VD-680-PS acf bondig machine user manual

© V D INTELLISYS TECHNOLOGIES PVT. LTD Page 1
VD INTELLISYS TECHNOLOGIES P LTD
TAB/COG/FOB LCD BONDING MACHINE
VD-680-PS
USER MANUAL

INDEX
1. Company Profile
2. Copyrights & Liability disclaimer
3. Introduction about VD-680-PS
4.packing list
5.Specification
6.lebelling
7.installation
8. Basic Knowledge of Bonding process
9. Machine HMI Introduction.
10. Examples
11. Some Customers photo

COMPANY PROFILE
V D INTELLISYS TECHNOLOGY PVT LTD
CIN NO: U72900DL2010PTC203285
PAN: AADCV2990E
TIN & CST No: 07AADCV2990E2Z8
IEC CODE: 0510058515
The company was founded by two IIT Graduates in 2010. VD INTELLISYS
TECHNOLOGIES (P) LTD is the biggest and best manufacturer/distributor of BGA(Ball Grid
Array) rework stations & LCD Repair solutions in the world . We provide cutting edge
solutions in LCD Panel Repair and SMT LED Production .Our customer includes Foxconn
,Sohnen USA ,DELHI METRO RAIL Corporation, Panasonic, FreeScale Semiconductor,
INCable , Vodafone ,IISC Bangalore , SitiCable, Ambuja Cement , IIT Madras , Abacus
Peripherals , Attero Recycling, DishTV , Essel Group , HIKVISION,etc.
We have also emerged as one of the largest distributor of repairing equipments having dealer
network of more than 1000+ across india.
Our company has entered this year into e-commerce business selling the educational products,
computer/laptop accessories, stationeries though our online portal www.shopsingh.com.
VD Intellisys Technologies Sister Company AV CHIPTRONIKS TECHNOLOGY PVT. LTD
operates some famous brands in Electronic Industry offering IT sale & Service under the brand
CHIPMENTOR and IT repair training under brand CHIPTRONIKS.
We have fantastic Customer support team, perhaps the first in the world where the support staff
are themselves insanely in love with repair industry. We offer PAN-INDIA Express Shipping
on all our products and 99% orders are shipped same day.
Our company have total 85 full time employees , out of which 19 are dedicated technical team ,
20 in sales , 3 in HR and 6 in marketing and other supporting staffs.

COPYRIGHTS & LIABILITY DISCLAIMER
The VD-680-PS package, including any hard copies and soft copies, are copyright protected. The
purchase of the programs confers the right to make back-up copies of the software included in the
package only. To the maximum extent permitted by applicable law, in no event shall manufacturer be
liable for any damages whatsoever (including without limitation, special, incidental, consequential, or
indirect damages for personal injury, loss of business profits, business interruption, loss of business
information, or any other pecuniary loss) arising out of the use of or inability to use this product, even
if manufacturer has been advised of the possibility of such damages. In any case, manufacturer’s entire
liability under any provision of this agreement shall be limited to the amount actually paid by you for
the SOFTWARE and/or HARDWARE.
Safety/Caution instructions
For Safety reasons, please note the following carefully
 This unit operates by electricity & Pneumatic . And some components within the device have
high dangerous voltages applied to them.
 Failing to follow the operating instructions could result in death, serious injuries, and/or
extensive damage to property!
 Never open the housing while main plug is connected.
 Do not use the units for any purpose other than which they are intended to.
 Use it according to the operating instructions.
 This equipment must not be switched on or used without supervision.
 The unit should switched-off or in idle state while not in use, leaving it ON may cause
overheating.
 Do not place any flammable material on the vicinity of the compressor.
 Do not allow the spillage of any liquid to on the machine as damage may occur.
 Please use the machine only on a level and non flammable surface
 Please do not touch bonding head until it cooled down.
 Any maintenance of the units is only permitted by a VD INTELLISYS certified service technician.
 Please also pay attention to the safety regulations applied in your area.

INTRODUCTION
VD-680-PS has been designed and manufactured by VD Intellisys Technologies P Ltd after
thorough research. This product is suitable for bonding of FPC,COF,TAB and LCD panel and
PCB.
This machine is used across the world and widely popular among LCD repair technicians and
manufacturers of TVs.

Packing List
The machine comes in two box :
Items in Box 1 :
1. VD-680-PS acf bonding machine
2. Accessories
Following are accessories :

Item in box 2 :
Platform with glass

SPECIFICATIONS
Automatic ACF bonding Machine
Equipment Model No VD-680-PS
Manufacturer Company VD Intellisys Technologies Pvt Ltd
Device Descripion Repair Screen Machine/Bonding Machine
Equipment Features 1. Different opearting modes
2. 3 level circuit control
3. Robust design
4. Vacuum Adsorption inbuilt
5. Heavy Weight so no alignment
problem
Device uses This product is used in a variety of FPC,
COF,TAB and LCD Panel and PCB bonding.
It can solve LCD vertical,horizontal,vertical
band,horizontal beltmblack belt,and many
such problems
Applicable LCD panel Specifications 15 ‘’-85’’
Applicable LCD panel Thickness 0.3mm-1.1 mm [Single Glass]
Binding direction X or Y unidirectional
Bonding Head Bit size Replaceableblade according to IC
specifications.The original machine is
equipped with 45x1.5x10
Device Processing Time TFT: 3.8s/chip
Production capacity TAB ,100pc /HR
Bonding Accuracy
Within ± 1.5μm
(Support 4K screen)
Highest positioning accuracy setting ±0.5μ m (Currently domestic the
highest index)
Equipment requirements the work Clean, No dust, Clean room

environment
Supply Pressure 0.5~0.7Mpa (Dry air source)
Power Supply AC 220V±10%，50HZ，3500W
Cylinder Device Japan SMC original thin cylinder
Pressure Systems SUNSOM Pressure system parallel bars
structure can eliminates
Indenter own weight, the pressure minimum
accuracy to 0.1KG,
pressure part both are use SMC precision
components
Heating Type Pulse (rapid heating / cooling and auxiliary
cooling function)
PID Temperature Control Adjustable heating curve Precision PID self-
System tuning type of Delta
The peak temperature : within +/- 3 degrees
Celsius
Room temperature time to 180 degrees the
response time within 2-3 seconds
Materials: Japan Titanium
Hot pressing head origin: United States
Plane precision (hot press side) :0.001mm
Plane thickness 0.5 (Reserved 3 times
grinding)
Thermocouple Type K type Original US OMEGA wire
Industrial control units / Programmer DELTA PLC
Touch unit DELTA touch screen
Image unit
COF counterpoint: down counterpoint
Number of lenses : 2

Microscopy: 30-120 Continuous zoom
COF Display: 19-inch HD
Upper light source : have
Down light source : have
COF trimming unit Origin: Taiwan Rail Type: U-rail (2056 high)
Accuracy : 0.01
Adjustable direction :X/Y/R
R Itinerary : Coarse 360 degrees, fine tuning
+/- 5 degrees
COF Fixture COF mechanical clamping type, Z tilt radius
micrometer trimming
Lens spinner unit Control mode: X / Y / Z micrometer control
Focus Adjustment: Manually adjust the focus
Silicone / Teflon Manual switching position
LCD stage (platform) Manual sliding or fixed optional
Alarm device Pressure abnormal/ temperature anomalies /
thermocouple abnormal / action abnormal
Hot press head counterpoint Cylinder stop can be set at any position in the
vertical direction
Control mode Touch screen + button operation
Parameter setting According to the need to set up Store
multiple sets of hot pressing parameters
Rated voltage 180-220 (customizable 110V)
Peak power 400-1100W（Supports 68X1.5X10
lengthened tool bit）
Maximum power 1100W
Actual power 580W
Body size 1800X1200x1520mm(L*W*H)

LABELLING

(C) VD INTELLISYS TECHNOLOGIES PVT LTD , 011-43464998., info@vdintellisys.com
INSTALLATION
Step-1
open the box 1 gently and take out all the equipments. Remove the air
compressor from the top of the machine. Remove the other accessories
from storage area on the left side of the machine.
step-2
fix the indicator light

Step-3
Fix the switch panel

step-4
fix the moving glass table frame and put the glass sheet on it.
step-5
Fix the pcb platform

step-6
Move the machine to desired location and transfer the machine from
wheel to fix stand
Step-7
install compressor

Bonding Technology of FPD(Flat Panel Display)
LCD (Liquid Crystal Display) which is the representation of FPD could not do solder junction
that is generally used in the world, because it has used ITO (Indium Tin Oxide) electrode
formed on the glass substrate since it was the early simple matrix (passive matrix).
So, a zebra, heat sealing, etc. are used for circuits’ design of LCD of a segment display,
such as a calculator and a clock.
Now, LCD of a dot-matrix display widely used for a PC or LCD television have been used
ACF (Anisotropic Conductive Film) junction because there are many terminals, the terminal
pitch is fine and high precision junction is required. ACF whose connection resistance is low
and which excels in heat resistance and connection reliability is used for other FPDs(Flat
Panel Display), such as PDP(Plasma Display Panel) and OLED(Organic LED).
Zebra rubber: It is the thing that laminates the conductive rubber which added carbon
and others as an electric conduction object and insulated rubber mutually.
Heat sealing: It is the thing that carries out printing formation of the circuit with
thermoplastic conductive adhesives at a film base material.
What’s ACF(Anisotropic Conductive Film)?
ACF is the matter that applied the adhesives of 10 to 50 micrometer thickness which
disperses the electric conduction particle uniformly on the support film (separator) of PET
(Polyethylene Terephthalate) etc., and is wound around the reel by the shape of a tape with
a width of 1 to 3mm and a length 50 to 200 meter.
The true ball-like resin with Ni-Au gild is used for the connection with a glass substrate, and
with Ni particles is used for PWB (Printed Wiring Board).
By arranging between the circuits which counter and applying heat and force, it is the
connection material which can perform electric junction and mechanical adhesion for many
electrodes below a 100-micrometer pitch.

Bonding mechanism
If around 180 to 210 degree heat is applied to a bonding head, the adhesion of ACF falls
rapidly. As the mobilized resin flows out of the crevice between up-and-down electrodes, it
satisfies the up-and-down electrode circumference, and it is hardens rapidly.
Moreover, electric conduction particles are confined between up-and-down electrodes by
the pressure applied simultaneously.
This metal skin film of the electric conduction particle surface enables the electrical
connection between up and down electrodes (anisotropy conductive connection), and make
it possible to connect.
Fine control of heat and pressure is important for this process, and it is greatly influenced by
the rigid conditions of the equipment supporting the kind of ACF to be used, a panel
electrode, and a bonding tool etc.
The example of a profile of pressure and a temperature setup in an ACF method

The connection process of ACF

TAB (Tape Automated Bonding) and COF (Chip On Film)
There are TAB, COF, etc. in the driver circuit joined to the terminal on the glass substrate of
LCD by ACF.
TAB has been widely used as a package of a LCD driver. However, conversion to COF is
progressing quickly by progress of enlargement of the display of a cellular phone, and
colorization.
Compared with TAB, COF bonding enables detailed correspondence of a bonding pitch and
free arrangement of it.
VD Intellisys Technologies Pvt. Ltd offers reliable bonding machine that can solve the
characteristic problems of COF such as badness of the mark recognition caused by the
thinness of COF.

Bonding process :
1. ACF Pre attaching
2. Prebonding
3. Final bonding
1. ACF pre attaching :
ACF cut at a designated length is laminated onto the electrode of LCD or TAB/COF, and
then the separator film is peeled off. Before peeling off , it is pressed by T bit solder iron
2. Prebonding & Final bonding :
We have to bond COF on glass side and PCB side . So you can see in the HMI , there are two
parameters: GLASS & another is PCB . The most importance is Glass side. We divide glass side
bonding into two stages:
(a) Prebonding or manual stage
(b) Final Bonding or automatc
But before we do bonding we have to do following two things :
But before you do this , apply IPA on crystal and head so that no dust remains .
(a) Head alignment : For doing head alignment , you have to press the "manual alignment " button
on panel . When you press the head will come down , and ou can move head up and down with your
hand . So align the head so the head come completely on the glass track .When you press manual
alignment again head will go up. you can use this steps repeatedly once you are sure its aligned
well. This is just done once to ensure it is aligned well. When you have enough practiceyou dont
need this in repetition.

(b) Cof alignment : We have to align the cof tracks with the Panel(Glass) tracks .Insert the cof in
the Cof plucker.( before that you have to apply acf tape on the cof, 1.2 mtr tape on glass side, 2.0
mtr tape on pcb side) . There are 3 knobs .one is for left and right alignment . second is for top and
bottom . Third is for balancing . Every glass have some kind of marks. Some may have + , - or O
this knd of symbols. So we have to match these two symbols on both side of screen.
(c) After cof alignment , now we have to do prebonding (manualbonding) : So press manual
bonding/prebonding on the HMI , head will come down .you can see you can not move up and down
with your hand . But if you think head is not aligned , and you want to move head, press cutter head
parameter,then you can move head up and down. After you head comes down ,you can apply little
heat to head (Press cutter head heating , 1-2 times) . after doing this you can apply little manual
cooling , and you can check if your cof is aligned and .you can move it little bit with knobs to align in
this stage . After you are sure now enter final bonding
(d) Final bonding : For final bonding , click automatic and press two (start buttons together on
machine panel) : head will come down automatically, it will follow its profile automatically, will bond
and cool automatically and move up automatically. Now you bonding is complete.
Follow the above procedure for PCB side : but its lot easier to pcb side , since one side is already
connected, so you dont have to do alignment , Just align once and press automatic .
VIDEOS :
.
1. COF Cleaning : https://www.youtube.com/watch?v=dfWReDxhMb0&t=5s
2. Bonding machine operation manual : https://www.youtube.com/watch?v=cigJIZ6CMXI&t=3s
3. Complete Bonding process : https://www.youtube.com/watch?v=oGvXy_-kuwY

MACHINE HMI PREOGRAM DESCRIPTION

Description about pressure meter
About Pressure meters : There are 4 pressure meters . Two on the right side and Two on the left
side . The two pressure meters on the right side determine the value of force that will be applie d by
the head in bonding stage on cof. Normally values of Upper Knife will be close to 60 , and value of
total pressure little more than 60 .
The two pressure meters on the left side determine the movement of head up and down. We have
used a special mechanism to move head up an down. it is based on pressure difference . So the
value of upper knife will be set to : 60 and lower knife set to Zero (0) . These values need to be just
set one time during machine installation.

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