Spansion® HyperBus™ Interface is a breakthrough that dramatically improves read performance while reducing the number of pins. The efficient 12-pin Spansion HyperBus Interface consists of an 8-pin address/data bus, a differential clock (2 signals), one Chip Select and a Read Data Strobe for the controller, reducing the overall cost of the system. The Spansion HyperBus Interface is being implemented broadly by leading system-on-chip (SoC) manufacturers. Spansion has developed the first family of products based on this new interface, Spansion HyperFlash™ NOR Memory devices, with read throughput of up to 333 megabytes per second—more than five times faster than ordinary Quad SPI flash currently available with one-third the number of pins of parallel NOR flash.

1. Spansion Introduces Breakthrough Interface
and World’s Fastest NOR Flash Memory
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© 2014 Spansion Inc.

2. Spansion Introduces Breakthrough Interface
and World’s Fastest NOR Flash Memory
Spansion® HyperBus™
Interface
Spansion HyperFlash™
Memory
 Dramatically improves read
performance while reducing
pin-count and board space
 Up to 333 megabytes
per second read
throughput
 Supported by major
System-on-Chip
manufacturers
 5X faster performance
than ordinary Quad SPI
 Applicable to flash, RAM
and peripheral devices
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© 2014 Spansion Inc.
 1/3 the pin-count of
parallel NOR flash

3. NOR Innovations Scale to Meet Application Challenges
Advances in Performance, Power, Space, Cost, Quality and Features
Ease of use
1980
5V
1985
3V
1990
1995
Simul.
R/W
1.8V
Performance
2000
MirrorBit
System Cost
Performance
2005
ASP
Security
2010
Universal
Pinout
SPANSION INNOVATIONS
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© 2014 Spansion Inc.
2015
Fast
DDR
DLP

4. Spansion® HyperBus™ Interface – Breakthrough Throughput
350
12 pins
300
MB/S
250
200
150
100
~45 pins
6 pins
50
6 pins
4 pins
0
Page-mode
Page-mode
Parallel
NOR
SPI SPI
x1
Ordinary DDR
Quad
Quad SPISPI
Spansion DDR
DDR SPI Spansion
Quad SPI
HyperBus
Interface
Sustained Read Throughput (MB/s)
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© 2014 Spansion Inc.

5. Efficient Bus for Various Memory Types and Peripherals
12-Pin Spansion® HyperBus™ Interface
CS#
8-bit I/O Bus
Memory
or
Peripherals
System on Chip
or
Microcontroller
CLK
CLK#
RDS
HyperBus Interface
 Chip Select (CS#)
 8-bit up to 166MHz
Double-Data-Rate
(DDR) I/O bus for
high throughput
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© 2014 Spansion Inc.
 Differential Clock
(CLK & CLK#)
 Read Data Strobe
(RDS) for accurate
read data capture
by host

6. “The Spansion HyperBus interface is a powerful
advancement on today’s low pin count memory
interfaces. The extra functionality and performance is
specifically welcome in automotive applications where it
allows high-speed, off chip access through a simple low
pin count connection. We are pleased to have worked
with Spansion during the development of the new
HyperBus standard and you’ll see a number of Freescale
Microcontrollers appearing in the near future taking
advantage of this new interface.”
Ray Cornyn
Vice President of Product Management
Freescale Automotive Microcontrollers business.
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© 2014 Spansion Inc.
CONFIDENTIAL

7. Introducing Spansion® HyperFlash™ Memory
Continuing High-Performance Leadership
Spansion
HyperFlash
Memory
333 MB/s
Parallel NOR
Spansion
15ns Page
= 96 MB/s
SPI NOR
Spansion
DDR 80MHz
= 80MB/s
All the benefits of Parallel and SPI NOR Flash
combined for advanced memory systems
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© 2014 Spansion Inc.

8. Spansion® HyperFlash™ Memory: World’s Fastest NOR Flash
Compelling Features:
 5x the Read Speed of Quad SPI
− 333MB/sec VCC = 1.8V
− 200MB/sec VCC = 3.0V
 96ns Initial Read Access Time
 128, 256, 512 Mb densities
Space-Saving 8x6mm BGA
 Common 24-ball BGA footprint
 SPI, QSPI, Dual QSPI or
HyperFlash Memory
Automotive Temperature
 Supports Extended Temp Range
 -40°C to 125C°
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© 2014 Spansion Inc.

9. Universal Footprint Features Common Pin-Out
Scalable Performance and Density
in the Same Package Footprint
6mm x 8 mmQuad SPI BGA
Dual-Quad 5x5 Memory
HyperFlash™ Array
Single SPI Memory
RSTO# CS2# RESET# INT#
RFU
RFU
One Quad SPI
2nd Quad SPI
HyperFlash
Memory
IO0 to IO3,
CK, CS#
IO0 to IO3,
CK, CS#
DQ0 to
DQ7, CK, CK#, C
S#, RDS
More Density
Higher Performance
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© 2014 Spansion Inc.
SCK2
CK#
SCK1
VSS
VCC
RFU
VSSQ
VSS
CS1#
CS#
RDS
RFU
DQ2
IO2
RFU
VCCQ
RFU
DQ1
IO1
DQ0
IO0
DQ3
IO3
DQ4
IO4
DQ7
IO7
DQ6
IO6
DQ5
IO5
VCCQ VSSQ
VIO
VSS
160MB/S
333 MB/S
80
128 Mb to 512Mb
256 Mb to 1Gb
128Mb to 1Gb

10. Simple Transition: Quad SPI to Spansion® HyperFlash™ Memory
BGA 6mm x 8mm, 5 x 5 ball footprint
Spansion
Single Quad SPI
Spansion
Dual-Quad SPI
Spansion
HyperFlash Memory
CK#
VSSQ
Quad SPI-1
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© 2014 Spansion Inc.
Quad SPI-2
RFU
RFU
HyperFlash

11. HyperFlash™ Memory Applications
D-SLR
Auto-Cluster
Advanced Driver
Assistance Systems
Solutions for Instant-On
and Interactive
Graphical User Interface
LED Projector
Medical
Infotainment
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© 2014 Spansion Inc.
Factory Automation

12. Spansion’s Performance Difference:
Faster Boot and Graphics Display
Spansion
HyperFlash
333MB/s
0.7 sec
NAND
Spansion
SPI
80MB/s
2.8 sec
NAND
Ordinary
SPI
50MB/s
4.2 sec
NAND
automotive
industrial
For illustration:
Boot to Display = U Boot, Regular Boot, Basic OS, Initial Display
Actual Time is Spansion Inc. architectural dependent which can include decompression and RAM shadowing
© 2014 system and
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13. High-Speed Read Reduces the Need for Compression
Sharper, Crisper Images
ORIGINAL
HIGH COMPRESSION
HyperFlash™ Memory
333 MB/s
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MINOR COMPRESSION
Spansion® DDR Quad SPI
80 MB/s
Ordinary DDR Quad SPI
50 MB/s
© 2014 Spansion Inc.

14. Spansion Redefines Performance for NOR Flash
HyperBus™ Interface
High Performance
HyperFlash™ Memory
Performance
 Fast boot
 Fast XIP with less DRAM
Common footprint and
small BGA form factor
 With Single and Dual Quad SPI NOR
 Performance migration
 For space-constrained designs
Multiple densities and
operating temperatures
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 For many memory types and peripherals
 Common interface and package for many
densities  easy capacity migration
 Automotive temperatures
© 2014 Spansion Inc.

15. www.spansion.com
Spansion®, the Spansion logo, MirrorBit®, MirrorBit® Eclipse™, HyperBus™, HyperFlash™ and combinations thereof are
trademarks and registered trademarks of Spansion LLC in the United States and other countries. Other names used are
for informational purposes only and may be trademarks of their respective owners.
This document is for informational purposes only and subject to change without notice. Spansion does not represent that
it is complete, accurate or up-to-date; it is provided “AS IS.” To the maximum extent permitted by law, Spansion disclaims
any liability for loss or damages arising from use of or reliance on this document.
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© 2014 Spansion Inc.