbars, DC Links, Power modules and their components such as IGBTs, MOSFETs, and ECUs.
The capabilities include:
• Joule heating (DC)
• Electromagnetics (low frequency) and AC
• ECTM and ECM battery model
• Electrical Element
• SmartPCB electro-thermal-structural PCB model
• Structural (linear static and model frequency)
• Two resistor and Network assembly
• PCB and Heat pipe compact models
• Membrane for moisture and humidity analysis
Simcenter FLOEFD EV module
The price is 20% less the total price off all modules included, plus SmartPCB.
Page 12

FLOEFD modules
EDA Bridge
AutoCalibration
BCI-ROM+Package Creator
Electronics Cooling Ext. Design Exploration
HVAC
Power Electrification
Battery, Electrical Element, Membrane, DC
2R, DC, PCB, Heat Pipe
EDA Import, SmartPCB, Package Creator, NA
BCI-ROM, Package Creator
LED, Lighting
LED, Monte Carlo, Sorption, Water Film
Embedded HEEDs
Comfort Parameters, Tracers, DO
Advanced
Hypersonic, Combustion, Water Film, DO,
Sorption, On-Orbit radiation
Structural EMAG
EV
EC
Power El.
Structural
EMAG
+
SmartPCB
ECC
EDA Bridge
EC
AutoCalibration
BCI-ROM & PC
+
Electrical Element
Page 13

FLOEFD modules: EV
EDA Bridge
AutoCalibration
BCI-ROM+Package Creator
Electronics Cooling Ext. Design Exploration
HVAC
Power Electrification
Battery, Electrical Element, Membrane, DC
2R, DC, PCB, Heat Pipe
EDA Import, SmartPCB, Package Creator, NA
BCI-ROM, Package Creator
LED, Lighting
LED, Monte Carlo, Sorption, Water Film
Embedded HEEDs
Comfort Parameters, Tracers, DO
Advanced
Hypersonic, Combustion, Water Film, DO,
Sorption, On-Orbit radiation
Structural EMAG
Electrical Vehicle
EV
EC
Power El.
Structural
EMAG
+
SmartPCB
ECC
EDA Bridge
EC
AutoCalibration
BCI-ROM & PC
+
Electrical Element
Page 14

The new Simcenter FLOEFD EV module comprises various capabilities crucial for comprehensive multiphysics
(thermal-electrical-electromagnetics-structural) analysis of e-Powertrain and its components such as battery,
inverters, busbars, DC Links, Power Modules and their components such as IGBTs, MOSFETs, and ECUs.
The capabilities include:
• Joule heating (DC)
• Electromagnetics (low frequency) and AC
• ECTM and ECM battery model
• Electrical Element
• SmartPCB electro-thermal-structural PCB model
• Structural (linear static and model frequency)
• Two resistor and Network assembly
• PCB and Heat pipe compact models
• Membrane for moisture and humidity analysis
• Huge library of solid materials, TIMs, IC packages,
and fans.
Simcenter FLOEFD EV module (MG287203FL)
Page 15

Electrical Simulation
Joule Heating (DC)
Electromagnetics (low frequency) and AC
Battery ECM and ECTM
Electrical Element

AC/DC and Electromagnetics
Page 17

Joule Heating (DC)
• Steady-state direct electric current in electro-conductive solids.
• Joule heating effect is included in heat transfer calculations.
• The electrical resistivity may be isotropic, anisotropic or temperature dependent.
Page 18

Electromagnetics (low frequency) and AC – Overview
Electromagnetic analysis capabilities
• AC/DC
• Time-Harmonic solver
• Transient solver (EM simulation time is considered to be
much smaller than CFD characteristic time)
• Surface Impedance (for effective Skin effect analysis)
• Permanent Magnets
• Iron Loss
• Demagnetization
• Linear and non-linear electromagnetic material properties
• Visualization of J, B, Ohmic and Iron Losses
Page 19

Battery model
Page 20

Battery models
The battery compact model calculates the heat dissipation rate based on the electrical or electrical-chemical
characteristics of the battery cell. The obtained heat dissipation rate is applied to the cell. The state of charge,
voltage, current and the temperature distribution are predicted. Two models are supported: ECM (equivalent
circuit, 2nd and 3rd order) and ECTM (electro-chemical thermal model).
Page 21

Battery model extraction
ECM Extraction Simulation
The battery model extraction capability can obtain ECM parameters from experimental data.
Experimental data
Obtaining ECM model parameters
from the experimental data
Page 22

Battery model extraction – Why?
With the variety of battery cells today it can be challenging to find parameters describing your particular cell as a
compact model. However, conducting a simple experiment can be possible.
Extraction of a battery compact model from measurement data solves the challenge of getting the correct
compact definition of a battery cell thus providing high accuracy of battery cell electro-thermal simulation.
Page 23

Electrical Element
Page 24

Electrical Element – Overview
A thermo-electrical compact model allows the addition of a component into a DC electro-thermal calculation
by the given component’s electrical resistance. The corresponding Joule heat is calculated and applied to
the body as a heat source, so you don’t need to have a detailed model of a component to take it into
account in the electro-thermal DC calculation.
ELECTRICAL
ELEMENT
Relay components are replaced with Electrical Element
compact model providing the same DC results of the board.
Page 25

Electrical Element: Why?
In a DC simulation, the circuit often can contain elements whose internal detailed structure is not known or is
too complex for direct modeling of the electrical circuit. However, the total electrical resistance of such
elements is known. In such a case the use of an Electrical Element allows you to close the circuit with the
correct electrical resistance and take into account the Joule heat dissipated.
Detailed relay is replaced by compact model.
Page 26

Electrical Element: Why?
The conductors require a good mesh to ensure that the correct cross-sectional area is captured and
therefore that the Joule heating simulation is accurate. The Electrical Element compact model allows you to
reduce mesh requirements for conductors while maintaining electrical and thermal accuracy.
Direct simulation Electrical Element Compact model simulation
Electrical element (right) defined for wires requires less mesh for
wire resolution while keeping the same accurate electrical results
Page 27

Electrical Element: How?
+

L
A
An Electrical Element condition can be of several types:
• A Resistor element uses the total electrical resistance specified between 2
contacts and dissipates the calculated joule heat uniformly inside the
bodies selected to represent the element.
• A Wire element is similar to a resistor with automatic calculation of the
electrical resistance based on a wire’s conductor material, length and cross
sectional area, and optionally you can specify the thermal resistance of the
wire’s insulator.
Q
+ 
R
Page 28

Electrical Element: How?
In addition, you can define an electrical Junction.
• A Junction element virtually (no connector body is used) connects two faces and closes the circuit with
the specified electrical resistance. The dissipated heat is not applied to any body but can be taken into
account as a Joule heat feature goal and used for definition of a more complex electrical device.
For example, you can use the Joule heat as a power for the two-resistor model representing a device
whose Junction temperature impacts the resistance of the Junction element.
R = f(T) Q
+ 
R
I-V Curves. Use Parameters to set R as f(T) Electrical Element (EE)
for electrical circuit
Q = f(R)
Joule heat from EE Two-resistor for thermal
definition of the device
Tj
Junction T
Page 29

Electrical Element – Summary
• Electrical Element is a thermo-electrical compact model which allows the
addition of a component into a DC electro-thermal calculation by the given
component’s electrical resistance.
• Electrical Element allows you to close the circuit with the correct electrical
resistance and take into account the Joule heat dissipated.
• You can use Electrical Element to minimize computational mesh
requirements for electrical conductors while maintaining the accuracy of the
electrical simulation.
• There are three types of Electrical Element: Resistor (user-defined
resistance with lumped model for joule heat dissipation), Wire (same as
Resistor but the electrical resistance is calculated from the wire
characteristics) and Junction (closes electrical circuit with specified
resistance).
Page 30

SmartPCB

SmartPCB – Fast and accurate thermal-electrical-structural PCB model
SmartPCB is a unique approach to simulate multiphysics phenomena of a printed circuit board taking into
account all nets with the maximum level of detail. Simulation model is a huge thermal network generated using
EDA data without the necessity of converting EDA into a CAD model explicitly, so the resulting model is simple
but lossless. SmartPCB provides the high accuracy of a fully detailed (explicit) model with a substantially
reduced calculation time. You can perform thermal, thermal-electrical and structural simulations with SmartPCB.
Thermal network
Explicit SmartPCB
N. of cells 8 300 000 98 000
Time to solve 17 H 1 H
Maximum XY resolution = size
of 1 pixel, order of 10 microns
Page 32

SmartPCB – Fine model
With a Fine resolution setting, the subscale mesh is refined until a smallest element (the minimum size is one
pixel) of the same material can be assigned with a network assembly node of exact (not averaged)
material. Unlike the “Averaged” resolution, the “Fine” resolution does not use any averaging of material
properties, instead it refines the Network assembly to resolve any complexity of the geometry precisely with
huge number of nodes.
Fine
Model
Page 33

SmartPCB – Averaged model
An Averaged model is built from Network Assembly nodes created for each tile - a rectangular cell element
of the board’s uniform subscale mesh (this mesh is used to create the Network assembly). In that case the
node has effective conductivity and capacity material properties calculated based on the materials' coverage.
Averaged = 30 tiles Averaged = 100 tiles
Model
RTH
RTH
RTH
RTH
Page 34

Joule Heating in PCB: Simcenter FLOEFD-HyperLynx SI PI Co-simulation
The SmartPCB model can simulate joule heating via Simcenter FLOEFD-HyperLynx™ (v2.8.1 and newer) co-
simulation. Simcenter FLOEFD can take a power map from a HyperLynx DC Drop Simulation and perform a
thermal analysis, then it can return a temperature map to HyperLynx to update the electrical simulation and
update the power map for Simcenter FLOEFD. Alternatively, you can just import a power map exported from a
HyperLynx DC Drop Simulation into Simcenter FLOEFD for a one-way data exchange.
Power Map
Temperature Map
Page 35

PCB Structural: SmartPCB FEM
A special SmartPCB FEM model allows for accurate and time effective stress analysis of a PCB taking all the
details of the PCB’s internal structure from an original EDA file (traces and vias are resolved without any
simplification) into account without creating the explicit geometry in CAD.
CFD with thermal Smart PCB
(60 200 cells, 5 280 592 nodes)
FEM without Smart PCB
(28 700 elements)
FEM Smart PCB only
(4 340 000 elements)
Mesher time 5 s 50 s 6 min
Solver time, s 50 min 1.5 min 60 min

PCB Structural: SmartPCB Homogenization
Orthotropic homogenization: stretching and bending loads are applied to each large scale element, then a
static analysis is conducted to determine property values.
Elements Mesh generation and solving time Memory peak
Explicit 4.3 M 30 min 170 Gb
Homogenized 190 K 6 min 18 Gb
Page 37

SmartPCB Homogenization
Homogenization allows for high accuracy with less memory requirement.
Elements Mesh generation and solving time Memory peak
Explicit 1.25 M 10 min 30 s 38.5 Gb
Homogenized 100 150 K 5 min 20 s 7.7 Gb
Homogenized 200 350 K 11 min 22 s 22.2 Gb
Page 38

Structural

Structural – Overview
Structural analysis capabilities
• Fully automated hexahedral dominant mesh generator
• A special PCB model based on EDA data
• Linear solver
• Modal frequency analysis
• Isotropic and orthotropic elastic material properties
• Transferred pressure and temperature fields from fluid
dynamic analysis with conjugate heat transfer as pressure
and temperature loads
• Multiphysics task
• Linear buckling
• Export project to SC3D (FEM geometry and conditions)
Page 40

Fully automated hexahedral dominant mesh: Examples
Page 41

Page 42

Page 43

Iterative Algebraic Solver
An iterative algebraic solver can be activated to solve memory intensive structural problems, for example very
complex PCBs, to minimize memory requirements for a structural simulation. The iterative solver can take
longer to solve than the default “Direct” solver so the iterative solver is recommended to be used only if the
available memory is insufficient for the simulation task.
Mesh generation time Calculating time Memory peak
Direct 5 min 22 min 170 Gb
Iterative 5 min 18 min 90 Gb
Mesh generation time Calculating time Memory peak
Direct 13 min 4 min 35 Gb
Iterative 13 min 7 min 20 Gb
Page 44

You can export Simcenter FLOEFD structural mesh and conditions as well as steady-state and transient results
into FLD format for performing advanced thermo-structural analyses in Simcenter 3D such as non-linear visco-
plastic creep analysis.
Export to SC3D Pre-Post
Export structural mesh and conditions to SC3D
Export to Field File
For easy FLOEFD-Simcentr3D interface
.fld
Interface to Simcenter 3D / NX Nastran
Page 45

Thermal–Mechanical workflow for a Ball Grid Array
Simcenter FLOEFD FEM mesh creation
Export results to Simcenter 3D
Export mesh to Simcenter 3D
Simcenter FLOEFD Thermal Simulation
Mesh settings - 2 min
Mesh generation - 5 min
Analyze in Simcenter 3D
Page 46

Structural: statistics
The FE solver is much faster than the FE mesher. When you need to analyze different load conditions you can
significantly save time by reusing the existing mesh and cloning project with results.
Coarse Medium Fine
N of elements 112 615 287 845 645 792
Mesher time, s 154 248 556
Solver time, s 24 44 128
Coarse Medium Fine
N of elements 343698 500898 1030429
Mesher time, s 458 776 1658
Solver time, s 20 44 135
Page 47

Structural: capabilities and limitations
Supported
• Linear solver only (displacements assumed to be
small and the dependency of the properties on
temperature is not strong)
• Stationary only
• Contacts are made automatically based on
topological coincidence
• Glue contact
• Sliding contact without friction
• Modal frequency analysis
• Linear buckling
Not supported
• Non-linear phenomena
• Transient application
• Other types of contacts (sliding with friction, rough
contact, non-penetrating contact)
• Contact based on tolerance value
• Preloaded condition
Page 48

Structural – Overview
• Automatic Hex-dominant mesh: Accurate simulation of problems in which bending
deformations dominate on rather coarse meshes due to minimizing the number of
tetrahedral elements.
• Auto Glue contact: Auto ‘glue contact’ mesh technology minimizes the calculation
time of projects with a large number of ‘glued’ surfaces and does not require
specifying the contact surfaces manually, which significantly reduces the time
needed to prepare for a calculation of a complex geometry.
• All-in-one: Direct integration of the structural analysis module and the CFD module
allows you to carry out complicated simulations for a structural analysis by using the
results of a CFD analysis calculation automatically, which does not require additional
conversion of CFD results to external finite element analysis (FEA) software.
• SmartPCB FEM: A unique technology of structural analysis for PCBs based on the
Smart PCB technology is implemented, that allows you to perform static and thermal
analyses on multilayer boards, taking into account the traces and via layouts without
the need to have them explicitly added as solid geometry in CAD.
J (RMS) Ohmic Loss
Temperature Displacement
Page 49

Compact models
Two Resistor & Network Assembly
PCB and Heat Pipe
Membrane

Two resistor and Network Assembly compact models
An IC Package can be modeled in Simcenter FLOEFD in a few different ways.
Simplified Two-resistor Model Explicit
Network Assembly
Two-resistor compact model is de-facto standard in representing components for thermal analysis and it
can be automatically created from EDA file using the EDA Bridge module (not included in EV module).
EV module contains Two-resistor and Network Assembly compact models.
Page 51

Simple PCB compact model
This feature allows you to obtain the bi-axial thermal conductivity values, with the normal (through plane) and
in-plane thermal conductivities automatically derived from the PCB structure and the properties of the
specified conductor and dielectric materials.
Page 52

Heat Pipe compact model
Compact representation for a heat pipe requiring the user to specify the overall effective thermal resistance of
the heat pipe, based on its performance for the system being designed, along with selection of a part and two
faces to define the heat flux direction.
The performance of a heat pipe depends on many factors, such as inclination, orientation, length, etc. The user
can simulate different conditions by specifying different Effective Thermal Resistances for the part.
Page 53

Membrane for moisture and humidity analysis
0.00
10.00
20.00
30.00
40.00
50.00
60.00
70.00
80.00
0 10000 20000 30000 40000 50000
Experiment
FloEFD
Membrane model: a water vapor transmission driven by concentration.
Page 54

Contact
Alexey Kharitonovich
Product manager Simcenter FLOEFD
Shabolovka 10
Moscow
Russia
Phone +7 495 510 66 33
Mobile +7 965 409 41 91
E-mail alexey.kharitonovich@siemens.com
Page 55

Thank You!

Simcenter FLOEFD EV Module Thermal Electrical Analysis

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