This presentation contains about the integrated circuits evolution and basics of its fabrication process.

4. INTEGRATED CIRCUIT: Integrated circuit is a microscopic array of electronic circuits and components that are diffused or implanted onto the surface of a single crystal, or chip, of semiconducting material such as silicon.

9. The number of transistors in an IC doubles for every 18 months.

12. System-on-a-Chip (SOC) All the components needed for a system are included on a single chip. Three Dimensional Integrated Circuit (3D-IC) It has two or more layers of active electronic components. Wafer-scale integration (WSI) It uses an entire silicon wafer to produce a single "super-chip".

16. The construction & design plans for the chip are prepared on a computer-aided drafting machine

18. From the construction plans image is made into a mask.

22. Dry Etch, PR strip, or clean Rinse

24. A covering film of protective material is put on top of the insulating silicon dioxide.

25. UV-light is shown through a mask and onto the chip.

26. The wafer is developed, rinsed and baked.

27. The wafer is treated with chemicals in a process called "etching."

28. Horizontal Furnace Center Zone Flat Zone Distance Temperature Heating Coils Quartz Tube Gas flow Wafers

29. Silicon substrate Diffusion of reactants

30. Metal is added to connect the components to each other in a process called metallization.

31. Photoresist application Imparting patterns Development

32. Etching removes the metal not protected by photo resist. This leaves a pattern of metal that is the same as the one described by the mask. Formation of multiple layers

33. When the final layer of connecting metal wires have been added, the chips on the silicon wafer are tested.

34. The chips on the wafer are separated with a diamond saw to form individual integrated circuits.

35. Finally, each chip is packed into the protective casing and subjected to another series of tests.