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Wherever electrical power is generated, there is also power dissipation, which heats up the components. This heat needs to be transferred away to prevent overheating. For semiconductors there is a maximum junction temperature, above which the semiconductor ceases to work. The right method to dissipate excess heat heavily depends on the mechanical and environmental conditions, as well as the field of application. Conduction Cooling is a way of transporting the heat without needing fans, and also providing a metal frame makes the solution even more rugged!

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MEN Mikro Elektronik GmbH

Recognizing and Eliminating Flux Concentrator Failures

Fluxtrol Inc.

In recent years, there has been a significant increase in the customer demands for improved induction coil lifetime. This has led to several publications in recent years by induction tooling manufacturers [1-4]. The main conclusion in these papers is that besides mechanical crashes the cause of most induction coil failures is localized overheating of the coil copper due to insufficient cooling. What is lacking from these publications is any way to determine what is sufficient cooling. In this paper, a scientific method for determining local copper temperatures will be presented. This will include evaluations of heat transfer coefficients for different sections of a multi-component inductor, dependence of heat transfer coefficient on water pressure and water passage cross-section, non-uniform power density distributions in various 2-D cross-sections and the resulting temperature distribution in the copper winding. The effects of duty cycle on optimal design will also be considered.

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Development and testing of ipc

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Conduction Cooling Explained in 5 Slides - Power Dissipation for Harsh Environments Wherever electrical power is generated, there is also power dissipation which heats up the components. This heat needs to be transferred away to prevent overheating. For semiconductors, there is a maximum junction temperature, above which the semiconductor ceases to work. The correct method of heat dissipation depends on the mechanical and environmental conditions, as well as the field of application. Conduction Cooling is a way of transporting the heat without needing fans, and adding a metal frame makes the solution even more rugged.

5 Things to Know About Conduction Cooling (CCA)

MEN Micro

5 Things to Know About Conduction Cooling

Angela Hauber

Hamari metro rail and electrical safety

Mahesh Chandra Manav

Jmv Presentation Airport and JMV LPS LTD

Mahesh Chandra Manav

CHAPTER 3: Induction Coil Design

Fluxtrol Inc.

5 Things to Know about Conduction Cooling (CCA)

MEN Micro

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costing of domestic and industrial wiring

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JMV LPS LTD RDSON Approve Product Manufacturing for Indian Railway and Follow NBC2016 International IEEE80,IEC 62305 . Kindly Visit our Stall #2 at IREEE2019 Place AERO CITY Gurgoan Date 22-24th Oct 2019. Very useful Exhibition for Railway's Traction Power Supply, Station Building Infra , Signal and Telecom , Building Automation and Ticket Fare Collection and Access Control Systems, Railway Board ,RDSO,RVNL., RITES,Railtel ,IRCON,CORE, Camtec(RDSO), DFCC,NHRCL, Metro Rail Project Authority in India , NCRTC, Railway Product OEM and EPC Companies. State Railway Infrastructure Development Corporation Ltd, Station Building Development , Indian Port Railway Development Corporation and Consultants for Railway Infra AECOM,EGIS India,AYESA,LKT India , Systra India, Louise Berger ,AARVEE Consultants many More

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Induction Furnace

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Relong’s RC350 is commercial microwave and RF laminate material designed with tightly controlled dielectric constant tolerance (± 0.05) and very low loss characteristics. This ceramic-filled, woven fiberglass reinforced PTFE composite material uses unique chemistry formulation and processing to offer RF and Microwave designers an advantage for improving electrical properties and mechanical performances.

RC350

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Tendances (20)

5 Things to Know about Conduction Cooling (CCA)

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Take a look into the reliability of plated through-holes and compare the impact of various amounts of copper plating in the through holes. Results of the thermal stress testing will be presented. Learn about the critical factors of Heavy Copper Printed Circuit Boards for determining the appropriate Heavy Copper elements such as acceptable heat rise, copper thickness, hole-size, and if capable of support vias.

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Insofar as the electronics can be found now in several applications of multiple domains, we have tried to highlight in this study that, those systems must be based on unquestionable reliability and meet the needs of the external environment. Starting from the unit "°c / w" concerning the thermal resistance from the gap between junction temperature and a reference temperature, we have tried to compare the thermal performance of electronic packages taking into consideration the thermal management. Our approach is based on the Monte Carlo simulation and the stochastic characterization of the QFN. From the norm of normalization, we have obtained standardized data sheets allowing accurate comparisons of the thermal performance of electronic packages as produced by different manufacturers. Our numerical model through simulation, prototyping concerning the design involves the JEDEC recommendations, which we consider a very interesting alternative. Through the deterministic analysis, we conducted an analysis from the Matlab program parameters, which control the Ansys software, the results were processed by statistical techniques to evaluate the times of the thermal resistance of the QFN. That is why we must consider the electronic package (encapsulating the integrated circuit), through the printed circuit board (PCB) to ensure the junction temperature maintenance and avoid the dissipation of the heat. Also our process was based on the union of the finite element method to the Monte Carlo simulation and stochastic characterization of the QFN. Keywords: Electronic package; Finite element method; printed

A Study on Stochastic Thermal Characterization of Electronic Packages

IJERA Editor

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An increasing number of power electronics products are taking advantage of a growing trend in the printed circuit board industry: Heavy Copper and EXTREME Copper Printed Circuit Boards. Most commercially available PCBs are manufactured for low-voltage/low power applications, with copper traces/planes made up of copper weights ranging from 1/2 oz/ft2 to 3 oz/ft2. A heavy copper circuit is manufactured with copper weights anywhere between 4 oz/ft2 to 20 oz/ft2. Copper weights above 20 oz/ft2 and up to 200 oz/ft2 are also possible and are referred to as EXTREME Copper. Our discussion will focus primarily on Heavy Copper.

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A very useful method of formulating the Total Thermal Resistance of ordinary mesa structure of DDR IMPATT diode oscillators are presented in this paper. The main aim of this paper is to provide a 2D model for Si and SiC based IMPATT having different heat sinks (Type IIA diamond and copper) at high power MMW frequency and study the characteristics of Total thermal resistance versus diode diameter for both the devices. Calculations of Total thermal resistances associated with different DDR IMPATT diodes with different base materials operating at 94 GHz (W-Band) are included in this paper using the author’s developed formulation for both type-IIA diamond and copper semi-infinite heat sinks separately. Heat Sinks are designed using both type-IIA diamond and copper for all those diodes to operate near 500 K (which is well below the burn-out temperatures of all those base materials) for CW steady state operation. Results are provided in the form of necessary graphs and tables.

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The aim of this project is analysis the efficiency ratio in an annular fin by the variation of heat transfer coefficient for any surface condition by using MATLAB software to calculate the base fin efficiency and the coated fin efficiency by the variation of heat transfer coefficient, radius ratio and base fin thickness of an annular fin and compare the coating fin efficiency to base fin efficiency. If the heat transfer coefficient is 50W/m2K the increase efficiency ratio is 10.46 – 28.02% for zinc coating fin from the literature but the MATLAB result is 9.3 - 25.54% , the gain efficiency ratio at thicker base fin (d=0.001m) is 11.72%, at the thinner base fin (d=0.0002m) is 33.57% from the literature but the MATLAB result is 7.45% (d=0.001m) and 32.14% (d=0.0002m) for zinc coating fin and the gain efficiency ratio at thicker base fin (d=0.001m) is 11.92%, at the thinner base fin (d=0.0002m) is 33.61% from the literature but the MATLAB result is 7.51% (d=0.001m) and 32.16% (d=0.0002m) for zinc alloy coating fin.

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Dubai, often portrayed as a shimmering oasis in the desert, faces its own set of challenges, including the occasional threat of flooding. Despite its reputation for opulence and modernity, the emirate is not immune to the forces of nature. In recent years, Dubai has experienced sporadic but significant floods, testing the resilience of its infrastructure and communities. Among the critical lifelines in this bustling metropolis is the Dubai International Airport, a bustling hub that connects the city to the world. This article explores the intersection of Dubai flood events and the resilience demonstrated by the Dubai International Airport in the face of such challenges.

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Effective data discovery is crucial for maintaining compliance and mitigating risks in today's rapidly evolving privacy landscape. However, traditional manual approaches often struggle to keep pace with the growing volume and complexity of data. Join us for an insightful webinar where industry leaders from TrustArc and Privya will share their expertise on leveraging AI-powered solutions to revolutionize data discovery. You'll learn how to: - Effortlessly maintain a comprehensive, up-to-date data inventory - Harness code scanning insights to gain complete visibility into data flows leveraging the advantages of code scanning over DB scanning - Simplify compliance by leveraging Privya's integration with TrustArc - Implement proven strategies to mitigate third-party risks Our panel of experts will discuss real-world case studies and share practical strategies for overcoming common data discovery challenges. They'll also explore the latest trends and innovations in AI-driven data management, and how these technologies can help organizations stay ahead of the curve in an ever-changing privacy landscape.

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