1. MASKED ION BEAM
LITHOGRAPHY
ARUNBALAJI.S

2. MIBL - INTRODUCTION
• Successing technology of Ion Beam Lithography
• New approach for Biomaterial Patterning
• It allows selected Ion beam to be allowed to fall on
the mask
• Ions of Ca,Mg,Na,P are used as Sources
• Technique of implanting the dopants in the
manufacturing process of semiconductors.

3. MIBL- Setup

4. Techniques in Ion Beam
Lithography

5. • Hydrogen and helium ion beams a extracted from
the suitable ion source.
• M X B mass separation unit is included.
• Proper electrostatic setup is arranged to get the
parallel ion beam
• The Mask is made up of Silicon, copper.
• Ion Beam Induced heating on the mask is avoided
by arrangement of cooling setup for mask

6. MAJOR TYPES OF ION
SOURCES
 Liquid metal ion sources
 Gas field ion sources
 Volume Plasma sources

7. Liquid metal ion source

8. GAS FIELD ION
SOURCE

9. Volume plasma Source
• Mostly used in ion implanters, ion milling machines
and other ion accelerators
• Sources of desired ions are introduced as gas.
• Electron bombardment is used to ionize it.

10. Importance of ion beam
over other techniques
• Nanofabrication without multistep process.
• When a focused beam of ions is traced over a
surface, it removes material to form a trench
approximately equal to the beam diameter.
• rewire integrated circuits by cutting or depositing
metal film conductors.
• useful in the pre-production development phase to
alter a circuit that may not be working because of
a design or fabrication error

11. Advantages of using ions
over electrons
 Ions are larger than electrons, so less change in
chemical nature of substrate,no x- ray emissions in
the sample.
 Ions are heavier than electrons . So ions gain high
momentum.
 Ion beam milling depends on the how much ions
needed to remove the material, it is independent of
the material’s chemical nature and material
strength.
 Material deposition on the specific sites of the
circuit.

12. MIBL - ADVANTAGES
• This method overcomes the problems of beam
dispersion and diffraction in the Optical and X-ray
lithographic systems
• It reduces the multiple steps like film
casting, exposure, developing and etching process
as in photolithography.
• The surface chemistry of substrate is tailored better
compared to photolithography.
• PMMA surface modification by calcium and
phosphorous ions are used to create microwells for
biomems devices
•

13. MIBL -APPLICATIONS
• High Volume gate level printing of Field emitter
Displays(FED).
• Fabrication of surface acousting wave and
microoptic devices.
• Deep trenching reactive ion beam etching in MEMS
and in particular for silicon Microsystems

14. THANK YOU