Equipment and Materials for Fan-Out Packaging 2019 report by Yole Développement

From Technologies to Markets
© 2019
From Technologies to Markets
© 2019
Equipment and
Materials For
Fan-Out Packaging
2019
Market and Technology Report
Sample

22Equipment and Materials for Fan-Out Packaging | Sample | www.yole.fr | ©2019
TABLE OF CONTENTS
Equipment and Materials for Fan-Out Packaging 2019
 Table of Contents 002
 About the Author 003
 Report Scope and Methodologies 004
o Companies Cited in this Report 006
o Glossary 007
o Who should be Interested in this Report 009
 What we got Right, What we got Wrong 010
 What’s new since 2017 Report? 012
 3-Page Summary 013
 Executive Summary 016
 Context 063
o Segmentation, Report Focus, Definition 064
o Fan-Out Packaging Introduction 073
o Is Fan-Out Packaging still Popular? 077
 Market Forecasts 080
o Fan-Out Packaging Production 081
o Equipment & Materials in Fan-Out Packaging 088
• Revenue: Split by Equipment, Materials, Process 090
• Production Investment vs Supplier Revenue 095
• Revenue: FOWLP vs FOPLP 099
 Market Trends 102
o Market Drivers and Dynamics 103
o Analysis of FOWLP vs FOPLP (inflection points, player strategy) 112
 Market Shares and Supply Chain 119
o Overview of Equipment and Materials Suppliers 120
o Market Shares of Equipment and Materials Suppliers 122
o Fan-Out Packaging Supply Chain & Landscape 138
 Fan-Out Panel-Level Packaging Challenges and Suppliers 152
 Fan-Out Packaging Process 168
o Generic Process Approaches 170
o Technical Challenges 180
 Market and Technology by Process Steps 190
o Carrier Bonding and Debonding 191
• Materials: Carriers 193
• Equipment: Debonding Tools 121
o Pick-and-Place 211
• Equipment: Pick-and-Place Tools 213
o Molding Compound Deposition 226
• Materials: Molding Compound 228
• Equipment: Molding Tools 240
o RDL Passivation 247
• Materials: RDL Polymer 249
• Equipment: RDL Polymer Coating/Development Tools 258
o RDL Patterning 266
• Materials: RDL Photoresist 268
• Equipment: Lithography Tools 282
o RDL Barrier-Seed Layers 292
• Equipment: PVD tools 294
o RDL Plating 312
• Materials: Cu RDL Plating Chemistry 314
• Equipment: Cu RDL Plating Tools 319
o Metrology & Inspections (Technology only) 323
 Conclusions 328
 Yole Corporate Presentation 332

33Title of the report | Report | www.yole.fr | ©2019
ABOUT THE AUTHOR
Biography & contact
Favier SHOO
Favier Shoo is aTechnology and Market Analyst in the Semiconductor & Software division atYole Développement, part ofYole
Group of Companies. Based in Singapore, Favier is engaged in the development of technology & market reports as well as the
production of custom consulting reports.
During 7 years at Applied Materials as a Customer-Application-Technologist in the advanced packaging marketspace, Favier
developed a deep understanding of the supply chain and core business values.As an acknowledged expert in this field, Favier
has provided training and held numerous technical review sessions with industry players. In addition, he has obtained 2
patents.
Prior to that, Favier worked at REC Solar as a Manufacturing Engineer to maximize production capacity.
Favier holds a Bachelor in Materials Engineering (Hons) and a Minor in Entrepreneurship from Nanyang Technological
University (NTU) (Singapore). Favier was also the co-founder of a startup company where he formulated business goals,
revenue models and marketing plans.
shoo@yole.fr

44
This report’s main objectives are as follows:
• Describe technologies that can be classified as “fan-out packaging”
• Identify and detail the fan-out packaging platform’s key process steps
• Analyze the manufacturing chain for fan-out technologies
• Pinpoint the equipment and materials suppliers for key process steps
• For these steps, provide a market forecast for the coming years and an prediction of future trends
• Elaborate on key market drivers, benefits, and challenges for equipment and materials in fan-out
packages
Fan-Out equipment and materials are studied from the following perspectives:
• Available technologies and their inherent challenges
• Volume of market sizing
• Revenue of market valuation
• Market shares of players involved
SCOPE OFTHE REPORT
Yours needs are
out of the report’
scope?
Contact us for a custom:
Equipment and Materials for Fan-Out Packaging | Sample | www.yole.fr | ©2019

55
3D-Plus, 3M,A*Star,AG,AGC,Akrometrix,Amicra,Amkor,Analog,Apple,Applied Materials,ASE,ASM,
Atotech,Aurora semiconductors, Besi, Bosch, Brewer Science, Broadcom, Camtek, Capcon, ChipPAC,
Corning, Deca, Denko, Devices, Dialog, Dupont, Ebara, Enthone, ERS, Evatec, EVG, Fico Molding,
Freescale, Fujifilm, Hanmi, HD Microsystems, Henkel, HiSilicon, Hitachi Chemical, Hoya, Huatian,
Huawei, Ibiden, IME, Infineon, Intel, ITRI, JCET Group, JSR, Kulicke&Soffa (K&S), Lintec, Mediatek,
Medtronic, Merck, MicroTec, Mitsui, MLI, Nagase ChemteX, Nanium, Nanometrics, NEG, Nepes, Nexx,
NGK, Nissan Chemical, Nitto Denko, Nokia, Novellus, NXP, Oerlikon, Orbotech, Plan Optik AG,
Platform Specialty Products, PTI, Qualcomm, Rudolph, Samsung Electronics, Schott, Science, Screen,
SEMCO, SEMPRIUS, SEMSYSCO, SMEE, Shibaura, Shin-Etsu, Shinkawa, Shinko Electric, Silicon, SPIL, SPTS,
STATS, STATS ChipPAC, STMicroelectronics, Sumitomo, SUSS MicroTec,Tazmo,Technic,TEL,TOK,Toray
Chemical,Towa,TSMC, Ultratech, ULVAC, Unimicron, UnitySC, Ushio, UTAC,Wacker,Yamada and
more…
COMPANIES CITED IN THIS REPORT

66
WHO SHOULD BE INTERESTED IN THIS REPORT
Equipment & material suppliers:
To identify new business opportunities and prospects
To understand the differentiated value of your products and technologies
To identify technology trends, challenges and precise requirements
To evaluate your Fan-Out Packaging technologies’ market potential
To position your company in the market
To monitor and benchmark your competitors
OSATs, IDMs & foundries:
To understand technology trends related to Fan-Out Packaging platforms
To spot new opportunities and define diversification strategies
To understand the overall Fan-Out Packaging market
To monitor and benchmark potential competitors
To understand the supply chains involved in Fan-Out Packaging
R&D organizations:
To evaluate the potential of future technologies and products
Identify market needs for new applications
To understand the bottle necks of the Fan-Out Packaging technology and
direct their resources to solve the technical issues
To identify the best candidates for technology transfers
To identify the partners for consortia
Financial & strategic investors:
To identify new business opportunities and prospects
To understand the market potential of Fan-Out Packaging
To understand which players will benefit from Fan-Out Packaging adoption
To understand the players that are investing in the Fan-Out Packaging business
OEMs & integrators:
To understand technology trends in Fan-Out Packaging platforms
To spot new opportunities and define diversification strategies
To understand the overall Fan-Out Packaging market
To monitor and benchmark potential competitors
To understand the supply chains including the equipment / material suppliers

77
• New 3-page summary of report with dashboards
• Updated market forecast of Fan-Out production revenues (2018 to 2024)
• New market survey on Fan-Out packaging popularity
• Updated production status of key players
• Updated carrier penetration rate between FOWLP vs FOPLP
• New analysis of FOWLP vs FOPLP
• New suppliers identified in FOPLP supply chain
• Updated equipment and materials suppliers for both FOWLP and FOPLP
• Updated market forecast of equipment and materials, volumes and revenue (2018 to 2024)
• Updated market shares of equipment and materials players (2016 to 2018)
• New market sizing for Cu RDL plating, equipment and materials
• New M&A timeline of FOPVD suppliers
WHAT’S NEW FROM 2017 REPORT?

88
2024 REVENUE BY PROCESS
*MARKETVALUE DASHBOARD
2018 REVENUE BY PROCESS
> $200 M > $700 M
FAN-OUT PACKAGING EQUIPMENT AND MATERIALS MARKET: REVENUE FORECAST
CARRIER FORECAST
PRODUCTION RATIO (%)
2018
> $200 M
REVENUE IN 2018
EQUIPMENT AND MATERIALS
FAN-OUT PACKAGING
*Market data includes key process steps that reflects Fan-Out Packaging characteristic and relevance.
*This is non-exhaustive. For details, please refer to sub-chapter “Segmentation, process flow and report focus”.
2024
> $700 M
REVENUE IN 2024
FAN-OUT PACKAGING
CAGR
21%
MARKET GROWTH 2018-2024
FAN-OUT PACKAGING

99
*MARKET SHARE DASHBOARD
$13 M $37 M $12 M $14 M
$27 M$14 M $24 M
FOWLP MATERIALS MARKET SHARE IN 2018: > $50M FOWLP MATERIALS
LEADERS EVOLUTION
FOWLP EQUIPMENT
LEADERS EVOLUTION
FOWLP EQUIPMENT MARKET SHARE IN 2018: > $100M

1010
DEFINITION OF FAN-OUT PACKAGING
How different people can understand it andYole Développement’s scope
Fan-Out packaging can be understood in several ways depending on who we are talking to. It is especially confusing because when the hype around this
package type started, many players used the name ‘Fan-Out’ to describe their solution to gain more attention in the market.
An even more confusing aspect is that acknowledged Fan-Out solutions are not or were not called ‘Fan-Out’ by their creators. For instance, Infineon,
creator of eWLB, one of the most widespread Fan-Out solutions, had not even called it ‘Fan-Out’ in its IP and referred to it for a long time as an
‘embedded die’ solution.
An acknowledged characteristic of ‘Fan-Out’ packages is that, as the name suggests, interconnections are fanned out on the chip and because of that,
bumping is not dependent on die surface.
This means that Fan-Out has the potential to achieve any number of interconnects with standard pitches at any shrink stage of the wafer node technology.
If the only definition of ‘Fan-Out’ is a package from which connections and bumping are out of the chip scale, then almost all packages can be defined as
Fan-Out! Flip-Chip BGA, Flip-Chip CSP, Embedded Die, etc. Due to this, confusion is high in the industry.
To make a fair comparison and to clarify the situation,Yole is focused on selected Fan-Out technologies that have two key characteristics:
Fan-Out solutions that are using mold compound to embed the dies—and not laminated materials.
Fan-Out solutions’ RDL that are not using advanced substrate (PCB type of layer)
Mold Chip
No advanced substrate
(PCB type) used for
redistribution layers
Mold compound is used to
embed the chips
Connections are
fanned out of chip
scale area

1111
FAN-OUT PACKAGING PROCESS PRINCIPLE
01
Tape lamination
Carrier
02
Pick and place
Carrier with foil and chips
03
Wafer-level molding
Molding with liquid mold compound
04 Carrier removal (de-bonding)
Reconstituted waferbackside after molding
05
Standard WLP process
(Passivation, pattern, RDL, bonding)
WLP Fan-Out wafer
Fan-Out: Dies embedded in mold compound. No advanced substrate needed to fan out of chip surface.
eWLB example (chip-first face-down)Source: Infineon
06
Dicing
After singulation

12
FAN-OUT END APPLICATIONS
Current end products using Fan-Out
Markets for
FO
packaging
are
becoming
more
diverse.
2012 2013 20142011 2015 2016 2017 2018 ≥2019

13
FAN-OUT - DETAILED PROCESS FLOW (1/3)
Chip-first face-down case
These
four front-end
steps are
critical for fan-
out packages
(the rest of the
process exists
in other
manufactured
packages and is
more mature).
Specific tools & equipment Specific materials
Pick & Placement tool
Wafer debonding equipment
 Dual-attached film spill-off
Mold compound
(liquid or granular)
Dual-attached film
+
Carrier (Si, ceramic, glass, metal).
Usually stainless steel (metal).
Compression wafer-level
molding tool
Vacuum lamination tool
Cleaning solutions
Grinding & CMP tools CMP pad and slurries
Critical materials:
• Choice of adhesive is key for
debonding step
• Choice of carrier type has
high impact on warpage and
debonding capability
Critical material:
• Mold compound deposition
induces stress on the die, die
shift, and warpage
Critical step:
High accuracy required to
limit die shift
Critical step:
• High impact on warpage
and reliability. Cost is
very dependent on
carrier choice.
Tape lamination
Pick and place
Molding
Debonding

1414
Passivation for RDL
Redistribution layer (RDL)
Patterning for RDL Photolithography for patterning
- Stepper or mask aligner
Wet bench (photoresist stripping)
Curing is done after patterning
- Seed layer deposition (PVD)
- Thick resist deposition for Pillars
- Thin resist deposition for RDL
(<10um)
- Resist patterning/lithography
(Stepper or mask aligner)
- Cu local ECD plating
- Polymer/thick resist stripping
- Seed layer wet etching
- Sputtering targets
- Thick photoresist
- Thin photoresist
- ECD chemistry
- Wet etch chemistry
- Cleaning chemistry
Dielectric material deposited by spin
coating
Dielectric materials for passivation
- BCB, PI, PBO, epoxy,Al-X
Specific materials
Critical materials:
• Choice of dielectric polymer
is key for reliability and curing
temperature (mold
compound cannot handle high
temperature)
Specific tools & equipment
Critical step:
• Finer L/S may worsen yield
due to uneven uniformity
RDL formations. Insufficient
wet etch will result in Line-to-
Line current leakage.

1515
Plating  PR Strip  UBM
etching via wet etch.
Final test + singulation
Ball mount + wafer test
Re-passivation layer
UBM deposition + Plating + Etching
Dicing tool
- Laser
- Blade
- Stealth
- Dielectric material deposited by spin coating
- Exposure (stepper/mask aligner)
- Resist stripping
- Passivation is cured after exposure
Materials for passivation
- BCB, PBO, epoxy,Al-X
- Stripping chemistries
UBM deposition techniques:
- PVD + ECD
or
- Electroless
or
- PVD
Consumables
- Sputtering targets + ECD
chemistry
or
- Electroless chemistry
or
- Sputtering targets
UBM wet-etch chemistry materials
(dependent of type of metal to etch)
Final test tool
- Balling (ball drop, printing)
-Wafer test tool
Critical materials:
• Choice of dielectric polymer
is key for reliability and curing
temperature (mold
compound cannot handle high
temperature)
Specific materialsSpecific tools & equipment

16
PROCESS STEPS TO FOCUS IN THIS REPORT (1/2)
In this report, Yole Développement focuses on some specific process steps. These steps are considered more specific and
illustrative of fan-out packaging, as well as areas showing strong innovation from different players:
o Pick and place:
• Pick-and-place is a key step for FOWLP. The process speed directly impacts the production pace, and die positioning accuracy has
consequences on RDL manufacturing.
o Bonding/debonding:
• A trademark step of fan-out packaging is the bonding of chips on carriers’ surface and debonding them once the reconstituted wafer is
molded. This step directly impacts package reliability and defines this platform’s feasibility. It impacts warpage, defectiveness, and package
manufacturing success.
o Mold compound deposition:
• Mold deposition is fan-out packaging’s most illustrative step. Mold constitutes the package itself, and embeds the chips. Creating a
reconstituted wafer/panel and processing it is at the very core of fan-out manufacturing.
o RDL process:
• Redistribution layers are the source of the “fan-out” packaging name. They allow the connections to transcend the chip surface and not be
limited by it. All steps are essential: polymers’ passivation coating, patterning them thanks to photolithography, and creating copper
connection layers through plating (after first sputtering the seed).This process impacts package thickness and efficiency.
o Metrology:
• Metrology steps are very important for guaranteeing good process execution. In the case of fan-out, some steps that are not commonly
measured in advanced packaging (i.e. warpage) become mandatory to follow.

17
PROCESS STEPS TO FOCUS IN THIS REPORT (2/2)
What about other process steps?
o All manufacturing steps are important for an optimum process, but some steps were not considered during our investigation.
Several reasons for this: either we did not have enough information on these steps, or they were closed markets, or we deemed
them less characteristic of FOWLP. For relevance and information quantity’s sake, Yole Développement has focused its
investigation on the process steps listed on the previous slide. However, we are capable of studying other steps and their
associated equipment and materials upon request, if desired.
o List of steps not investigated in this report:
• UBM deposition and etching
• Ball mounting
• Wafer testing
• Dicing
o Some steps were investigated only at a technical level, and a market study was not performed:
• Carriers (market forecasts available only for glass carriers)
• Metrology steps

18
FAN-OUT ACTIVITY MARKET FORECAST
Fan-Out
packaging
continues to
strive in this
new digital
age driven by
Mega-Trends.
Standard: Core FO
Big-Entry: HD FO
Mega-Entry
Yole Développement September 2019
Mega-Entry
Mega-Entry
*Core FO: Low-End to Mid-End devices
*HD FO: High-End to High-Performance devices Equipment and Materials for Fan-Out Packaging | Sample | www.yole.fr | ©2019

1919
FAN-OUT PACKAGING: *WAFERVOLUME DISTRIBUTION IN 2017 & 2018
Others Others
2018
*Volume units are in 300mm wafer equivalent.
*Total wafer volume includes 200mm, 300mm, 330mm and Panels.
*Volume splits are based on annual capacity.
2017
New players are entering Fan-Out
production by FOPLP technology
Others: Nepes, SPIL, Huatian
Others: Nepes, SPIL,
Huatian

2020
FAN-OUT COST EVOLUTION ANALYSIS*
Going panel
means
tremendous
cost
reduction.
• End customers are asking for lower and lower prices.
• Price reduction is a key parameter for Fan-Out market
growth.That price reduction can be achieved by reducing
manufacturing cost, which is achieved by using larger
carriers.
• Going panel (example here with 18”x24” panel) could
enable cost reductions up to 66%… if technologies are
ready and yield higher than 90%.
2016 2017 2018
$0.10
FOWLP
Cost/package*
$0.20
$0.30
$0.40
≥2019≤2015
*Example for 8x8mm packages with
single die embedding
300mm
200mm
Panel
25% cost reduction
66% cost reduction

2121
2012 2013 2014 2015 2016 2017 2018 2019
M&A ACTIVITIES AMONGST FOPVD* SUPPLIERS
Bigger players are acquiring companies to tap into new markets and capabilities…
NEXX Systems, Inc
was acquired byTokyo
Electron (TEL) in
2012
SPTSTechnologies
Group Limited was
acquired by Orbotech
Ltd. in 2014
Oerlikon’s Advanced
Technologies Segment
is acquired by Evatec
AG in 2015
Orbotech Ltd. was
acquired by KLA-
Tencor Corporation
in 2019
TEL NEXX, Inc. was
acquired by ASM
PacificTechnology Ltd.
(ASMPT) in 2018
*FOPVD = Fan-Out PhysicalVapour Deposition Equipment and Materials for Fan-Out Packaging | Sample | www.yole.fr | ©2019

2222
EQUIPMENT & MATERIALS SUPPLIERS FOR FAN-OUT MANUFACTURING
IC 1 IC 2
Non-exhaustive players with Fan-Out Packaging capabilities

2323
FOPLP INFRASTRUCTURE - EQUIPMENT & MATERIALS SUPPLIERS INVOLVED (1/3)
Non exhaustive list of suppliers
Key processes Equipment Materials
Carrier bonding / debonding
Pick & place assembly
Panel level molding

2424
Process steps Equipment Materials
RDL, pattern, passivation
RDL (PVD)
RDL (Plating)
RDL (etch)

2525
Process steps Equipment Materials
Ball mount
Dicing
Inspection

26
FAN-OUT PACKAGING REVENUE FORECAST: EQUIPMENT AND MATERIALS*
In terms of production (300mm wafer equivalent)
*This is non-exhaustive. For details, please refer to sub-chapter “Segmentation, process flow and report focus”. Equipment and Materials for Fan-Out Packaging | Sample | www.yole.fr | ©2019

27
FAN-OUT PACKAGING REVENUE FORECAST: MATERIALS*
2018-2024

28
FAN-OUT PACKAGING REVENUE FORECAST: EQUIPMENT*
*This is non-exhaustive. For details, please refer to sub-chapter “Segmentation, process flow and report focus”. Equipment and Materials for Fan-Out Packaging | Sample | www.yole.fr | ©2019

29
FAN-OUT PACKAGING REVENUE FORECAST: FOWLPVS FOPLP*
FOWLP vs
FOPLP
revenue split
by production
volume ratio.
2018-2024

3030
FOWLP MARKET SHARE SUMMARY IN 2018: MATERIALS
Total > $50 M
2018 Global Materials Market for FOWLP
MarketValue and Shares are included in Full Report

3131
FOWLP MARKET SHARE SUMMARY IN 2018: EQUIPMENT
2018 Global Equipment Market for FOWLP

3232
MARKET FORECASTS, MARKET SHARES AND TECHNOLOGY FOCUS BY PROCESS
and many more…

33
Contact our
SalesTeam
for more
information
33
Contact our
SalesTeam
for more
information
Status of
the Advanced Packaging
Industry 2019
Fan-Out Packaging 2019
Technologies & Market Trends
Status of Advanced Substrates
2019
YOLE GROUP OF COMPANIES RELATED REPORTS
Yole Développement

34
Contact our
SalesTeam
for more
information
34
Contact our
SalesTeam
for more
information
Advanced packaging technology
in the Apple Watch Series 4’s
System-in-Package
YOLE GROUP OF COMPANIES RELATED REPORTS
System Plus Consulting

Although Fan-Out (FO) packaging is still
a relatively small market amongst other
popular packaging platforms, it can cover
high-end High-Density (HD) FO and low-
end Core FO applications. Historically, FO
packaging is essential to applications such
as Power Management Integrated Circuits
(PMICs), Radio-Frequency (RF) transceivers,
connectivity modules, audio/codec modules
and radar modules and sensors. It was,
however, the adoption by Apple’s Application
Processor Engine (APE) of TSMC’s integrated
FO Package-on-Package (inFO-PoP) platform
that started to fuel its popularity and made
HD FO possible. Now, there is no doubt the
industry is no longer as overexcited about FO
packaging as it was during the TSMC/Apple
buzz. However, in HD FO, TSMC is the sole
leader, and is not only using inFO for APE. It is
also extending it into new exciting technologies
like inFO-Antenna-in-Package (AiP) for fifth
generation (5G) wireless communication, and
inFO-on-Substrate (oS) for High Performance
Computing (HPC). So, FO packaging is still
maintaining its centrality as a popular option
for mega-trend driven applications like AiP,
HPC and Systems-in-Packages (SiPs). FO Wafer
Level Packaging (WLP) capacity expansion is
therefore expected moving forward. SEMCO
and PTI have been catching up aggressively,
with a different strategy, since 2016. A new
milestone was achieved by SEMCO in 2018,
with the latest release of a FO Panel-Level
Packaging (PLP) APE-PMIC in the Samsung
Galaxy Smartwatch. Also, PTI had gone into
FOPLP production for MediaTek’s PMIC and
audio transceiver. Moving forward, investments
by manufacturers will be modest in the short
term and strong in the long term. Regardless,
a new high volume application is anticipated
to fuel another tremendous growth in the FO
packaging market space.
Based on new sales, made from incremental
production volumes, the equipment and
materials revenue for FO packaging is expected
to grow from >$200 M in 2018 to >$700 M in
2024 at >20% CAGR. With production players
slashing growth projections in 2019, suppliers
of FO packaging are now anticipating a smaller
Capital Expenditure (CapEx) investment in
2019. Nevertheless, equipment and materials
suppliers are well-positioned in the FO
packaging supply chain to gain business from
long-term growth. Megatrend-driven demands,
in the long run, are expected to provide
the impetus to push for an inflection in the
equipment and materials revenue from FO
packaging eventually.
In this report, the equipment and materials
market is sized based on processes that
reflect the characteristics and relevance of FO
packaging. These include carrier, debonding,
pick-and-place, molding compound deposition,
EQUIPMENT AND MATERIALS FOR FAN-OUT PACKAGING 2019
Market & Technology Report - September 2019
EQUIPMENT AND MATERIALS MARKET REVENUE FORECAST IN FAN-OUT
PACKAGING
Electronic packaging equipment and materials revenue growth is highly reliant on big players’
investments.A new killer application is needed to fuel robust growth.
(Yole Développement, September 2019)
Equipment and materials in Fan-Out packaging revenue forecast
KEY FEATURES
• Market forecasts
- Supplier revenue: equipment and
materials in Fan-Out packaging
- Supplier revenue: FOWLP vs FOPLP
• Market trends
- Market drivers and dynamics
- Analysis of FOWLP vs FOPLP
inflection points and player
strategies
• Market shares and supply chain
- Fan-out panel-level packaging
supply chain
- FOWLP market shares in 2018
• Technology trends
- Fan-out panel-level packaging
challenges
- Generic process flows and
approaches in Fan-Out packaging
• Market forecasts, market shares and
technology focus by process
- Carrier bonding and debonding
- Pick-and-place
- Molding compound deposition
- RDL: passivation, patterning,
barrier-seed layer, plating
- Metrology and inspections –
technology only
WHAT’S NEW
• New 3-page summary of report with
dashboards
• Updated market forecast of Fan-Out
production revenues (2018 to 2024)
• New market survey on Fan-Out
packaging popularity
• Updated production status of key
players
• Updated carrier penetration rate
comparison between FOWLP and
FOPLP
• New analysis of FOWLP vs FOPLP
• New suppliers identified in FOPLP
supply chain
• Updated equipment and materials
suppliers for both FOWLP and FOPLP
• New modelling of tool units between
FOWLP vs FOPLP
• Updated market forecast of
equipment and materials, volumes
and revenue (2018 to 2024)
• Updated market shares of equipment
and materials players (2016 to 2018)
• New market sizing for Cu RDL
plating, equipment and materials
• New MA timeline of FOPVD
suppliers
$0 M
$100 M
$200 M
$300 M
$400 M
$500 M
$600 M
$700 M
$800 M
2018 2019 2020 2021 2022 2023 2024
Equipment Materials
$200M
$700M
CAGR2018-2024:+20%

EQUIPMENT AND MATERIALS FOR FAN-OUT PACKAGING 2019
GLOBAL EQUIPMENT MARKET SHARE FOR FOWLP
FO packaging suppliers are grappling with two
conflicting motivations of cost reduction and
Return-on-Investment (ROI) justification. FOWLP
suppliers are worried about a cost-price war if
FOPLP is adopted and finally overloads the market
with supply. There will continue to be pressure
to make a strategic decision to invest in either
FOWLP or FOPLP because core FOWLP capacity
is showing signs of under-utilization. Coupled
with FOPLP penetration, the over-supply risk is
increasingly being recognized. Yet, there are strong
motivations to venture into FOPLP because end-
customers are demanding lower cost FO packages.
As such, some FO packaging suppliers are sitting
on the fence. In this divided environment, they
would rather gain less business with certainty than
embrace uncertainty that could involve losing on
larger investments.
FOWLP suppliers are unable to stop the
penetration of FOPLP suppliers despite the
volume of FO being relatively small compared to
the huge volume of printed circuit boards sold,
which enables panel-level manufacturing. This
forces FOWLP suppliers to focus on higher-end
challenges that FOPLP cannot achieve technically
in the near term. For example, TSMC’s supply
chain is expected to grow because of the extension
of HD FO applications.
A lower production penetration rate of FOPLP
is expected in 2019 even though more players
are involved compared to 2018. In 2019, FOPLP
suppliers are expected to expand slowly, with
more players adopting panel capabilities. Presently,
the volume is not big enough to justify further
investment in panel production, especially when
core FO is already experiencing under-utilization.
However, in the long run, the expansion of FOPLP
is expected to increase because new players
are driving a low-cost proposition into the FO
packaging market. Also, it has been proven
technically feasible by SEMCO and PTI. FOWLP
equipment is projected to drop by 12% from 2018
to 2024. On the other hand, FOWLP materials,
FOPLP equipment and FOPLP materials are all
expected to gain 4% each.
2018 FOWLP market shares – Equipment suppliers*
Equipment and materials revenue growth: FOWLP vs. FOPLP
FOPLP VS FOWLP UNFOLDS IN THE EQUIPMENT AND MATERIALS SUPPLIER
LANDSCAPE
Total $100 M
*Non exhaustive list of companies
The market shares and values are included in the report.
TAZMO
EV Group
ERS
SUSS Microtec
TOK
Besi
Shibaura
ASMPT
Toray
Others
APICYamada
Towa
Besi
ASM
Hamni
TEL
SUSS Microtec
EV Group
TAZMO
Others
Veeco (Ultratech)
SUSS Microtec
Rudolph
Canon
Others
KLA (SPTS)
Evatec
Ebara
ASM NEXX
LAM (Novellus)
Applied
Materials
DEBONDING
$13 M
PICK PLACE
$37 M
MOLDING
$12 M
COAT/DEVELOP
$14 M
LITHOGRAPHY
$14 M
PVD
$27 M
CU RDL PLATING
$24 M
0%
100%
2018
$200M
2024
$700M
Materials
30%
Equipment
61%
Materials
3%
Equipment
6%
Materials
34%
Equipment
49%
Materials
7%
Equipment
10%
CAGR 2018-2024
+20%
FOWLP FOPLP
ReDistribution Layer (RDL) passivation, RDL
patterning, RDL barrier-seed layers and RDL plating.
The equipment market value is significantly higher
than the materials market for FO packaging, with
the Average Selling Price (ASP) of equipment per
wafer generally higher than the ASP of materials per
wafer. Also, certain key processes do not need any
materials, for example pick-and-place. Moreover,
Yole Développement analysts cover equipment and
materials in more depth in the report.

COMPANIES CITED IN THE REPORT
3D-Plus, 3M, A*Star, AG, AGC, Akrometrix, Amicra, Amkor, Analog, Apple, Applied Materials, ASE,
ASM, Atotech, Aurora semiconductors, Besi, Bosch, Brewer Science, Broadcom, Camtek, Capcon,
ChipPAC, Corning, Deca, Denko, Devices, Dialog, Dupont, Ebara, Enthone, ERS, Evatec, EVG, Fico
Molding, Freescale, Fujifilm, Hanmi, HD Microsystems, Henkel, HiSilicon, Hitachi Chemical, Hoya,
Huatian, Huawei, Ibiden, IME, Infineon, Intel, ITRI, JCET Group, JSR, KulickeSoffa (KS), Lintec,
Mediatek, Medtronic, Merck, MicroTec, Mitsui, MLI, Nagase ChemteX, Nanium, Nanometrics,
NEG, Nepes, Nexx, NGK, Nissan Chemical, Nitto Denko, Nokia, Novellus, NXP, Oerlikon,
Orbotech, Plan Optik AG, Platform Specialty Products, PTI, Qualcomm, Rudolph, Samsung
Electronics, Schott, Science, Screen, SEMCO, SEMPRIUS, SEMSYSCO, SMEE, Shibaura, Shin-
Etsu, Shinkawa, Shinko Electric, Silicon, SPIL, SPTS, STATS, STATS ChipPAC, STMicroelectronics,
Sumitomo, SUSS MicroTec, Tazmo, Technic, TEL, TOK, Toray Chemical, Towa, TSMC, Ultratech,
ULVAC, Unimicron, UnitySC, Ushio, UTAC, Wacker, Yamada and more…
MARKET TECHNOLOGY REPORT

Report introduction 4
Context 63
Segmentation, report focus, definition
Fan-Out packaging introduction
Is Fan-Out packaging still popular?
Market forecasts 73
Market revenue: Fan-Out packaging
production
Supplier revenue: equipment and materials
in Fan-Out packaging
Supplier revenue: production investment
Supplier revenue: FOWLP vs FOPLP
Market trends 93
Market drivers and dynamics
Analysis of FOWLP vs FOPLP: inflection
points, player strategies
Market shares and supply chain 98
Overview of equipment and materials suppliers
Fan-Out Panel-Level packaging supply chain
FOWLP market share in 2018
Technology trends 102
Fan-Out Panel-Level packaging challenges
Generic process flows and approaches in
Fan-Out packaging
Market forecasts, market shares and
technology focus by process 140
Carrier bonding and debonding
- Materials: carriers
- Equipment: debonding tools
Pick-and-place
- Equipment: pick-and-place tools
Molding compound deposition
- Materials: molding compound
- Equipment: molding tools
RDL passivation
- Materials: RDL polymer
- Equipment: RDL polymer coat/develop tools
RDL patterning
- Materials: RDL photoresist
- Equipment: lithography tools
RDL barrier-seed layer
- Equipment: PVD tools
RDL plating
- Materials: Cu RDL plating chemistry
- Equipment: Cu RDL plating tools
Metrology inspections (technology only)
Conclusions 290
Yole Développement corporate
presentation 294
TABLE OF CONTENTS (complete content on i-Micronews.com)
• Fan-Out Packaging: Technologies and
Market Trends 2019
• Status of Advanced Substrates 2019
• Status of the Advanced Packaging Industry
2019
• Advanced packaging technology in the
Apple Watch Series 4’s System-in-Package
Find all our reports on www.i-micronews.com
RELATED REPORTS
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AUTHOR
Favier Shoo is a Technology and Market
Analyst in the Semiconductor Software
division at Yole Développement, part of Yole
Group of Companies. Based in Singapore,
Favier is engaged in the development of
technology market reports as well as
the production of custom consulting. After
spending 7 years at Applied Materials as
a Customer-Application-Technologist in
advanced packaging marketspace, Favier
had developed a deep understanding of
the supply chain and core business values.
Being knowledgeable in this field, Favier had
given trainings and held numerous technical
review sessions with industry players. In
addition, he had obtained 2 patents. Prior
to that, Favier had worked at REC Solar
as a Manufacturing Engineer to maximize
production capacity. Favier holds a Bachelor
in Materials Engineering (Hons) and a
Minor in Entrepreneurship from Nanyang
Technological University (NTU) (Singapore).
Favier was also the co-founder of a startup
company where he formulated business
goals, revenue models and marketing plans.
Due to the lack of a substantial market for
FOPLP, only market shares of FOWLP are
analyzedinthisreport.Equipmentandmaterials
market shares are analyzed for both sectors
in full in the report. In this flyer, however
we are focused on equipment suppliers. The
market revenue from each process varies.
Apart from the ASP differences, asset value
depreciation, High Volume Manufacturing
(HVM) throughput and number of process
passes are crucial to a tool’s unit production
volumes. Suppliers understand that they need
to be resource-efficient and resilient to the
effects of the cyclical nature of this industry.
Hence, equipment suppliers are not passive
in supporting FO packaging developments
and production. In fact, competition is strong
because suppliers are trying to establish their
products as the Development-Tool-Of-Record
(DTOR) for the new FO packaging fabs or
production lines. In 2018, the global equipment
market for key processes is worth $100 M.
The first-ranked company in 2018 for market
share for FO packaging tools for the RDL
barrier-seed layer process was Physical Vapor
Deposition (PVD) equipment supplier SPTS,
a subsidiary of KLA, with a 90% share of the
market.
REPORT OBJECTIVES
• Describe technologies that can be
classified as “fan-out packaging”
• Identify and detail the fan-out
packaging platform’s key process
steps
• Analyze the manufacturing chain for
fan-out technologies
• Pinpoint the equipment and
materials suppliers for key process
steps
• For these steps, provide a market
forecast for the coming years and an
prediction of future trends
• Elaborate on key market drivers,
benefits, and challenges for
equipment and materials in fan-out
packages

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44
OUR 2019 REPORTS COLLECTION (1/4)
18 fields of excellence combined with six markets to provide a complete picture of your industry landscape
Market –Technology – Strategy – byYole Développement
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• Telecom Infrastructure
• Defense Aerospace
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45
MEMS SENSORS
o MARKET ANDTECHNOLOGY REPORT
• Status of the MEMS Industry 2019 - Update
• Status of the Audio Industry 2019 - New
• Uncooled Infrared Imagers and Detectors 2019 – Update
• Consumer Biometrics:Technologies and MarketTrends 2018
• MEMS Pressure Sensor Market and Technologies 2018
• Gas Particle Sensors 2018
o STRUCTURE, PROCESS COST REPORT
• MEMS Sensors Comparison 2019
• MEMS Pressure Sensor Comparison 2018
• Particle Sensors Comparison 2019
• Miniaturized Gas Sensors Comparison 2018
o PATENT REPORT
• MEMS Foundry Business Portfolio 2019 - New
• Miniaturized Gas Sensors 2019 - New
PHOTONIC AND OPTOELECTRONICS
• Silicon Photonics and Photonic Integrated Circuits 2019
• LiDARs for Automotive and Industrial Applications 2019 - Update
o PATENT REPORT
• Silicon Photonics for Data Centers: Optical Transceiver 2019 - New
• LiDAR for Automotive 2018
RF DEVICES ANDTECHNOLOGIES
• RF GaN Market:Applications, Players,Technology,
and Substrates 2019 - Update
• 5G’s Impact on RF Front-End Module and Connectivity
for Cell Phones 2019 – Update
• 5G Impact on Telecom Infrastructure 2019 - New
• Radar and Wireless for Automotive: Market and Technology
Trends 2019 - Update
• Passive Active Antenna Systems for Telecom
Infrastructure 2019 - New
• RF Standards and Technologies for Connected Objects 2018
• RF Front-End Module Comparison 2019 - Update
• Automotive Radar RF Chipset Comparison 2018
o PATENT REPORT
• Antenna for 5G Wireless Communications 2019 - New
• RF Front End Modules for Cellphones 2018
• RF Filter for 5G Wireless Communications: Materials and Technologies 2019
• RF GaN 2019 – Patent Landscape Analysis
Update : 2018 version still available About Yole Développement | www.yole.fr | ©2019

46
IMAGING
• Status of the CIS Industry 2019:Technology
and Foundry Business - Update
• Imaging for Automotive 2019 - Update
• NeuromorphicTechnologies for Sensing 2019 - Update
• Status of the CCM and WLO Industry 2019 – Update
• 3D Imaging Sensing 2018
• MachineVision for Industry and Automation 2018
• Sensors for RoboticVehicles 2018
• Compact Camera Modules Comparison 2019
• CMOS Image Sensors Comparison 2019
o PATENT REPORT
• Facial Gesture Recognition Technlogies in Mobile Devices 2019 - New
• Apple iPhone X Proximity Sensor Flood Illuminator 2018
MEDICAL IMAGING AND BIOPHOTONICS
• X-Ray Detectors for Medical, Industrial
and Security Applications 2019- New
• Microscopy Life Science Cameras: Market and Technology Analysis 2019
• Ultrasound technologies for Medical, Industrial
and Consumer Applications 2018
o PATENT REPORT
• Optical Coherence Tomography Medical Imaging 2018
MICROFLUIDICS
• Status of the Microfluidics Industry 2019 - Update
• Next Generation Sequencing DNA Synthesis - Technology,
Consumables Manufacturing and MarketTrends 2019 - New
• Organ-on-a-Chip Market Technology Landscape 2019 - Update
• Point-of-Need Testing Application of MicrofluidicTechnologies 2018
• Liquid Biopsy: from Isolation to Downstream Applications 2018
• Chinese Microfluidics Industry 2018
o PATENT REPORT
• Microfluidic ManufacturingTechnologies 2019 – New
• Nanopore Sequencing 2019 - New
INKJET AND ACCURATE DISPENSING
• Inkjet Printheads - Dispensing Technologies
Market Landscape 2019 - Update
• Emerging Printing Technologies
for Microsystem Manufacturing 2019 - New
• Piezoelectric Devices from Bulk to Thin Film 2019 - New
• Inkjet Functional and Additive Manufacturing for Electronics 2018
• Piezoelectric Materials from Bulk to Thin Film Comparison 2019

47
BIOMEMS MEDICAL MICROSYSTEMS
• Medical Wearables: Market Technology Analysis 2019 - New
• Neurotechnologies and Brain Computer Interface 2018
• BioMEMS Non-Invasive Sensors: Microsystems for Life Sciences
Healthcare 2018
o PATENT REPORT
• 3D Cell Printing 2019 - New
• CirculatingTumor Cells Isolation 2019 - New
SOFTWARE AND COMPUTING
• Artificial Intelligence Computing For Automotive 2019 - New
• Hardware and Software for Artificial Intelligence (AI)
in Consumer Applications 2019 - Update
• Image Signal Processor andVision Processor Market
and Technology Trends 2019
• xPU (Processing Units) for Cryptocurrency, Blockchain, HPC
and Gaming 2019 – New
• Artificial Intelligence for Medical Imaging 2019 - New
o PATENT REPORT
• Artificial Intelligence for Medical Diagnostics - New
MEMORY
• Status of the Memory Industry 2019 - New
• MRAM Technology and Business 2019 - New
• Emerging NonVolatile Memory 2018
• Memory Comparison 2019
o PATENT REPORT
• Magnetoresistive Random-Access Memory (MRAM) 2019 - New
• 3D Non-Volatile Memory 2018
ADVANCED PACKAGING
• Fan Out PackagingTechnologies and MarketTrends 2019 - Update
• 3D TSV Integration and Monolithic Business Update 2019 - Update
• Advanced RF SiP for Cellphones 2019 - Update
• Status of the Advanced Packaging Industry 2019 - Update
• Status of the Advanced Substrates 2019 - Update
• Panel Level PackagingTrends 2019 - Update
• Automotive Packaging Market Technology Trends 2019 - New
• Trends in Automotive Packaging 2018
• Thin-Film Integrated Passive Devices 2018
• Advanced RF SiP for Cellphones Comparison 2019

48
SEMICONDUCTOR MANUFACTURING
• Nano-Imprint Technology Trends for Semiconductor
Applications 2019 - New
• Equipment and Materials for Fan Out Packaging 2019 - Update
• Equipment for More than Moore:Thin Film Deposition
Etching 2019 - New
• Wafer Starts for More Than Moore Applications 2018
• Polymeric Materials atWafer-Level
for Advanced Packaging 2018
• Bonding and Lithography Equipment Market
for More than Moore Devices 2018
• Wafer Bonding Comparison 2018
o PATENT REPORT
• Hybrid Bonding for 3D Stack 2019 – New
BIOTECHNOLOGIES
• CRISPR-Cas9 Technology: From Lab to Industries 2018
o PATENT REPORT
• Personalized Medicine 2019 – New
SOLID STATE LIGHTING
• Status of the Solid State Light Source Industry 2019 - New
• Edge Emitting Lasers (EELS) 2019 - New
• Light Shaping Technologies 2019 - New
• Automotive Advanced Front Lighting Systems 2019 - New
• VCSELs – Market and Technology Trends 2019 - Update
• IR LEDs and Laser Diodes – Technology,Applications,
and Industry Trends 2018
• Automotive Lighting 2018:Technology, Industry and MarketTrends
• UV LEDs - Technology, Manufacturing and ApplicationTrends 2018
• LiFi:Technology, Industry and MarketTrends 2018
• VCSEL Comparison 2019
o PATENT REPORT
• VCSELs 2018
DISPLAY
• Next Generation 3D Displays 2019 - New
• Next Generation Human Machine Interaction (HMI)in Displays 2019 - New
• Micro-and Mini-LED Displays 2019 - Update
• Next Generation TV Panels: New Technologies, Features and
Market Impact 2019
• Displays OpticalVision Systems forVR,AR MR 2018
o PATENT REPORT
• MicroLED Displays : Intellectual Property Landscape 2018

49
POWER ELECTRONICS
• Power SiC: Materials, Devices and Applications 2019 - Update
• Power Electronics for EV/HEV and e-mobility:
Market, Innovations and Trends 2019 - Update
• Status of the Power Electronics Industry 2019 - Update
• Discrete Power Packaging : Material Market
and Technology Trends 2019 - New
• Status of the Power ICs Industry 2019 - Update
• Status of the Passive Components for the Power Electronics
Industry 2019 - Update
• Status of the Inverter Industry 2019 - Update
• Status of the Power Module Packaging Industry 2019 - Update
• Wireless Charging Market Expectations
and Technology Trends 2018
• Power GaN 2018: Epitaxy, Devices,Applications
and Technology Trends
• Automotive Power Module Packaging Comparison 2018
• GaN-on-Silicon Transistor Comparison 2019
• SiC Transistor Comparison 2019
o PATENT REPORT
• Power SiC : Materials, Devices and Modules 2019 - New
• Power GaN : Materials, Devices and Modules 2019 – Update
BATTERY ENERGY MANAGEMENT
• Status of the Rechargeable Li-ion Battery Industry 2019 - New
• Li-ion Battery Packs for Automotive and Stationary Storage
Applications 2019 - Update
o PATENT REPORT
• Battery Energy Density Increase: Materials
and EmergingTechnologies 2019 - New
• Solid-State Batteries 2019 - New
• Status of the Battery Patents 2018
COMPOUND SEMI.
• Emerging Semiconductor Substrates:
Market Technology Trends 2019- New
• Status of the Compound Semiconductor Industry 2019 - New
• InP Materials, Devices and Applications 2019 - New
• GaAsWafer and Epiwafer Market: RF, Photonics,
LED and PV Applications 2018
o PATENT REPORT
• GaN-on-Silicon Substrate: Materials, Devices
and Applications 2019 - Update

50
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MARKET MONITOR byYole Développement
A FULL PACKAGE:
The monitors will provide the evolution of the market in units, wafer area and revenues.
They will also offer insights into what is driving the business and a close look at what is
happening will also be covered in it.
The following deliverables will be included in the monitors:
• An Excel database with all historical and forecast data
• A PDF slide deck with graphs and comments/analyses covering the expected
evolutions
o ADVANCED PACKAGING – NEW
This monitor will provide the evolution of the advanced packaging platforms. It will
cover Fan-Out Wafer Level Packaging (WLP), Fan-Out Panel Level Packaging (PLP),
Wafer-Level Chip Scale Packaging (WLCSP), Flip Chip packaging platforms, and 2.5D
and 3D Through Silicon Via (TSV) integration. Frequency: Quarterly, starting from Q3
2019
o COMPOUND SEMI. – NEW
This monitor will describe how the compound semiconductor industry is evolving. It
will offer a close look at GaAs, InP, SiC, GaN and other compounds of interest
providing wafer volumes, revenues, application breakdowns and momentum.
Frequency: Quarterly, starting from Q3 2019
o CAMERA MODULE – NEW
This monitor will provide the evolution of the imaging industry, with a close look at
image sensor, camera module, lens and VCM. Volumes, revenues and momentum of
companies like Sony, Samsung, Omnivision and OnSemi will thus be analysed.
Frequency: Quarterly, starting from Q3 2019
o MEMORY – UPDATE
For the memory industry you can have access to a quaterly monitor, as well as an
additional service, a monthly pricing. Both services can be bought seprately:
• DRAM Service: Including a quarterly monitor and monthly pricing.
• NAND Service: Including a quarterly monitor and monthly pricing.
REVERSETECHNOLOGY MONITOR by System Plus Consulting
o SMARTPHONES – NEW
To stay updated on the latest components, packaging and silicon chip choices of the smartphone makers, System Plus Consulting has created its first Smartphone Reverse
Technology monitor. This year, get access to the packaging and silicon content database of at least 20 different flagship smartphones – more than five per quarter. Starting at the
beginning of 2019, the monitor will include an Excel database report for each phone and a quarterly comparison.

51
OUR 2019 MONITORS COLLECTION (2/2)
Get the most updated overview of your market to monitor your strategy
PATENT MONITOR by KnowMade
A FULL PACKAGE:
Starting at the beginning of the year, the KnowMade monitors include the following
deliverables:
• An Excel file including the monthly IP database of:
• New patent applications
• Newly granted patents
• Expired or abandoned patents
• Transfer of IP rights through re-assignment and licensing
• Patent litigation and opposition
• Quarterly report including a PDF slide deck with the key facts figures of the
quarter: IP trends over the three last months, with a close look to key IP players and
key patented technologies.
o GaN for Power RF Electronics
Wafers and epiwafers, GaN-on-SiC, silicon, sapphire or diamond, semiconductor
devices such as transistors, and diodes, devices and applications including converters,
rectifiers, switches, amplifiers, filters, and Monolothic Microwave Integrated Circuits
(MMICs), packaging, modules and systems.
o GaN for Optoelectronics Photonics
Wafers and epiwafers, GaN-on-sapphire, SiC or silicon; semiconductor devices such
as LEDs and lasers; and applications including lighting, display, visible communication,
photonics, packaging, modules and systems.
o Li-ion Batteries
Anodes made of lithium metal, silicon, and lithium titanate (LTO); cathodes made of
Lithium Iron Phosphate (LFP), Nickel-Manganese-Cobalt (NMC), Lithium Nickel
Cobalt Aluminium Oxide (NCA), Lithium Nickel Metal Dioxide (LiNiMO2), Lithium
Metal Phosphate (LiMPO4), and Lithium Metal Tetroxide (LiMO4); electrolytes
including liquid, polymer/gel, and solid inorganics; ceramic and other separators;
battery cells including thin film/microbattery, flexible, cylindrical and prismatic; and
battery packs and systems.
o Post Li-ion Batteries
Battery technologies including redox-flow batteries, sodium-ion, lithiumsulfur, lithium-
air, and magnesium-ion, and their supply chains, including electrodes, electrolytes,
battery cells and battery packs/systems.
o Solid-State Batteries
Supply chain including electrodes, battery cells, battery packs/systems and
electrolytes, including polymer, inorganic and inorganic/polymer, inorganic materials,
including argyrodites, LIthium Super Ionic CONductor, (LISICONs), Thio-LISICONs,
sulfide glasses, oxide glasses, perovskites, anti-perovskites and garnets.
o RF Acoustic Wave Filters
Including Surface Acoustic Wave (SAW), Temperature Compensated (TC)- SAW, Bulk
Acoustic Wave- Free-standing Bulk Acoustic Resonator (BAWFBAR), BAW-Solidly-
Mounted Resonator (BAW-SMR), and Packaging.
o RF Power Amplifiers
Including Low Noise Amplifiers, Doherty Amplifiers, Packaging, and Millimeter-Wave
technology.
o RF Front-End Modules
o Microfluidics
From components to chips and systems, including all applications.

52
I-MICRONEWS MEDIA
To meet the growing demand for market,
technological and business information,
i-Micronews Media integrates several tools
able to reach each individual contact within its
network.
We will ensure your company benefits from
this
ONLINE ONSITE INPERSON
i-Micronews e-newsletter
i-Micronews.com
FreeFullPDF.com
Events Webcasts
Unique, cost-effective ways
to reach global audiences.
Online display advertising
campaigns are great strategies
for improving your
product/brand visibility.They
are also an efficient way to
adapt with the demands of the
times and to evolve an effective
marketing plan and strategy.
Brand visibility, networking
opportunities
Today's technology makes it
easy for us to communicate
regularly, quickly, and
inexpensively – but when
understanding each other is
critical, there is no substitute
for meeting in-person. Events
are the best way to exchange
ideas with your customers,
partners, prospects while
increasing your brand/product
visibility.
Targeted audience
involvement equals clear,
concise perception of your
company’s message.
Webcasts are a smart,
innovative way of
communicating to a wider
targeted audience.Webcasts
create very useful, dynamic
reference material for
attendees and also for
absentees, thanks to the
recording technology.
#15,800+ monthly unique visitors
on i-Micronews.com
#10,900+ weekly readers
of i-Micronews e-newsletter
#110 attendees on average
#7+ key events planned for 2019
on different topics
#380 registrants per webcast on
average to gain new leads for
your business
Contact: CamilleVeyrier (veyrier@yole.fr), Marketing Communication Director

53
CONTACT INFORMATION
o CONSULTING AND SPECIFICANALYSIS, REPORT BUSINESS
• North America:
• Steve LaFerriere, Senior Sales Director forWestern US Canada
Email: laferriere@yole.fr – + 1 310 600-8267
• ChrisYouman, Senior Sales Director for Eastern US Canada
Email: chris.youman@yole.fr – +1 919 607 9839
• Japan Rest of Asia:
• Takashi Onozawa, General Manager,Asia Business Development
(India ROA)
Email: onozawa@yole.fr - +81 34405-9204
• Miho Ohtake, Account Manager (Japan)
Email: ohtake@yole.fr - +81 3 4405 9204
• Itsuyo Oshiba, Account Manager (Japan Singapore)
Email: oshiba@yole.fr - +81-80-3577-3042
• Korea: Peter Ok, Business Development Director
Email: peter.ok@yole.fr - +82 10 4089 0233
• Greater China: Mavis Wang, Director of Greater China Business
Development
Email: wang@yole.fr - +886 979 336 809
• Europe: Lizzie Levenez, EMEA Business Development Manager
Email: levenez@yole.fr - +49 15 123 544 182
• RoW: Jean-Christophe Eloy, CEO President,Yole Développement
Email eloy@yole.fr - +33 4 72 83 01 80
o FINANCIAL SERVICES (in partnership withWoodside Capital
Partners)
• Jean-Christophe Eloy, CEO President
Email: eloy@yole.fr - +33 4 72 83 01 80
• Ivan Donaldson,VP of Financial Market Development
Email: ivan.donaldson@yole.fr - +1 208 850 3914
o CUSTOM PROJECT SERVICES
• Jérome Azémar,Technical Project Development Director
Email: azemar@yole.fr - +33 6 27 68 69 33
o GENERAL
• CamilleVeyrier, Director, Marketing Communication
Email: veyrier@yole.fr - +33 472 83 01 01
• Sandrine Leroy, Director, Public Relations
Email: leroy@yole.fr - +33 4 72 83 01 89 / +33 6 33 11 61 55
• Email: info@yole.fr - +33 4 72 83 01 80
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