5. Colliding domains
Mechanics Electronics
Piezoelectrics
Biology
Electrostatics Ferromagnetics
Control theory
Magnetostatics Piezoresistive
Fluidics
Systems
Magnetorestrictive
Optics
Proteomics Process design
Electromagnetics
Genomics Process simulation
Acoustics
Packaging
Materials
Biochemistry
Yield optimization
Electrokinetics DfM
Physics Manufacturing
6. Hierarchy of MEMS modeling
Behavioral System Structural
Algorithmic
Device level
Component level
Ab Initio
Physical Process
7. Behavioral Structural
1 Schematic Component 4
capture Library
Synthesis
System Model
&
Extraction
Optimization
3D Multiphysics engine
Behavioral Multiphysics engine
Layout engine
Verification engine
DRC engine
Ab Initio
Physical
&
Extraction
Process modeling
Process
Layout
Modeling
2 3
Physical Process level
Seamless integration of design flow…
8. Top down flow: schematic based…
Process iterative calculations
Database
Design of experiments
Process Synthesized Mask Layout
Flow
Sensitivity Analysis
Netlist
Material
Database Monte Carlo Methods
Design for Manufacture
Structural
Description
Synthesis techniques
Element
Database
Meshed model for 3D Verification
Fast but less accurate…
9. Bottom up design flow: 3D based
Process
Description
Mask
Set
Process 3D Multiphysics
Database
Process
Flow
3D Model Simulation
Material
Results
Database
Multiphysics
“Black box”
System Model
Accurate but slower…
10. IntelliSuite: Best of both worlds
Mask & Mesh Extraction
Synthesis
Physical Verification
Schematic vs 3D Macromodel
Analysis/Optimization
Multiphysics
Schematic based
Analysis
Microsystem
Schematic Requirements Process flow
Capture Mask Set
Top Down Bottom Up
Accurate + Fast
11. IntelliSuite Tool Chain
Synple Blueprint Clean Room Fast Field EDA Linker
Schematic capture Physical design Process flow design Multiphysics solvers Link to EDA tools
Component based Layout/DRC Process debug Coupled field analysis Cadence, Mentor,
Design exploration Tape Out Process visualization System model extraction Synopsys, Ansoft,
Mask and 3D synthesis Mathworks etc…
13. Synple capabilities (Behavioral)
Schematic capture Multiphysics computation Synthesis Yield Engineering Link to other tools
Design Exploration Mechanics Schematic to mask DfM Automatic meshing
Optimization Electrostatics Schematic to 3D Process Corner studies Derive process flow
Design for manufacture Damping/Dissipation Schematic to mesh Yield prediction
Piezo
Mixed Signal
Control Systems
1000X faster than FEA
14. Hierarchical multi-domain design
Atomic elements
Transistor RLC Plate Anchor Beam Gap
-
Compound +
elements
Op-Amp
Shuttle mass Folded flexure spring Comb drive
-
+
Device elements
Interface circuit Resonator
15. Electrical Digital Electronics Controls
Structural Thermal MEMS Macro-
Mechanics model
Wide Range of Building Blocks
16. Schematic based design exploration
Compute time: 4 hr (Full 3D) vs 30s (compact)
Band pass filter
Monte Carlo based
process variation analysis
22. Benefits
Schematic driven design
Entry point for parametric design and design exploration
Hierarchical modeling
Model your device at system or circuit level
Save time
100-1000X faster than FEA models.
Design exploration and optimization
Quickly prototype and explore multiple designs
3D System modeling
View your results in 3D
33. What is Clean Room?
Process simulation and MEMaterial
visualization Material databases & process
State of the art 3D process modeling optimization
RECIPE IntelliFAB
RIE/ICP/Bosch etch simulation Process traveller creation and
STS etch database visualization.
IntelliEtch Hexpresso
Ab initio based etch modeling Automated hexahedral meshing engine
wet and dry etch modeling for FEA/BEA model creation
34. Clean Room capabilities (Process)
Process capture Material databases Process simulation Hexpresso
Develop process traveller Process correlated databases FABViewer: Flow visualization Automated HEX mesher
Debug traveller Material properties AnisE - Anisotropic etching 1 click Mask to Mesh
Create process databases IntelliEtch - ab initio etching
RECIPE - RIE/ICP etch simulator
35. Setup complex process flows…
Process Editor for MEMS
3 1 IntelliFAB makes editing
and organizing a process
Process Pane
table quick and easy. Setup
Enter process parameters,
your virtual process traveller
tolerances and
exactly as you would for a
visualization settings in a
real foundry.
single consolidated pane
2
Group, section, organize
Grouping common sets of
processes into process
subsets makes the
organizing a complex
traveler easy. You can group
your process flow in any
4
which way you please: by
material, by process type or
Filter with ease by process option.
Filtering tools allow you to
quickly focus on the
processes that you want to
explore
36. Visualize Complex
process flows
Courtesy, Prof Tim Dallas, Texas Tech
37. Visualize Complex
process flows
Courtesy, Prof Tim Dallas, Texas Tech
38. Visualize Complex
process flows
Courtesy, Prof Tim Dallas, Texas Tech
39. Simulate composite MEMS processes
Combination of multi-step mask transfers, oxide and nitride layers, sacrificial layer deposition and
wet etching and DRIE processes.
Composite processes, Shikida Mitsuhiro, J. Micromech. Microeng. 14
41. Higher order plane etching
D. Saya, Sensors & Actuators A95 (2002)
Simulation results
42. Surface morphology prediction
Pyramid like morphology on 100 Si
Simulation results predict pyramid formation
subject to wet anisotropic etching
Arbitrary Cut Planes <533>
to understand the physics
43. Surface morphology prediction
1 Micromasking of apex
2 Floor moves down fast
3 Edges are stable
4 Facets are very stable
Hillock formation prediction
49. Fastfield capabilities (Structural)
Fastfield Multiphysics Fully coupled Specialized engines Extraction
Unique FEM-BEM formulation Thermal BioMEMS Multiphysics capture
64 bit multi-processor enabled Electrostatics High frequency EMag Efficient for verification
5-10X than pure FEM based Mechanical Lagrangian models
Fluidics 1000X more efficient that FEA
Contact physics
Piezo
Magnetostatics
50. What is Fastfield Multiphysics?
Coupled solver formulation
ANSYS, Algor, Comsol, etc are all pure Finite Element tools
Best solver for each physics domain
Boundary Element Method (BEM): Electrostatics, Electromagnetics
Finite Element Method (FEM): Thermal, Mechanical and Electromagnetics
Volume of Flow (VoF) and Finite Volume (FV): Fluidics, Electrokinetics, Chemical Reactions
Advanced pre-correction and solver techniques
Pre-corrected FFT (pFFT++), GMRES, Arnoldi, OpenMP based multi-processor solvers
51. Why Fastfield Multiphysics?
Speed and efficiency
2-10X Faster than pure FEA formulation (Algor, Ansys, Comsol, etc)
Handle large real world problems
Surface meshing vs volume meshes
Internal volumes, air gaps, etc do not need to be meshed
Ease of meshing, no costly re-meshing during deformation
Ease of convergence
Quickly run your analysis without convergence issues
Deal with large deformations, contact and post-contact without convergence issues
52. Rotary ring gyro Draper vibratory gyro Raytheon/TI RF switch
Lockheed inertial device
Rate/Coriolis analysis Electrostatic drive Non-linear contact analysis
Squeeze film analysis
Hitachi NASA Corning NASA
RF Tunable Filter Adaptive optics 3D Optical cross connect Radiation detectors
52
53. Membrane
Inlet
Micro-mixing in a valve Flow mixing Fluid Structure Interaction Flow separation device
Concentration gradient evolution Y combiner Inlet flow - membrane interaction
Microfluidics• Electrokinetics • Transport stochiometry • Heat transfer • Electro-Wetting on
Dielectric (EWOD) • Digital droplet microfluidics • Free Surface Flow • Fluid Structure Interaction •
Electrochemistry • Micro-mixing • Electrophoresis • Dielectrophoresis • Capillary flow and electro-
separation • Electro-osmosis • Electro-hydrodynamics • Micro-pumps
Electrokinetics Electro-osmotic driven flow Electrophoresis/Dielectrophoresis Free surface flow
Multiplex focusing Electrohydrodynamics for cooling High Frequency Waste separation Slide coater
55. Fast Impedance
Extraction
Phase ripple in
a BAW device
Multi-processor enabled BAW/SAW simulation
1 2 Piezo-acoustic
Fast impedance and phase ripple calculations
wave generation
56. Concentration skewing Minimized concentration skewing
Two reactants meeting at the junction and reacting
to form a new analyte. Support for multivalent
reactions is new in v 8.5
Enhanced ion drag calculations allows you to
optimize elbow turns to minimize concentration
skews
Enhanced Chemical Reaction Enhanced transport behavior
1 Microfluidics with enhanced transport kinetics 2 Multivalent Ion drag calculations in electrokinetic
transport
57. Droplet moving around a pre-set track (top view) Droplet fission (top view)
Electrowetting on dielectric (EWOD)
3
3D Electrowetting calculations
58. ElectroMagnetics
IntelliSuite is the only tool on the market
that allows you to perform coupled
Thermo-Electro-Mechanical & Full Wave
ElectroMagnetic analyses— this is
particularly useful in designing
deformable RF-MEMS such as switches,
tunable capacitors and varactors.
60. What is extraction?
Simplifying a full 3D model into behavioral model
Convert FEA/BEA model (large DOFs) into computationally efficient model
Develop pre-computed energy based model that captures multiphysics
What is extracted ?
Mechanical Strain Energy of Modes of Interest (Including stress and stress gradient effects)
Capacitive energy
Thermal effects (deformation due to temperature change)
Fluidic Structure Interaction (due to compressive or non-compressive media)
Other dissipation sources (thermoelastic damping (v8.6.1) and anchor acoustic losses (v8.6.2))
61. System Model Extraction (SME)
Capture strain energy Capture electrostatic energy Capture fluid damping
associated with each mode associated with each mode characteristics
Arnoldi/Krylov
First mode sub-space Compact
reduction Representation
HDL
HDL formulation
Second mode
Hardware
N-DOF behavioral model Description
based on Lagrangian
formulation
d # "L & "L
% () =0
dt % "q j ( "q j
$ '
Third mode
!
❶ Capture total energy of relevant mode ❷ Krylov/Arnoldi methods to ❸ Create Compact model for
(Mechanical, Electrostatic, Dissipation) generate Lagrangian formulation system modeling
62. System model extraction (SME) flow chart
/ SPICE OR OTHER EDA TOOL
Summary: Convert problem from Newtonian (inertia based) to more efficient Lagrangian domain (energy based)
63. SME advantages
• Automated full • 3D MEMS system
multi-physics simulation
capture
• Device and package
• 1000 X faster than level extraction
pure FEA
• Automated VHDL/
• Matches FEA to Verilog/ SPICE
within 1% accuracy generation
• Fully capture
harmonic responses
64. EDA Linker capabilities (compatibility)
Create accurate N-DOF dynamic system model
from MEMS FEA/BEA model
Output system model into SPICE, HDL, and
Simulink formats
Compatible with EDA tools from Cadence,
Mathworks, Mentor, Synopsys and Tanner
Integrated CMOS-MEMS (SoC/SiP) compatibility
65. Integrated design flow for MEMS + IC
Device/System Design Exploration
1 Design of Experiments
(SYNPLE/IntelliSuite)
Final MEMS Device design
2
(Multiphysics)
MEMS-CMOS integration
N-DOF Lagrangian design flow can be based on :
3 System Model Extraction
(IntelliSuite) √ VHDL-AMS
√ Verilog-A
Transistor level design √ SPICE netlist
4 (SPICE/SYNPLE or other EDA tools)
√ Matlab/Simulink .MEX
Gate level
5 Place and route, DRC, LVS
(Cadence/Synopsys/Mentor/ViewLogic/Tanner etc)
6
Final Layout
(IntelliMask Pro/ L-Edit/ Virtuoso/other)
66. What is verification?
Model verification (Schematic vs 3D)
Verify schematic model and 3D model match
Ensure MEMS model used in circuit development is accurate
Physical verification (‘Tape Out’)
Verify physical layout is consistent with Design Rules
Ensure design meets manufacturability criteria
67. Static model verification
0.200
Extracted 3D
-0.200
-0.600
-1.000
-1.400
-1.800
0 2 4 6 8 10 12
Pull-in: Schematic results vs Full 3D results
68. Damping model verification
Perforated condenser membrane
Full 3D (TEM) vs Macromodel comparison
Full capture of fluidic damping and spring force
70. Summary
• End to end design tools for MEMS
• Simulate MEMS at any level:
Ab-initio, Component, Device, Algorithm and System
• Flexible design flow to achieve accurate and fast results
• Used by major customers in 30+ countries
