Samsung Analyst Day 2013: S.LSI Namsung Woo Samsung System LSI Business

1. Samsung System LSI Business
NS (Stephen) Woo, Ph.D.
President & GM of System LSI
Samsung Electronics
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2. Disclaimer
The materials in this report include forward-looking statements which can generally be identified by phrases such as Samsung
Electronics (SEC) or its management "believes," "expects," "anticipates," "foresees," "forecasts," "estimates" or other words or
phrases of similar implications. Similarly, such statements that describe the company's business strategy, outlook, objectives,
plans, intentions or goals are also forward-looking statements. All such statements are subject to certain risks and uncertainties
that could cause actual results to differ materially from those in the presentation files above.
For us, particular uncertainties which could adversely or positively affect our future results include:
· The behavior of financial markets including fluctuations in exchange rates, interest rates and commodity prices
· Strategic actions including dispositions and acquisitions
· Unanticipated dramatic developments in our major businesses including CE (Consumer Electronics),
IM (IT & Mobile communications), DS (Device Solutions)
· Numerous other matters at the national and international levels which could affect our future results
These uncertainties may cause our actual results to be materially different from those expressed in this report.
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3. System Semiconductor Industry
Samsung System LSI : Now
Looking Forward

4. Market of Mobile Device
Smartphone
Tablet
(billion units)
(billion units)
1.3
1.2
1.0
0.8
0.7
0.6
9%
0.4
0.5
0.3
0.5
0.2
22%
0.5
0.1
0.7
0.6
0.07
0.3
2012
0.05
2013
Premium
2014(E)
2012
2015(E)
Mid + Low
0.06
0.12
2013
Premium
0.07
25%
58% 0.19
2014(E)
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0.26
2015(E)
Mid + Low
* Source : Gartner, 2013 3Q
* Source : Gartner, Strategy Analytics, 2013 3Q
0.09

5. Computing Power
• New applications require higher computing/bandwidth
Computing/Bandwidth
Dual Camcording
1080p Video
Web browsing
Single Camcording
Location Based
Service
Voice Command
Resolution
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6. Display Trend
• Higher resolution
FHD-class Display
Display
Resolution
UHD
(3,840x2,160)
WQHD
(2,560x1,440)
FHD
HD-class Display
(1,920x1,080)
HD
(1,280x720)
2011
2013
2015(E)
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7. Camera Sensor Trend
• Image quality enhancement is also improving
Camera Sensor
Resolution
20Mp
16Mp
Wide
Dynamic Range
13Mp
Image
Stabilization
5Mp
8Mp
Face
Detection
Wide
Dynamic Range
Face
Detection
Image
stabilization
3Mp
2007
2009
2011
2013
2015(E)
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8. System Semiconductor Industry
Samsung System LSI : Now
Looking Forward

9. Three business areas
LSI
SOC
Foundry
AP
Connectivity
Foundry
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Image Sensor
Display Driver IC
Smart Card IC
Power Management IC

10. Product Portfolio
• Powerful CPU/GPU
• Pixel Leadership
• Low Power
Power
Sequence
Control
&
I2C Interface
Camera
Sensor
• World’s Best Performance
• PMIC line: AP & OLED
• High Efficiency
• High Accuracy
• Smartphone
• IoT
• Slim Solution
PMIC
WiFi/BT
GPS
• Low Power Consumption
vt
NFC
• High Density e-SE Module
SIM
Display Driver IC
• Full line up for next FHD
• Lower Power solution
T-Con
• Fast Speed (New Architecture)
eDRAM
T-con
Backlight
control
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11. 1. AP (Application Processor)
• Focusing on high performance with low power consumption
CPU Leadership
Powerful GPU
Low Power
Game changing technology :
Richer 3D graphics with
Advanced mobile process &
big.LITTLE octa core
Energy efficiency
design methodologies
Low
big
High
Low
High
LITTLE
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12. Computing Power
• Has been leading AP industry since 2009
 Innovation in both Architecture & Silicon Technology
(DMIPS)
30,000
Cortex-A15
2.xGHz
Cortex-A15 Octa
1.6GHz
Cortex-A9 Quad
20,000
1.4GHz
Cortex-A9 Dual
10,000
ARM11
800MHz
2008
Cortex-A8
1.2GHz
1.0GHz
2009
2011
2010
* Source : Samsung Electronics Co., Ltd., ARM
2012
2013
*DMIPS : Dhrystone Million Instructions Per Second
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13. big.LITTLE Architecture
• Best of both worlds: high performance and low energy
 Heterogeneous architecture for energy efficiency
1
2
3
4
LITTLE
C-A7
big
C-A15
1
2
3
4
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14. big.LITTLE Architecture
• 20% gain at performance and energy, respectively
Performance
Energy
Higher is Better
Lower is Better
-15 ~ 20%
+ 20%
big.LITTLE
big.LITTLE
Conventional
*Source : Samsung Electronics Co., LTD, 2013 2Q
Conventional
*Source : Samsung Electronics Co., LTD, 2013 2Q
*Conventional : big CPU only
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15. Advanced Silicon Process
• Leadership in low-power, advanced silicon process
Vdd
90/65nm
45nm
32nm
28nm
Strained Si
20nm
m
ULK
1st Gen
HK/MG
1.2V
Gen
HK/MG
10nm
1st Gate Last
HK/MG
1.1V
1.0V
14nm
2nd
1.0V
1st Gen
FinFET
0.9V
2nd Gen
FinFET
0.8V
2006,
2009
2010
2012
2013
* Source : Samsung Electronics Co., Ltd.
*Vdd : Supplying voltage of drain
2014(E)
0.7V
Process Node
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16. 2. Image Sensor
• Higher resolution & smaller pixel have driven sensor industry
Pixel Pitch (um)
Back-side Illumination Pixel
13Mp
12Mp
8Mp
5.6
ISOCELL
Wide Dynamic Range
5Mp
2.8
Resolution
3Mp
2.25
1.8
VGA
1.3Mp
1.4
2Mp
1.1
Standard Mobile Imaging Architecture (SMIA)
2004
2005
2006
2007
Sub 1um
2008
2009
* Source : Samsung Electronics Co., Ltd.
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2010
2011
2012
2013

17. Pixel Architecture
• To increase sensitivity and decrease light loss & crosstalk
Gap-less u-lens
Deep PD
Light-guide
Increase sensitivity
Reduce loss in Si
Reduce metal layer reflection
u-lens
C/F
Metal
Photo-diode
Conventional
Without
color interference
Light-guide
G
Back-side illumination
No light loss
With
color interference
ISOCELL
Remove metal layer reflection
R
G
R
Photo Photo
Diode Diode
Photo Photo
Diode Diode
Back-side
illumination
ISOCELL
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Front-side Back-side
illumination illumination

18. New Products for 2014-15
• 16Mp ISOCELL Sensor with 1.12um pixels
- Main sensor for smartphones
- Wide dynamic range & Auto focus
• Next APS-C sensor
- Sensor for mirror-less cameras
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19. 3. Foundry
Advanced technology and
continuous capacity growth
Customers
One stop IP shopping and
design support
Best service for development and
mass production
Technology &
Capacity
IP & Design
Support
Partnership with customers
Service
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20. 14nm Achievement
• World’s leading 14nm FinFET solution via collaboration
Samsung : 14nm FinFET test sample & Design Infrastructure ready
ARM , Cadence, Synopsys & Mentor
 FinFET Design Enablement Platform
 First Cortex-A7 implementation
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21. Technology & Capacity
Samsung
IBM
ISDA
Giheung, KR
STMicro.
GlobalFoundries
Austin, Texas, USA
* ISDA : International Semiconductor Development Alliance
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Hwaseong, KR

22. System Semiconductor : Introduction
Samsung System LSI : Now
Looking Forward

23. 1
“Widcon” & TSV (Through Silicon Via)
2
64-bit CPU
3
FinFET Process
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24. “Widcon” with TSV
• Wide connection between logic and memory
 Higher bandwidth, lower power consumption
Memory Stacking with TSV
Short Connection with TSV
Micro Bump
DRAM
u-bump
AP
Package
PCB
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25. Widcon in reality
• World’s 1st AP using Widcon & TSV
Performance
Power
33%
Higher is
Better
Lower is
Better
60%
43%
14%
Widcon1 LPDDR3
Widcon2 LPDDR4
Widcon1
*Source : Samsung Electronics Co., Ltd., JEDEC, 2013 1Q
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LPDDR3
Widcon2 LPDDR4

26. 64-bit CPU core for Smart Devices
• 2-step approach:
 AP with ARM’s 64-bit core
 AP with Samsung’s own 64-bit core
Samsung
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27. 14nm FinFET Technology
• FinFET technology leadership
 Lower Vdd and delay than a planar process
Advantage
Structure
Gate
Source
Drain
Delay
FinFET
20nm Planar
Less
Delay
Lower Vdd
Vdd
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28. New Business
1
ModAP (Cellular Modem + AP)
2
IoT
3
Foundry 2.0
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29. 1. ModAP (Modem + AP)
• Dual tracks for modem collaboration
 High-end
: 2-chip strategy with Tier-1 modem suppliers
 Mid/low-end : ModAP using system company’s modem
Additional Products
Existing Products
ModAP
AP
Modem
Memory
Memory
AP
Modem
Memory
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30. ModAP
• System LSI’s 1st ModAP was shipped in 3Q’13
Exynos 4 Quad +
System Company’s Modem
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31. 2. IoT (Internet of Things)
• Smart building, Smart community, . . .
• Total connectivity solutions
Air conditioning
and Temperature
control
Energy
Generation
Energy
Storage
Lighting Control
Control of
Elevators and
Escalators
Total Solutions
Security Control
Disaster
Prevention
Monitoring
Cameras
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32. 3. Foundry 2.0
• Technical leadership … 14FF and beyond
Foundry 2.0
1
Follower
 Technology Leadership
2
Tier 1 only
 Tier 1 + Tier 2/3
3
Silicon
 Silicon + IP Provider
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33. Foundry 2.0
• 10nm FinFET Leadership
SRD
 Schedule
*SRD: Semiconductor Research & Development
 Performance, power and area
ISDA
• Early EUV Adoption
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34. Concluding Remarks
• Samsung S.LSI provides total solution for connected world
 Mobile AP (Application Processor)
 Image Sensor
 ModAP
 IoT
• Samsung S.LSI offers attractive foundry solution
 Leading-edge technology: 14FF
 Capacity
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