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VISVESVARAYA TECHNOLOGICAL UNIVERSITY, BELAGAVI, KARNATAKA, INDIA
VLSI Lab,
Dept. of ECE
NMIT , Bengaluru -560064
Submitted By
Rahul K C 1NT21EC106
VLSI Design
• What is VLSI?
– “Very Large Scale Integration”
– Defines integration level
– 1980s hold-over from outdated taxonomy for integration levels
• Obviously influenced from frequency bands, i.e. HF, VHF, UHF
– Sources disagree on what is measured (gates or transistors?)
• SSI – Small-Scale Integration (0-102)
• MSI – Medium-Scale Integration (102-103)
• LSI – Large-Scale Integration (103-105)
• VLSI – Very Large-Scale Integration (105-107)
• ULSI – Ultra Large-Scale Integration (>=107)
Obligatory historical Moore’s law plot
Integration level of Trends
Integrated Circuits/MEMs
• Today, VLSI refers to systems impl. w/integrated circuits
– Integrated circuit refers mostly to general manufacturing technique
• micro/nano-scale devices on a semiconductor (crystalline) substrate
• Formed using chemical/lithography processing
• What kind of devices / structures?
– transistors (bipolar, MOSFET)
– wires (interconnects and passive devices)
– diodes (junction, LEDs, VCSELs, MSM, photoconductor, PiN)
– MEMs (integration of piezoelectrics and mechanics based on static electrical fields:
accelerometers, gyroscopes, pressure sensors, micro-mirrors)
• For CMOS digital design, we only use MOSFET transistors (used as switches) and
wires
Integrated circuits consist of:
A small square or rectangular “die”, < 1mm thick
Small die: 1.5 mm x 1.5 mm => 2.25 mm2
Large die: 15 mm x 15 mm => 225 mm2
Larger die sizes mean:
More logic, memory
Less volume
Less yield
Dies are made from silicon (substrate)
Substrate provides mechanical support and electrical common point
Chips
VLSI Design
Draw polygons that represent layers deposited-on or infused-into the substrate
More of an art than science
One 2-input NAND gate with 4 transistors
Typical microprocessor contains 50 – 200 million transistors (10-50 million gates)
Scale:
approximately
10 um x 10
um
• Manual layout design is obviously not practical
• Design complexity:
– Manually drawing layout for a billion transistors would take too long
– Even if we could…
• How to verify (test) designs for functionality, speed, power, etc.?
– Complexity scales faster than actual design
• How to reuse designs?
• How to create human-readable designs?
• How to speed-up design process?
• These problems form a great deal of work
– Electronic Design Automation (EDA)
– a.k.a. CAD
• Advancing EDA technology, fabrication technology, designs and
microarchitectures, and IP form bulk of work (and money) in the industry
EDA Tools
• Conclusion:
– This course is about using design tools to manage design complexity of VLSI systems
– Only way to learn tools: practice and work with tools individually
– Must teach IC fundamentals, but prevent course from becoming semiconductor theory, analog
electronics, circuits, or digital logic course
• Target large-scale integration and EDA
• Reach good balance between fundamental IC theory and automated large-scale design
methodology
• 80-90% of course time will be spent in lab
– Tutorials will provide basic knowledge
– Must learn the tools on your own (assisted by instructor)
Course Overview
• This course is called “Fundamentals of VLSI Chip Design”
• Focus on large-scale system design (CAD tools)
• CAD tools manage design and verification complexity
• What we have…
– Latest, most advanced CAD tools in the EDA industry
– Three primary players
• Synopsys, #258 ($1.2 billion revenue)
• Cadence Design Systems, #259 ($1.1 billion revenue)
• Mentor Graphics, ?
• Comparison: Microsoft #95 ($36.8 billion), Intel #102 ($34.2 billion)
– Fabrication award for 500 nm CMOS fabrication process
• AMI C5N process with academic design kit (NCSU CDK)
• 1.5 mm x 1.5 mm die size, multiple dies, packaging
EDA Tools
• Big companies, lots of money, 40 years of integrated circuit design experience, conferences, journals,
powerful PCs… what’s the problem?
• IC CAD tools are difficult to use
– Written by electrical engineers (not professional programmers)
– Incredibly buggy
– Not documented
– Rely on ancient, outdated file formats for interoperability
– Still mostly rely on command-line interfaces
– Utilize outdated, primitive, buggy APIs for GUIs
– Inherently required to solve hard problems
• Place components, route wires
• Must utilize advanced heuristics that are only as good as fabrication process technology
information and user input (garbage-in, garbage-out)
EDA Tools
• Cadence tools
– “IC-Tools” => IC5141 package (Linux)
– Collection of tools managed by Design Framework II (dfII)
• Virtuoso schematic/layout editor
• Analog Environment
• Spectre simulator
• Diva DRC, EXT, LVS
• Other Cadence tools
– SignalStorm => TSI42 package (Linux)
– Abstract Generator => DSMSE54 (Solaris)
– First Encounter => SOC42 package (Linux)
• Synopsys
– Design Compiler (Linux)
• Mentor
– HDL Designer (Linux)
What EDA Tools Can Do
• Manual layout vs. EDA is like:
– Manual transmission vs. automatic transmission
– HTML programming vs. Frontpage
– Assembly code programming vs. compiled high-level language
• Manual layout for small, optimized designs will always be superior
• EDA techniques for larger-scale designs will always be superior
(verification, reusability, NRE, etc.)
• Goal: do careful, manual design of smaller components (cells) and use
EDA to combine them for large-scale design
What EDA Tools Can Do
 “My” Design Flow
Digital cell library
design
Cadence IC-Tools
Circuit Sim
Cadence IC-Tools
Characterization
Cadence SignalStorm
Abstract Generation
Cadence AbGen
Standard Cell Library
Behavioral VHDL
Design
Mentor HDL Designer
char. info
process
info, cell
abstracts
Synthesis
Synopsys Design
Analyzer
VHDL
Behavioral Simulation
Mentor ModelSim
Place-and-Route
Cadence First
Encounter
Cell Timing Simulation
Mentor ModelSim
Verilog
Interconnect Timing
Simulation
Mentor ModelSim
Course will be divided into units
Introduction: IC design and fabrication
fundamentals
Lectures
Assignments from textbook
CMOS circuit design, layout, and simulation
Tutorial: Cadence IC-Tools
Design projects
Development of standard cell library
Cell library development
Tutorial: Cadence Signal Storm and
Abstract Generator
Report on cell library
VHDL Design
Lectures on VHDL
Tutorial: Mentor HDL Designer
Design project
Logic Synthesis
Tutorial: Synopsys Design Analyzer
Place-and-route
Tutorial: Cadence First Encounter
Course project
Teams
Design
Fabrication?
Course Organization
THANK YOU

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vlsi

  • 1. VISVESVARAYA TECHNOLOGICAL UNIVERSITY, BELAGAVI, KARNATAKA, INDIA VLSI Lab, Dept. of ECE NMIT , Bengaluru -560064 Submitted By Rahul K C 1NT21EC106
  • 2. VLSI Design • What is VLSI? – “Very Large Scale Integration” – Defines integration level – 1980s hold-over from outdated taxonomy for integration levels • Obviously influenced from frequency bands, i.e. HF, VHF, UHF – Sources disagree on what is measured (gates or transistors?) • SSI – Small-Scale Integration (0-102) • MSI – Medium-Scale Integration (102-103) • LSI – Large-Scale Integration (103-105) • VLSI – Very Large-Scale Integration (105-107) • ULSI – Ultra Large-Scale Integration (>=107)
  • 3. Obligatory historical Moore’s law plot Integration level of Trends
  • 4. Integrated Circuits/MEMs • Today, VLSI refers to systems impl. w/integrated circuits – Integrated circuit refers mostly to general manufacturing technique • micro/nano-scale devices on a semiconductor (crystalline) substrate • Formed using chemical/lithography processing • What kind of devices / structures? – transistors (bipolar, MOSFET) – wires (interconnects and passive devices) – diodes (junction, LEDs, VCSELs, MSM, photoconductor, PiN) – MEMs (integration of piezoelectrics and mechanics based on static electrical fields: accelerometers, gyroscopes, pressure sensors, micro-mirrors) • For CMOS digital design, we only use MOSFET transistors (used as switches) and wires
  • 5. Integrated circuits consist of: A small square or rectangular “die”, < 1mm thick Small die: 1.5 mm x 1.5 mm => 2.25 mm2 Large die: 15 mm x 15 mm => 225 mm2 Larger die sizes mean: More logic, memory Less volume Less yield Dies are made from silicon (substrate) Substrate provides mechanical support and electrical common point Chips
  • 6. VLSI Design Draw polygons that represent layers deposited-on or infused-into the substrate More of an art than science One 2-input NAND gate with 4 transistors Typical microprocessor contains 50 – 200 million transistors (10-50 million gates) Scale: approximately 10 um x 10 um
  • 7. • Manual layout design is obviously not practical • Design complexity: – Manually drawing layout for a billion transistors would take too long – Even if we could… • How to verify (test) designs for functionality, speed, power, etc.? – Complexity scales faster than actual design • How to reuse designs? • How to create human-readable designs? • How to speed-up design process? • These problems form a great deal of work – Electronic Design Automation (EDA) – a.k.a. CAD • Advancing EDA technology, fabrication technology, designs and microarchitectures, and IP form bulk of work (and money) in the industry
  • 8. EDA Tools • Conclusion: – This course is about using design tools to manage design complexity of VLSI systems – Only way to learn tools: practice and work with tools individually – Must teach IC fundamentals, but prevent course from becoming semiconductor theory, analog electronics, circuits, or digital logic course • Target large-scale integration and EDA • Reach good balance between fundamental IC theory and automated large-scale design methodology • 80-90% of course time will be spent in lab – Tutorials will provide basic knowledge – Must learn the tools on your own (assisted by instructor)
  • 9. Course Overview • This course is called “Fundamentals of VLSI Chip Design” • Focus on large-scale system design (CAD tools) • CAD tools manage design and verification complexity • What we have… – Latest, most advanced CAD tools in the EDA industry – Three primary players • Synopsys, #258 ($1.2 billion revenue) • Cadence Design Systems, #259 ($1.1 billion revenue) • Mentor Graphics, ? • Comparison: Microsoft #95 ($36.8 billion), Intel #102 ($34.2 billion) – Fabrication award for 500 nm CMOS fabrication process • AMI C5N process with academic design kit (NCSU CDK) • 1.5 mm x 1.5 mm die size, multiple dies, packaging
  • 10. EDA Tools • Big companies, lots of money, 40 years of integrated circuit design experience, conferences, journals, powerful PCs… what’s the problem? • IC CAD tools are difficult to use – Written by electrical engineers (not professional programmers) – Incredibly buggy – Not documented – Rely on ancient, outdated file formats for interoperability – Still mostly rely on command-line interfaces – Utilize outdated, primitive, buggy APIs for GUIs – Inherently required to solve hard problems • Place components, route wires • Must utilize advanced heuristics that are only as good as fabrication process technology information and user input (garbage-in, garbage-out)
  • 11. EDA Tools • Cadence tools – “IC-Tools” => IC5141 package (Linux) – Collection of tools managed by Design Framework II (dfII) • Virtuoso schematic/layout editor • Analog Environment • Spectre simulator • Diva DRC, EXT, LVS • Other Cadence tools – SignalStorm => TSI42 package (Linux) – Abstract Generator => DSMSE54 (Solaris) – First Encounter => SOC42 package (Linux) • Synopsys – Design Compiler (Linux) • Mentor – HDL Designer (Linux)
  • 12. What EDA Tools Can Do • Manual layout vs. EDA is like: – Manual transmission vs. automatic transmission – HTML programming vs. Frontpage – Assembly code programming vs. compiled high-level language • Manual layout for small, optimized designs will always be superior • EDA techniques for larger-scale designs will always be superior (verification, reusability, NRE, etc.) • Goal: do careful, manual design of smaller components (cells) and use EDA to combine them for large-scale design
  • 13. What EDA Tools Can Do  “My” Design Flow Digital cell library design Cadence IC-Tools Circuit Sim Cadence IC-Tools Characterization Cadence SignalStorm Abstract Generation Cadence AbGen Standard Cell Library Behavioral VHDL Design Mentor HDL Designer char. info process info, cell abstracts Synthesis Synopsys Design Analyzer VHDL Behavioral Simulation Mentor ModelSim Place-and-Route Cadence First Encounter Cell Timing Simulation Mentor ModelSim Verilog Interconnect Timing Simulation Mentor ModelSim
  • 14. Course will be divided into units Introduction: IC design and fabrication fundamentals Lectures Assignments from textbook CMOS circuit design, layout, and simulation Tutorial: Cadence IC-Tools Design projects Development of standard cell library Cell library development Tutorial: Cadence Signal Storm and Abstract Generator Report on cell library VHDL Design Lectures on VHDL Tutorial: Mentor HDL Designer Design project Logic Synthesis Tutorial: Synopsys Design Analyzer Place-and-route Tutorial: Cadence First Encounter Course project Teams Design Fabrication? Course Organization