2. PACT MISSION
2
Introduce a scientific background in the existing technical
experience
Convert Rheology and Polymer Science into a language of
management, technical board and operators
Supply a technical and scientific support to complex
scenarios
3. current needs future needs further development
equipment
formulation
polymer rheology
material science
R&D
industrial application
process simulation
PACT OVERALL STRATEGY
3
4. RHEOLOGY EQUIPMENT
RDAII Torsional Rheometer:
• Melt viscosities, or resistances to deformation, of neat polymers
and masterbatches under torsional shear flow.
• Melt strengths of the crystalline and amorphous phases of the
polymer
RSAII Extensional Rheometer:
• Solid film’s extensional viscosities during repetitive
elongation and retraction to a certain strain level at a
certain temperature
Extrusion Coating Technology – Seminar 2010
6. TGA Thermogravimetric Analyzer):
Testing decomposition behavior vs.
temperature of different polymers and
masterbatches
THERMAL ANALYSIS EQUIPMENT
Extrusion Coating Technology – Seminar 2010
8. DSC (Differential Scanning Calorimeter):
Thermal properties of the polymer/masterbatch pellets
or final film products
Oxidation Induction Time
Polymer blend compositions
THERMAL ANALYSIS EQUIPMENT
16. INTRODUCTION TO
RHEOLOGY
T, MW, MWD,
Dispersion etc.
Rheometer for advanced QC and R&D
a. Neat material process control
b. Masterbatch content and process control
c. Final product quality assessment
d. Service for sister companies
RDAII: Rheometrics Dynamic Analyzer
RSAII: Rheometrics Solids Analyzer + SER Fixture
Rheology:
“The science of the deformation and flow of matter”
Extrusion Coating Technology – Seminar 2010
17. DMA
• Dynamic Mechanical Analysis
(DMA) technique used to study and
characterize materials.
• A sinusoidal stress is applied and the
strain in the material is measured,
allowing one to determine the
complex modulus.
• The temperature of the sample or
the frequency of the stress are often
varied, leading to variations in the
complex modulus.
Extrusion Coating Technology – Seminar 2010