Inverter Technology Trends and Market Expectations 2016 Report by Yole Developpement

May © 2016
From Technologies to Market
Inverter
Technology
Trends & Market
Expectations
2016
Sample

2
REPORT OBJECTIVES
This report’s objectives are to:
• Explore the market for inverters and their components
• Understand the market dynamics for related power electronics applications
• Identify the key drivers that will shape the market in the future
• Understand the main technology and market trends
• Have a clear overview of competitive landscape and regional characteristics
©2016 | www.yole.fr | Inverter Technology Trends & Market Expectations 2016 | Sample

3
REPORT METHODOLOGY
Market segmentation methodology
Market forecast methodology

4
REPORT METHODOLOGY
Technology analysis methodology Information collection

5
• Report Objectives 4
• What is in this report 5
• Glossary 8
• Executive Summary 9
• Power Electronics: Basic Concepts 36
Why the inverter is so important? 44
• PE Market 2015 - 2021 47
Device market 51
Inverter market 54
• PE application overview 60
Electric & hybrid vehicles 62
Architecture 65
Towards more integration 69
WBG penetration 85
Market 89
Supply chain 90
Wind turbines 95
Architectures 100
Power devices 109
Market 114
Market shares 119
Focus on China 123
Photovoltaic inverters 126
Architectures 131
Power devices 140
PV inverter manufacturers 147
Market 153
Rail 156
Architectures 159
SiC implementation 164
Market share 169
Market 170
Uninterruptible power supplies 176
Architecture 179
WBG integration 183
Market 189
Focus data centers 190
Industrial motor drives 194
Low voltage motor drives 202
Medium voltage motor drives 203
Market 207
Market share 208
TABLE OF CONTENTS
Part 1/2

6
TABLE OF CONTENTS
Part 2/2
• Inverter’s technological evolution 215
Priorities per application 218
Power density 221
Architecture trends 226
WBG 230
High temperature 235
Software vs. hardware 239
Power stack 242
• Players landscape 248
• Conclusion 261
• Yole Presentation 264

7
INVERTER MARKET FORECAST
2015-2021
The business
is dominated
by industrial
motor drives
and UPS.

8
MARKET SPLIT PER POWER RANGE
In 2015
How the
inverter
market is
split by
power range
in each
application?
EV/HEV PV inverter Wind turbine Rail Motor drivesUPS

9
TOWARDS MORE INTEGRATION
Converters co-integration
• XXX
• XXX
• XXX
•Improved cooling
•Higher power density
•Mechatronic improvement
Double sided cooling
1-in-1 power modules
Co-integration motor + inverter:
• XXX
• XXX
Main evolutions in power electronics:
In-wheel motor + inverter
integration
Towards
system
integration
6-in-1 power modules
All-in-1 power modules
Coming technologies?
Widely used 6-in1
power modules

10
GEOGRAPHICALTRENDS
Wind power evolution by region

11
AVERAGE INVERTER PRICE
How inverter prices have gone down
Microinverters
are much more
expensive than
these average
values, while
central
inverters are
cheaper per
$/W.

12
SIC IMPLEMENTATION IN RAIL TRACTION
Full SiC
converters are
being already used
from metros (in
Tokyo) to HSRs,
as it is the case for
the Shinkasen
bullet train, which
is testing full-SiC
converters.
Current
Prototype
Market

13
MARKET SHARES
Main train manufactures
Almost all main
train
manufacturers
are developing
their own
traction power
converters.

14
PRIORITIES PER APPLICATION
Which is(are) the main driver(s) per application?
Different
drivers,
different
priorities,
different
technical
evolutions
EV/HEV,
aeronautics &
rail are
specially
looking for
power
density

15
ARCHITECTURE TRENDS
Power density
NPC
topology
shows lower
power
densities,
that is why it
is not used
for EV or
aircrafts.

16
OFF-THE-SHELF POWER STACK MARKET
Market shares
The power
stack market
is estimated
at $XX.

17
INTER-APPLICATION POSITIONING
In which markets are companies positioned?
Many players are
trying to be
positioned in he
automotive
industry, as this
market is
expected to
boom in the next
couple of years.
New in this market
Got out of the market
Acquired
Not exhaustive list

18
EVERYYEAR,YOLE DÉVELOPPEMENT ATTENDS MAIN EVENTS. MEET WITH US AT*:
• NEPCON Japan
January 13-15, 2016 – Tokyo, Japan
• CS International
March 1-2, 2016 – Brussels, Belgium
• Image Sensors
March 15-17, 2016 – London, UK
• International Conference and Exhibition on
Device Packaging
March 15-17, 2016 – Fountain Hills, USA
• Lab-on-a-Chip European Congress
March 15-16, 2016 – Madrid, Spain
• APEC
March 20-24, 2016 – Long Beach, USA
• PCIM Europe
May 10-12, 2016 – Nuremberg, Germany
• ECTC
May 31-June 3, 2016 – LasVegas, USA
• Sensors Expo & Conf
June 21-23, 2016 – San José, USA
• SEMICON West
July 12-15, 2016 – San Francisco, USA
• LED Professional Symposium – LpS
September 20-23, 2016 – Bregenz,Austria
• SEMICON Europa
October 25-27, 2016 – Grenoble, France
• SEMICON Japan
December 14-16, 2016 – Tokyo, Japan
*Non exhaustive list

19
Biographies & contacts
ABOUT THE AUTHORS
Mattin GRAOTXAPARTEGI
Mattin Grao Txapartegi is a Power Electronics Analyst at Yole Développement. He is in charge of inverter architecture evolutions
and passive components (from capacitors to protection devices). Previously, he has been working as an intern at the French car
maker Renault, designing power converters for electric car chargers. He graduated from Grenoble INP with an Engineering
degree in Electrical Systems, followed by a specialization in embedded systems for transportation. He then earned an advanced
master’s degree in Aeronautics Engineering from Arts et Métiers ParisTech. During this time, he oversaw managerial, financial, and
marketing fields within the aeronautics industry.
Mail: grao@yole.fr
Pierric GUEGUEN
Dr Pierric Gueguen is Business Unit Manager for power electronics and compound semiconductor activities at Yole
Développement. He has a PhD in micro- and nanoelectronics and a master’s degree in micro- and nanotechnologies for
integrated circuits. He worked as a PhD student at CEA-Leti in the field of 3D integration for integrated circuits and advanced
packaging. He then joined Renault SAS, and worked for 4 years as technical project manager in the company’s R&D division.
During this time, he oversaw power electronic converters and integration of wide band gap devices in electric vehicles. He is
author and co-author of more than 20 technical papers and 15 patents.
Mail: gueguen@yole.fr

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Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media in addition to
corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing (technology or process), Yole Développement
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21
MEMS
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LED
Compound
Semi.
Imaging Photonics
MedTech
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Electronics
FIELDS OF EXPERTISE
Yole Développement’s 30 analysts operate in the following areas
©2016 | www.yole.fr | About Yole Développement

22
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www.yole.fr
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analysis
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• Events
www.i-Micronews.com

23
A GROUP OF COMPANIES
Market,
technology and
strategy
consulting
www.yole.fr
MA operations
Due diligences
www.yolefinance.com
Innovation and business maker
www.bmorpho.com
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
IP analysis
Patent assessment
www.knowmade.fr

24
OUR 2016 REPORTS PLANNING
o MEMS SENSORS
− Gas Sensors and Combos 2016
− Status of the MEMS Industry 2016*
− Sensors for Cellphones and Tablets 2016
− Market and Technology Trends of Inkjet Printheads: Towards New Printing Opportunities
2016…
− Sensors for Biometry and Recognition 2016
− Finger Print Sensors Market and Technologies 2016
− 3D Imaging Sensing 2016**
− Silicon Photonics 2016
− Emerging Non Volatile Memories 2016*
o IMAGING OPTOELECTRONICS
− Status of the CMOS Image Sensor Industry 2016*
− Uncooled Infrared Imaging Technology Market Trends 2016*
− Imaging Technologies for Automotive 2016
− Sensors for Drones Consumer Robots 2016
− 3D Imaging Sensing 2016**
− Silicon Photonics 2016
o MEDTECH
− BioMEMS 2016
− Point of Need Testing 2016: Application of Microfluidic Technologies
o ADVANCED PACKAGING
− FanOut WLP: Technology Trends and Business Update 2016*
− Embedded Die Packaging: Technology and Markets Trends 2016*
− 2.5D 3D IC Business Update 2016
− Status of the Advanced Packaging Industry 2016*
− Advanced Packaging in Emerging Markets: China 2016
− Supply Chain Readiness for Panel Manufacturing in Packaging 2016
o MANUFACTURING
− Inspection and Metrology Technology and Applications Trends in Advanced Packaging 2016**
− Equipment and Materials for Fan Out Technology (Wafer vs Panel)
− Equipment and Materials for Advanced Substrates
− Equipment and Materials for 3D T(X)V Technology
− Thinning Dicing Equipment for Advanced Packaging, MEMS, Photovoltaics, LED, CMOS 2016
o COMPOUND SEMICONDUCTORS
− SiC Modules, Devices and Substrates for Power Electronics 2016*
− GaN Modules, Devices and Substrates for Power Electronics 2016*
− Sapphire Applications Market 2016: from LED to Consumer Electronics*
− RF GaN Technology and Market Analysis 2016
o LED
− Sapphire Applications and Market 2016: From LED to Consumer Electronics*
− LED Packaging 2016
− Microdisplays and MicroLEDs
− UV LED Technology, Manufacturing and Applications Trends 2016*
− OLED for Lighting 2016
− LED in Automotive Lighting 2016
o POWER ELECTRONICS
− Power Electronics in Electric and Hybrid Vehicles 2016
− Status of Power Electronics Industry 2016*
− Passive Components Technologies and Market Trends for Power Electronics 2016
− SiC Modules, Devices and Substrates for Power Electronics 2016*
− GaN Modules, Devices and Substrates for Power Electronics 2016*
− Inverter Technologies Trends Market Expectations 2016
− Power Electronics for Renewable Energy 2016
− Thermal Management for LED and Power 2016
− RF GaN Technology and Market Analysis 2016
o BATTERY
− Market Trends and Technologies in Battery Pack and Assembly 2016
− Innovative and Emerging Technologies in Energy Storage Market 2016
**To be confirmed
Patent Analysis by Knowmade and Teardown Reverse Costing by System Plus Consulting are available on
www.i-micronews.com

25
OUR 2015 PUBLISHED REPORTS LIST
o MEMS SENSORS
− Sensors and Data Management for Autonomous Vehicles
− Sensors for Wearable Electronics And Mobile Healthcare
− Status of the MEMS Industry
− Uncooled Infrared Imaging Technology Market Trends
− Infrared Detector Technology Market Trends
− High-End Gyroscopes, Accelerometers and IMUs for Defense, Aerospace Industrial
− Emerging Non Volatile Memory (NVM) Technology Market Trends
o IMAGING OPTOELECTRONICS
− Camera Module Industry
− Uncooled Infrared Imaging Technology Market Trends
− Status of the CMOS Image Sensors
− Infrared Detector Technology Market Trends
o MEDTECH
− Sample Preparation Automation Through Emerging Microfluidic Technologies
− 2015 Microfluidic Applications in the Pharmaceutical, Life Sciences, In-Vitro Diagnostic, and
Medical Device Markets
− Sensors for Wearable Electronics And Mobile Healthcare
o COMPOUND SEMICONDUCTORS
− Sapphire Applications Market 2015: from LED to Consumer Electronics
− SiC, GaN, and other Wide Band Gap (WBG) materials for power electronics applications
− GaN and SiC Devices for Power Electronics Applications
o LED
− LED Lighting Module Technology, Industry and Market Trends 2015
− UV LED - Technology, Manufacturing and Application Trends
− Phosphors Quantum Dots 2015: LED Downconverters for Lighting Displays
− Sapphire Applications Market 2015: from LED to Consumer Electronics
o POWER ELECTRONICS
− Power Packaging Technology Trends and Market Expectations
− Energy Management for Smart Grid, Cities and Buildings: Opportunities for Battery
Electricity Storage Solutions
− Status of Chinese Power Electronics Industry
− New Technologies and Architectures for Efficient Data Center
− IGBT Market and Technology Trends
− Status of Power Electronics Industry
− SiC, GaN, and other Wide Band Gap (WBG) materials for power electronics applications
− GaN and SiC Devices for Power Electronics Applications
o ADVANCED PACKAGING
− Status of the Advanced Packaging Industry
− Supply Chain Readiness for Panel Manufacturing in Packaging
− Fan-in Wafer Level Packaging: Market and Technology Trends
− Flip Chip: Technologies and Markets Trends
− Fan-Out and Embedded Die: Technologies Market Trends
o MANUFACTURING
− Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED
Applications
− Emerging Non Volatile Memory (NVM) Technology Market Trends
Patent Analysis by Knowmade and Teardown Reverse Costing by System Plus Consulting are
available on www.i-micronews.com

26
CONTACT INFORMATION
Follow us on
• Consulting and Specific Analysis
• North America: Steve LaFerriere, Director of Northern America Business Development
Email: laferriere@yole.fr
• Japan Asia:Takashi Onozawa, Representative Director,Yole KK
Email: onozawa@yole.fr
• RoW: Jean-Christophe Eloy, CEO President,Yole Développement
Email eloy@yole.fr
• Report business
• North America: Steve LaFerriere, Director of Northern America Business Development
Email: laferriere@yole.fr
• Europe: Lizzie Levenez, EMEA Business Development Manager
Email: llevenez@systemplus.fr
• Japan Asia:Takashi Onozawa, Representative Director,Yole KK.
Email: onozawa@yole.fr
• Korea: HaileyYang, Business Development Manager, Korean Office
Email: yang@yole.fr
• Taiwan: Mavis Wang, Business Development Director
Email: wang@yole.fr
• Financial services
• Jean-Christophe Eloy, CEO President
Email: eloy@yole.fr
• General
• Email: info@yole.fr

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