How 3-D integration will challenge and reshape the memory industry'The semiconductor memory industry is about to go through a period of major technological changes as new integration trends and disruptive packaging technologies pave the way to the future growth of this industry.Historically, the DRAM memory market has been mostly driven by computing applications while NOR Flash has been mainly deployed into consumer and communication devices.More recently, NAND Flash memory has emerged as the most promising solid state storage solution for current consumer devices and is showing as the best candidate for hard disk drive replacement in the near future.INTEGRATION IS THE NEXT CHALLENGEOn the other hand, today wireless is growing and enabling new market segments everywhere, (smart-phones, mobile pocket computing devices).As a result, CONNECTIVIY and INTEGRATION are now new drivers to deal with. Demand for data is increasing everywhere: Faster pipes, more pipes (WAN, LAN, PAN), HD multimedia.Current complexity and concurrency require more than ever higher data capacity, improved power consumption and is stressing existing well established architectures: new interconnects, integration schemes and packaging technologies are needed to support higher performance, breakthrough density and low power consumption devices. 3-D IC integration is showing as a major solution path to tackle these challenges and memories will be key components in achieving this successful integration.3-D INTEGRATION WILL OPEN A NEW APPLICATION SPACE FOR MEMORY MARKETThe burgeoning 3-D Packaging industry since its early beginning The global economic downturn is challenging the fast adoption of the 'Through Silicon Vias' technology into high volume applications such as low cost memories. However, we are seeing concrete signs that this market is definitely taking-off, with the first 3-D integrated DRAM memories being shipped this year: we estimate that about 20 000 wafers of DRAM memory will be shipped with 3D TSV by the end of 2009, with production moving forward to higher volumes in 2010. By 2013, we expect that telecom and computing industries will drive more than 70% of the volume for 3-D TSV integrated memories.3-D integration with memories is a hot topic at the moment because of the challenging market conditions and of the important investment needed for building the required infrastructure. As a result, precompetitive alliances and partnerships may be necessary to drive the risk down while accelerating product adoption. Memory manufacturers, CMOS foundries, OSAT packaging houses, Fab-less IC players and integrated device manufacturers are all concerned and actively preparing for this ultimate integration.This new study aims at answering the following questions: What are the end applications driving the use of 3-D integrated memories' Who are the key players doing it' How will it happen' When will the market ramp up' What is the impact of the current economic turmoil' How big is this 3-D memory market going to be and at which conditions' How will 3D TSV technologies boost new applications and drive the growth of Flash and DRAM market'Key features of the reportUp-to-date Key metrics of the memory market: Per application (more than 30 products screened)Per type of memory (DRAM / SRAM / NOR / NAND Flash)In Munits shipment and in 300mm wafer equivalentImpact of 3-D integration on the memory market and applicationsKey players strategy for 3DIC integration with memoriesCost analysis & challenges for TS V manufacturing: How to make TS V interconnects happen in high volume / low cost memory markets'Companies cited in the report:AMD, Amkor, Chartered Semiconductor, Dai Nippon Printing, Dongbu HiTek, Ibiden, IBM, IMFlash, Intel, Elpida, Excico, Freescale, Fujitsu, Hynix, Micron, Nanya, NEC, Numonyx, Qualcomm, Renesas, TSMC, Texas Instruments, Samsung, SanDisk, Seagate, Shinko, SOITEC / Tracit, Sony, StatsChipPac, STMicroelectronics, Spansion, SPIL, Swissbit, Tezzaron,

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Memory Applications, Packaging & Integration Trends 2009
Published on June 2009
Report Summary
How 3-D integration will challenge and reshape the memory industry'
The semiconductor memory industry is about to go through a period of major technological changes as new integration trends and
disruptive packaging technologies pave the way to the future growth of this industry.
Historically, the DRAM memory market has been mostly driven by computing applications while NOR Flash has been mainly
deployed into consumer and communication devices.
More recently, NAND Flash memory has emerged as the most promising solid state storage solution for current consumer devices
and is showing as the best candidate for hard disk drive replacement in the near future.
INTEGRATION IS THE NEXT CHALLENGE
On the other hand, today wireless is growing and enabling new market segments everywhere, (smart-phones, mobile pocket
computing devices).
As a result, CONNECTIVIY and INTEGRATION are now new drivers to deal with. Demand for data is increasing everywhere: Faster
pipes, more pipes (WAN, LAN, PAN), HD multimedia.
Current complexity and concurrency require more than ever higher data capacity, improved power consumption and is stressing
existing well established architectures: new interconnects, integration schemes and packaging technologies are needed to support
higher performance, breakthrough density and low power consumption devices. 3-D IC integration is showing as a major solution path
to tackle these challenges and memories will be key components in achieving this successful integration.
3-D INTEGRATION WILL OPEN A NEW APPLICATION SPACE FOR MEMORY MARKET
The burgeoning 3-D Packaging industry since its early beginning The global economic downturn is challenging the fast adoption of
the 'Through Silicon Vias' technology into high volume applications such as low cost memories. However, we are seeing concrete
signs that this market is definitely taking-off, with the first 3-D integrated DRAM memories being shipped this year: we estimate that
about 20 000 wafers of DRAM memory will be shipped with 3D TSV by the end of 2009, with production moving forward to higher
volumes in 2010. By 2013, we expect that telecom and computing industries will drive more than 70% of the volume for 3-D TSV
integrated memories.
3-D integration with memories is a hot topic at the moment because of the challenging market conditions and of the important
investment needed for building the required infrastructure. As a result, precompetitive alliances and partnerships may be necessary to
drive the risk down while accelerating product adoption. Memory manufacturers, CMOS foundries, OSAT packaging houses, Fab-less
IC players and integrated device manufacturers are all concerned and actively preparing for this ultimate integration.
This new study aims at answering the following questions: What are the end applications driving the use of 3-D integrated memories'
Who are the key players doing it' How will it happen' When will the market ramp up' What is the impact of the current economic
Memory Applications, Packaging & Integration Trends 2009 Page 1/6

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turmoil' How big is this 3-D memory market going to be and at which conditions' How will 3D TSV technologies boost new applications
and drive the growth of Flash and DRAM market'
Key features of the report
Up-to-date Key metrics of the memory market:
Per application (more than 30 products screened)
Per type of memory (DRAM / SRAM / NOR / NAND Flash)
In Munits shipment and in 300mm wafer equivalent
Impact of 3-D integration on the memory market and applications
Key players strategy for 3DIC integration with memories
Cost analysis & challenges for TS V manufacturing:
How to make TS V interconnects happen in high volume / low cost memory markets'
Companies cited in the report:
AMD, Amkor, Chartered Semiconductor, Dai Nippon Printing, Dongbu HiTek, Ibiden, IBM, IMFlash, Intel, Elpida, Excico, Freescale,
Fujitsu, Hynix, Micron, Nanya, NEC, Numonyx, Qualcomm, Renesas, TSMC, Texas Instruments, Samsung, SanDisk, Seagate,
Shinko, SOITEC / Tracit, Sony, StatsChipPac, STMicroelectronics, Spansion, SPIL, Swissbit, Tezzaron, Toshiba, UMC, Xilinx,
Ziptronix and more.
Benefits:
Who should buy the report
Strategy & Marketing executives from the equipment, materials or chip manufacturing semiconductor industries who need to position
rapidly on the impact of 3-D integration on the complex, high volume and fast moving memory market.
Table of Content
Table of Contents
Introduction to memory technologies P1
o DRAM / SRAM / NOR Flash / NAND Flash
- 2008 Overall memory shipment market (in Units)
- 2008 Overall memory market revenues (in $B)
o Trends for next generation Non-Volatile memory technologies:
- M-RAM / PC-RAM: status of industrialization and near-term opportunities
Memory Applications & Markets P18
o Current & future applications driving DRAM / SRAM / NAND / NOR Flash memory demand
- Per industry:
Market forecasts in Munits shipment and in 300mm wafers equivalent
Breakdown for Telecom / Computing / Consumer / Servers / Automotive / Industrial & Medical markets
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- Per product / application:
2008-2015 market forecasts in Munits shipment and in 300mm wafers equivalent
Breakdown for Desktop PCs / Notebooks / Net books / MID / Regular & Blade Servers / Data
storage servers / Portable media players / Portable game stations / Memory Cards / USB Stick / Cell-phones / Game stations /
Set-Top Box / HD camcorders / DSC / SLR / Automotive / Base stations / Portable navigation Sys ' GPS / Digital TV / Workstations /
Memory Upgrades / HDD / Printer / Analog TV / DVD Player / HPC / ATE systems
Memory Packaging & Integration Trends P33
o Architectures and memory die quantity analysis in current product generation:
- Focus on Cell-phones, SS Ds, DSCs, servers, Portable media players and game stations
o Single Die versus Stacked packaging:
- 2008-2015 Key market metrics and trends for memory - integration using TSO P / FBGA / PoP / PiP / WLP Fan-in / Fan-out WLP
packages / Silicon interposers
Impact of 3-D integrations on the memory market P55
o Applications and market drivers for 3D integration with memories
o 'Embedded 3D-SOC memories' Versus '3-D Stacked memories in SiP':
- Definitions, players and roadmaps
- 2008-2015 market forecasts in Munits shipment and in 300mm wafers equivalent
o ''3D Chip Stacking'' Vs. ''Circuit Transfer 3D'' Vs.
''Monolithic 3D'' integration
- Definitions, players and roadmaps
- 2008-2015 market forecasts in Munits shipment and in 300mm wafers equivalent
o Impact of MLC versus SLC Flash memory architecture on adoption of 3-D TS V memories
- Definitions, players and roadmaps
- 2008-2015 market forecasts in Munits shipment and in 300mm wafers equivalent
o Silicon interposers for 3D TS V memories:
- Definitions, players and roadmaps
- 2008-2015 market forecasts in Munits shipment and in 300mm wafers equivalent
o TS V manufacturing cost challenge:
- What is the process and cost of TS V in memories today'
- What is the targeted cost for a broad adoption of 3-D TS V into low cost memory markets'
o Overall Roadmap for 3-D integration with Memories (2008 ' 2015)
o Impact of 3-D integration on DRAM / SRAM / NAND / NOR Flash memory markets
- 2008-2015 market forecasts in Munits shipment and in 300mm wafers equivalent
- Breakdown per mount technology: forecast for Single die / Wire Bond stacked / 3-D TS V memory
- Breakdown per application:
Opportunities of 3-D integrated memory in DDR3 / DDR4 / Wireless Application processors / Wireless Baseband - DSP / SS Ds /
Graphic memory / Micro-Cards / Embedded & Cache CPU-GPU / FPGAs
Player's strategy for 3-D integration with memories P85
o Supply chain analysis: Memory fabs / CMOS foundries / OSAT pacckaging houses / IDMs / Fab-less / Integrator player activities
o Infrastructure & pre-competitive alliances in 3-D IC system integration
Perspectives & Conclusions P98
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Annexes P104
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