There were 4 hang issues reported across two wafers and two final testing machines. One wafer had a bad die at coordinates (0,16) that was causing hang problems and could be shipped for further investigation. The hangs on the two final testing machines were resolved by switching operating systems, resetting components, and reloading test programs. The operating system version R10.8.4 seemed to be causing hangs after power cuts but runs successfully after first booting with R10.6.4.p1.