I-Byte Technology March 2021

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I-Bytes
Technology
March Edition 2021
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Table of Contents
1. Financial, M & A Updates...................................................................................................................................1
2. Solution Updates..................................................................................................................................................9
3. Rewards and Recognition Updates...................................................................................................................44
4. Customer Success Updates................................................................................................................................52
5. Partnership Ecosystem Updates.......................................................................................................................62
6. Environment & Social Updates........................................................................................................................75
7. Miscellaneous Updates......................................................................................................................................79

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Financial, M & A
Updates Technology Industry

Financial, M&A Updates
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Arista (USA) Networks, Inc. Reports Fourth Quarter and Year End 2020
Financial Results
• Revenue of $648.5 million, an increase of 7.1% compared to the third quarter of 2020, and an increase
of 17.4% from the fourth quarter of 2019.
• GAAP gross margin of 63.9%, compared to GAAP gross margin of 63.6% in the third quarter of 2020
and 64.5% in the fourth quarter of 2019.
• Non-GAAP gross margin of 65.0%, compared to non-GAAP gross margin of 64.6% in the third
quarter of 2020 and 65.2% in the fourth quarter of 2019.
• GAAP net income of $183.0 million, or $2.31 per diluted share, compared to GAAP net income of
$260.7 million, or $3.25 per diluted share in the fourth quarter of 2019.
• Non-GAAP net income of $197.7 million, or $2.49 per diluted share, compared to non-GAAP net
income of $183.4 million, or $2.29 per diluted share in the fourth quarter of 2019.
• Revenue of $2.32 billion, a decrease of 3.9% compared to fiscal year 2019.
• GAAP gross margin of 63.9%, compared to GAAP gross margin of 64.1% in fiscal year 2019.
• Non-GAAP gross margin of 65.0%, compared to non-GAAP gross margin of 64.7% in fiscal year
2019.
• GAAP net income of $634.6 million, or $7.99 per diluted share, compared to GAAP net income of
$859.9 million, or $10.63 per diluted share, in fiscal year 2019.
• Non-GAAP net income of $718.4 million or $9.04 per diluted share, compared to non-GAAP net
income of $786.8 million or $9.73 per diluted share, in fiscal year 2019.
Executive Commentary
“I am pleased with Arista's return to growth in Q4 2020. With our laser focus on customer success,
pristine financials and transformative innovations, Arista is well positioned to continue our
momentum in the post pandemic era,” stated President and CEO of Arista Networks.
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Key Financial Highlights

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AUO (Taiwan) deepens the layout of smart transportation, acquires shares
and forms alliance with Xinchuang Electronics
AU Optronics conducted huge transactions on the open market. Industrial Computer Xinchuang Electronics Co., Ltd. acquired a 7.7% stake in Xinchuang
Electronics. Through this shareholding, the two parties hope to establish a strategic partnership for the AIoV ecosystem and jointly create a comprehensive
solution for smart transportation and commercial vehicle networking platforms. As a leading manufacturer of smart car displays, AUO provides rugged and
flexible public information displays, center consoles and dashboard products for land, sea and air transportation and ride hubs, and has a large customer
base covering the world. In addition, the commercial vehicle networking AIoV solution developed by AUO covers the cloud to the ground, from software
to hardware, and from AI to vertical applications. Among them, AUO's fleet and vehicle condition management system and driving monitoring system can
assist transportation Service managers can grasp the full picture of fleet operation in real time to meet the needs of commercial fleet operation management.
Xinchuang Electronics is one of the main manufacturers of in-vehicle computers in Taiwan. In the application of intelligent transportation such as
commercial vehicles and transportation, it has demonstrated the competitiveness of the market-leading intelligent transportation in-vehicle computer
technology and solutions, and is a series of intelligent transportation display solutions for AUO An important partner with commercial vehicle networking
platforms. With the establishment of a strategic partnership between AUO and Xinchuang Electronics, they will be able to form complementary advantages,
jointly master the upgrading needs of customers in the field of smart transportation, and provide complete solutions.
Description
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Autodesk (USA) Inc. Announces Fiscal 2021 Fourth Quarter And
Full-Year Results
• Total billings decreased 1 percent to $1.47 billion.
• Total revenue was $1.04 billion, an increase of 16 percent as reported and on a constant currency basis. Recurring
revenue represents 94 percent of total.
• Design revenue was $899 million, an increase of 13 percent as reported, and 14 percent on a constant currency
basis. On a sequential basis, Design revenue increased 6 percent as reported and on a constant currency basis.
• Make revenue was $82 million, an increase of 28 percent as reported, and 27 percent on a constant currency basis.
On a sequential basis, Make revenue increased 7 percent as reported, and 6 percent on a constant currency basis.
• Subscription plan revenue was $950 million, an increase of 22 percent as reported and on a constant currency
basis. On a sequential basis, subscription plan revenue increased 7 percent as reported and on a constant currency basis.
• Maintenance plan revenue was $30 million, a decrease of 62 percent as reported, and 61 percent on a constant
currency basis. On a sequential basis, maintenance plan revenue decreased 24 percent as reported, and 22 percent on a
constant currency basis.
• Net revenue retention rate was within the range of 100 to 110 percent.
• GAAP operating income was $184 million, compared to $134 million in the fourth quarter last year. GAAP
operating margin was 18 percent, up 3 percentage points.
• Total non-GAAP operating income was $315 million, compared to $259 million in the fourth quarter last year.
Non-GAAP operating margin was 30 percent, up 1 percentage point.
• GAAP diluted net income per share was $4.10, compared to $0.59 in the fourth quarter last year, in part reflecting
a $679 million deferred tax asset valuation allowance release.
• Non-GAAP diluted net income per share was $1.18, compared to $0.92 in the fourth quarter last year.
"Our strong fiscal 2021 results reflect the increasing importance of a cloud-based platform to our customers and
the resilience of our subscription business model," said Autodesk president and CEO. "With a record number of
enterprise agreements in the fourth quarter and recently announced intention to acquire Innovyze, we are looking
to the future with optimism and remain confident in our fiscal 2023 targets and double-digit growth thereafter."
3
Key Financial Highlights

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Autodesk (USA) to Acquire Innovyze, Inc. for $1 Billion; Provider of Smart Water
Infrastructure Modeling and Simulation Technology
Autodesk, Inc. announced it has signed a definitive agreement to acquire
Portland, Oregon-based Innovyze, Inc., a global leader in water infrastructure
software, for $1 billion net of cash subject to working capital and tax closing
adjustments. The acquisition positions Autodesk as a technology leader in
end-to-end water infrastructure solutions from design to operations, accelerates
Autodesk’s digital twin strategy, and creates a clearer path to a more sustainable
and digitized water industry. Innovyze’s modeling, simulation, and predictive
analyses solutions enable more cost-effective and sustainably designed water
distribution networks, water collection systems, water and wastewater treatment
plants, and flood protection systems. Further, Innovyze’s solutions centralize
infrastructure asset visibility to optimize capital and operational expenses.
Combining Innovyze’s portfolio with the power of Autodesk’s design and
analysis solutions, including Autodesk Civil 3D, Autodesk Infra Works, and the
Autodesk Construction Cloud, offers civil engineers, water utility companies and
water experts the ability to better respond to issues and to improve planning.
“We can achieve a more sustainable planet, but we can’t do it without
responsibly managing our use of water and securing its future,” said Autodesk
president and CEO. “An estimated $1.9 trillion is required to address global
water infrastructure needs by 2030, and by fundamentally changing the way
systems are designed, constructed, and operated, we are best positioned to
overcome this challenge and realize the better world we’ve imagined.”
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pbb (Germany) provides €66.5 mn for an office portfolio in Warsaw and Budapest
managed by Galleon Capital Management (GalCap Europe)
pbb Deutsche Pfandbriefbank has provided an investment loan
facility totaling €66.5 Mn for an office portfolio managed by
GalCap Europe on behalf of an institutional client. The fund will
utilise the proceeds for the refinancing of a mixed-use portfolio with
assets in Budapest and Warsaw. pbb acted as arranger and sole
lender under the facili ty. The portfolio comprises six refurbished
office buildings in central locations. The 50,000m² of gross lettable
area predominantly consists of office space, which is complemented
by small proportions of retail and restaurant as well as residential
and hotel space. The portfolio is let to reputable tenants such as
government institutions and other well-known national and
international firms.
Managing Partner of GalCap Europe said: “We are convinced
that the real estate markets of Central Europe offer exceptionally
attractive investment opportunities. The mid- to long-term
prospects are compelling. Our cooperation with pbb Deutsche
Pfandbriefbank enables us to realize these opportunities in a
timely manner.”
Description
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Fujifilm (Japan): Notice Concerning the Completion Timing for the Acquisition
of Hitachi's Diagnostic Imaging-related Business
FUJIFILM Corporation announced that it has entered into an agreement with Hitachi, Ltd. (Hitachi) to acquire Hitachi's Diagnostic Imaging-related
Business (the Business) on December 18, 2019 in its effort to further expand its Healthcare business. Hitachi and FUJIFILM Healthcare, which was
established by Hitachi to absorb the Business, have signed an agreement for absorption-type company split. With the commencement of a procedure for
company split in relation to the Business, Fujifilm announces that the acquisition process is expected to complete on March 31, 2021. Fujifilm, through this
acquisition, further expands its Medical Systems business. The Business has a strong global presence, providing a comprehensive suite of products
including CT, MRI, X-ray, and ultrasound systems. The business not only serves as a stable revenue base, but also shows potential for further growth. In
recent years, vendors have been expected in clinical settings to provide solutions that directly benefit medical institution's management, combining various
products including CT, MRI, X-ray, PACS, endoscopy, and ultrasound systems. The product portfolios of Fujifilm and the Business overlap little. The
combination of their product lineups dramatically enhances its capability to offer a comprehensive solution to medical institutions. In addition, Fujifilm's
advanced image processing technologies and AI technologies can be applied to products in the Business's comprehensive lineup to create new values,
contributing to high quality medical care. Such values will be delivered globally utilizing extensive sales network. Fujifilm will establish a solid business
foundation to become a world's leading healthcare company and play a leading role in improving the quality of medical care.
Description
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L3harris (USA) Technologies Signs Definitive Agreements To Sell Its Military
Training And Combat Propulsion Systems Businesses For $1.45 Billion
L3Harris Technologies has signed definitive agreements to sell its Military
Training business to CAE and its Combat Propulsion Systems and related
businesses to RENK AG for a combined $1.45 billion. Each transaction is
subject to customary closing conditions, including receipt of regulatory
approvals, and is expected to close in the second half of 2021. Under the first
agreement, CAE will acquire L3Harris’ Military Training business for $1.05
billion in cash. With annual revenue of approximately $500 million, the
Military Training business provides a wide range of training systems,
simulations and related services to U.S. and international military customers.
Under the second agreement, RENK AG will acquire L3Harris’ Combat
Propulsion Systems and related businesses for about $400 million in cash.
With annual revenue of approximately $230 million, the Combat Propulsion
Systems business manufactures military engines and transmissions.
“With announcement, we have now completed or announced divestitures
of businesses with a combined $1.4 billion of revenue for $2.5 billion in
expected proceeds, and our portfolio shaping process is ongoing,” said
Chairman and CEO, L3Harris. “These agreements place our Military
Training and Combat Propulsion Systems and related businesses with
well-suited buyers, while positioning L3Harris to further focus on its core
technologies and execute its strategic priorities.”
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Match Group (USA) to Acquire Hyperconnect
Match Group and Hyperconnect announced they have reached an agreement for Match
Group to acquire Hyperconnect for US$1.725 billion in cash and stock. The transaction is
expected to close in Q2 2021 pending customary regulatory approvals. Hyperconnect is a
leading social discovery and video technology company based in Seoul, South Korea that
operates two flagship apps: Azar and Hakuna Live. Azar is the highest grossing 1-on-1 live
video and audio chat app globally, allowing users to connect seamlessly with others from
around the world, instantly translating voice and text. Since launch in 2014, Azar has tallied
over 540 million cumulative downloads. Hakuna Live is an interactive, social live streaming
app that enables group video and audio broadcasts with various features including virtual
gifting, AR powered avatars, profile enhancements, and communities built around shared
interests. Since launch in 2019, Hakuna Live has been downloaded more than 23 million
times with strong momentum in South Korea and Japan. Hyperconnect's R&D efforts led to
the application and deployment of mobile WebRTC (Real-Time Communication) in 2014.
Scalable, low-cost video technology, award-winning on-device AI, and unique features have
cultivated highly engaged audiences across Hyperconnect's products. On both Azar and
Hakuna Live, users interact and build friendships in safe and dynamic settings.
"As more of our lives move online, people are looking for richer and deeper
experiences," said CEO of Match Group. "Hyperconnect's live video and audio
engagement technology is a powerful tool that enables users to connect with new people
and cultures on a global basis. Hyperconnect's engineering team is relentlessly
imaginative and creative. With more than 75% of usage and revenue coming from
markets spread across Asia, their product suite and regional footprint squarely
complements our own. We will leverage our deep bench of expertise to help accelerate
Hyperconnect's already-impressive growth, look to deploy Hyperconnect's technologies
across our existing portfolio, and continue to invest in their growth."
Description
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Solutions Updates
Technology Industry

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AMD (USA) Unveils AMD Radeon RX 6700 XT Graphics Card, Delivering
Exceptional 1440p PC Gaming Experiences
9
Solution Description
AMD introduced the AMD Radeon RX 6700 XT graphics card, providing exceptional performance, stunningly vivid visuals and
advanced software features to redefine 1440p resolution gaming. Representing the cutting edge of engineering and design, AMD
Radeon RX 6700 XT graphics cards harness breakthrough AMD RDNA 2 gaming architecture, 96MB of high-performance AMD
Infinity Cache, 12GB of high-speed GDDR6 memory, AMD Smart Access Memory1 and other advanced technologies to meet the
ever-increasing demands of modern games. Delivering up to 2X higher gaming performance in select titles1 with amazing new
features compared to the current installed base of older-generation graphics cards and providing more than 165 FPS in select esports
titles2, the AMD Radeon RX 6700 XT graphics card pushes the limits of gaming by enabling incredible, high-refresh 1440p
performance and breathtaking visual fidelity. Taking advantage of this incredible performance, more than 40 system builders and
OEMs are expected to launch high-performance desktop PCs powered by the new graphics card. HP is expected to refresh two
desktop gaming systems this Spring – the HP OMEN 25L and 30L – featuring AMD Radeon RX 6700 XT graphics cards and AMD
Ryzen™ 5000 Series Desktop Processors.

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Alps Alpine (Japan), KRS and Sompo Japan Launch Co-creative Efforts to
Address Lost Pallets in Food Logistics
10
Alps Alpine Co., Ltd. has teamed up with K.R.S. Corporation and Sompo Japan Insurance Inc. to address the problem of pallets going missing in
logistics operations. The co-creative activities began in December 2020. Pallets used to carry and transport goods are essential for achieving efficiency
in logistics operations, such as sorting with the aid of a forklift. In Japan alone, several hundred million pallets are estimated to be in circulation each
year, helping to improve job efficiency in cargo handling, transportation and warehousing, as well as to ease the effects of a worker shortage. However,
companies in a wide range of industries that employ pallets for logistics, storage and manufacturing face a common dilemma – pallets go missing. As
a result, companies bear ongoing losses due to depletion of assets and higher rental expenses that affect transportation efficiency and lift costs. The
co-creative activities here are a cross-industry effort to resolve the above logistics issues not only by overcoming obstacles faced by individual pallet
users, but also by contributing to greater efficiency in the logistics industry as a whole. Alps Alpine’s Long-Lifetime Asset Tracker1, an IoT device for
remote tracking of logistics assets, will be attached to around 200 pallets administered by KRS to undergo demonstration testing. Positional
information, movement history and other operational data for pallets will be collected from the tracking devices to identify pallets presumed to be
missing within, or diverted to, unanticipated usage channels or storage locations, and to understand and analyze usage history and reasons for the loss
or diversion of pallets. The aim is to apply data obtained through the testing to resolve issues relating to pallet use.

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Analog Devices’ (Japan) Battery Management System ICs and Automotive
Audio Bus Power Volvo’s All Electric XC40 SUV
11
Analog Devices, Inc. and Volvo Cars announced that Volvo Cars’ first pure electric SUV—the Volvo XC40 Recharge—will
feature ADI’s integrated circuits (ICs) that support the battery management system (BMS) and Automotive Audio Bus®
(A2B). By saving vehicle weight and maximizing range, these advanced technologies deliver an attractive total cost of
ownership for electric vehicles while also supporting a sustainable future. The Volvo XC40 P8 Recharge was a 2021
semi-finalist in the North American Car, Truck and Utility Vehicle of the Year™ Awards (NACTOY) utility vehicle category.
The NACTOYAwards honor excellence in innovation, design, safety, handling, driver satisfaction and value. The awards are
intended to recognize the most outstanding new vehicles of the year. ADI's ICs provide industry leading accuracy over the life
of the vehicle that significantly increases miles per charge and are scalable across the vehicle fleet from hybrid vehicles to full
electric vehicles. The ICs meet the highest global security standards, and scale across multiple battery chemistries, including
the zero-cobalt chemistries such as lithium iron phosphate (LFP) that support social and environmental sustainability.

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New Construction Management Solution -- Autodesk (USA) Build -- Now
Available Worldwide
12
Autodesk, Inc. announced Autodesk BuildTM, a new project and field management solution and part of Autodesk Construction
Cloud®, is now available to users globally. Initially announced at Autodesk University 2020, Autodesk Build now provides
construction teams with a single solution for project management, quality, safety, cost and closeout by connecting data,
workflows and teams in one highly-configurable environment. Easy to deploy, adopt and use, Autodesk Build unifies
best-in-class features from BIM 360 and PlanGrid and adds powerful new capabilities to make information immediately available
across the entire construction team. Owners, general contractors and specialty contractors can enhance project quality by relying
on Autodesk Build for real-time visibility that keeps teams in sync, improves collaboration, mitigates project risk and enables
data-driven decision making. Autodesk also made announcements around its cloud collaboration solutions for architecture,
engineering and construction (AEC) design teams: Autodesk Docs is now also included in the AEC Collection, BIM 360 Design
is now Autodesk BIM Collaborate Pro and Autodesk BIM Collaborate is now available globally.

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Arista (USA) Advances Zero Trust Security Strategy with Enhancements
to AI-driven Awake Security Platform
13
Awake Security, the network detection and response (NDR) security division of Arista Networks unveiled platform enhancements that strengthen its
ability to detect advanced threats, protect the unmanaged attack surface and autonomously perform threat hunting and forensic investigations.
Enhancements also include new features that make the platform even more intuitive for security analysts at all levels. Within six months of Arista’s
acquisition of Awake, the AI-driven network detection and response (NDR) platform is now integrated into Arista’s zero trust and DANZ Monitoring
Fabric (DMF) solutions, delivering innovative and secure capabilities to customers. Awake’s NDR platform is a key pillar of Arista’s vision for zero
trust security. With a new network-based multi-domain macro-segmentation service, situational awareness for all network resources and Awake’s NDR,
Arista is transforming network security from an afterthought to networks that are inherently secure. This approach provides continuous monitoring to
identify malicious intent whether originating from outside or inside the network perimeter along with the ability to then rapidly take remedial action.
With this launch, the Awake platform gains critical capabilities through its deepening integration with Arista solutions. Arista’s DANZ Monitoring
Fabric (DMF) is a next-generation network visibility solution that provides pervasive observability for both north-south and east-west traffic. When
combined with the Awake platform, customers benefit from a scale-out architecture that efficiently protects high-throughput networks by enabling use
cases such as network detection and response (NDR), threat hunting and full packet network forensics.

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Fujifilm (Japan) Kyowa Kirin Biologics and Mylan EPD Announce Launch of
“Adalimumab (Genetical Recombination) [Adalimumab Biosimilar 1]” in Japan
14
Fujifilm Kyowa Kirin Biologics Co., Ltd. and Mylan EPD G.K., a company of the Viatris group, announced that
“Adalimumab (Genetical Recombination) [Adalimumab Biosimilar 1]”, a biosimilar to AbbVie's Humira®
(Adalimumab (Genetical Recombination)), the top-selling drug in the world, has launched in Japan. This is the first
launch of a biosimilar to Humira® in Japan. Mylan EPD G.K. is in charge of the commercialization. Fujifilm Kyowa
Kirin Biologics and Viatris entered into a partnership in 2018 for the commercialization of the product as Hulio® in
Europe and Viatris has commercialized the product in more than 20 countries across the region. In 2019, Fujifilm
Kyowa Kirin Biologics and Viatris expanded the partnership globally. Furthermore, Hulio® received market approval
in the United States in 2020 and will be marketed by Viatris in July 2023 pursuant to its patent license agreement with
AbbVie.

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Fujifilm (Japan) launches “FUJIFILM PROJECTOR Z8000”
15
FUJIFILM Corporation is pleased to announce the launch of the “FUJIFILM PROJECTOR Z8000 (FP-Z8000)” in March, 2021, joining the lineup of the Z
Series of ultra-short throw projectors equipped with the world's first “folded two-axial rotatable lens.” The FP-Z8000 is a high-brightness projector capable
of projecting images in 8000 lumens (lm) of brightness. Its class-leading* compact and lightweight design accommodates installation in a wide variety of
conditions. Images can be projected at various directions without having to move the main unit. Its ability to throw large images from a close-up distance
enables spatial presentation that makes effective use of limited space. Projectors are used in a wide variety of situations including offices and educational
institutions. In recent years, opportunities have expanded to include projectors in digital signage at commercial facilities, product presentation at corporate
showrooms and artwork presentation at art galleries and museums. These have increased the needs for incorporating projectors to make effective use of
limited space for effective advertising and utilize ceilings and floors for spatial presentation. Fujifilm entered into the projector market in 2019 with the
launch of “FUJIFILM PROJECTOR Z5000 (FP-Z5000),” equipped with a “folded two-axial rotatable lens” to project images to various directions without
having to move the main unit. In last July, the company developed the FP-Z8000, which inherits main features of the FP-Z5000 but delivers images in 8000lm
of brightness. Since the announcement on the development of the FP-Z8000, it has won strong praise for its capability to broaden the scope of spatial
presentation due to its minimal constraint for installation and throw clearly visible images even in bright locations.

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Infineon’s (Germany) new Wi-Fi 6 solutions bring reliable, high performance
connectivity to smart homes
16
Digitalization is accelerating in all areas of life. From home entertainment to health tech to in-car entertainment, the number
of connected consumer devices used in homes or on-the-go continues to accelerate, increasing the demand for wireless
connectivity. With the new AIROC™ Wi-Fi 6/6E and Bluetooth® 5.2 product series, Infineon Technologies AG is responding
to consumers’ demand for secured and convenient wireless connectivity and helping to reduce congestion of home networks.
Wi-Fi 6, the latest generation of Wi-Fi to hit the market, is specifically built to improve reliability and performance, even in
high device density environments. Driven by the Covid-19 pandemic, more and more people are increasingly working,
studying and entertaining at home. Online gaming devices with virtual reality capabilities, sports devices that stream
work-outs live or connected kitchen gadgets are increasingly congesting the home network environment. Unlike previous
generations of Wi-Fi that focused on peak device speeds, Wi-Fi 6 includes advancements to relieve network congestion, and
to improve network efficiency, device battery life, latency and range in addition to peak speeds.

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KYOCERA (Japan) Launches 0.5mm-Pitch 5652 Series Electronic
Connectors for Automotive Applications
17
Kyocera Corporation has introduced a new 0.5mm-pitch floating board-to-board connector series (F/P*1 = 170%) for high-speed 16Gbps data
transmission. Sold under the 5652 Series designation, the new connectors can float within ±0.85mm for easy and accurate mating. They are
available now. Furthermore, the 5652 Series are Kyocera’s first connectors to use the new “FloXY” brand name, and the company plans to
gradually expand the lineup in the future. Demand for a safer, more secure driving experience is bringing revolutionary change to the automotive
market, with rising demand for smart cars, electric vehicles, ADAS (Advanced Driver-Assistance Systems), and AD (Autonomous Driving).
Essential to these systems are automotive devices such as Mobility Computers, IVI*2, and LiDAR, which require connectors that can support
high-volume, high-speed data transmission without latency. Kyocera’s new 5652 Series connectors are the first in the industry*3 to comply with
USB 3.1 Gen.2 standards for high-speed data transmission, as well as other standards, including PCIe Gen.1 through Gen.4, MIPI D/C-PHY, SATA
3.0, and USB 3.1 Gen.1. These connectors are available in a wide range of stacking heights, from 14mm to 30mm, enabling more design options.
They can withstand the extreme operating temperatures of up to 125° C (257° F) required of in-vehicle equipment. Kyocera will continue to
expand its product lineup and is currently developing other floating board-to-board connectors and high-pin-count (300+) connectors for
high-speed data transmission with stacking heights 5.0mm.

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Lenovo (Hong Kong): Latest ThinkPad™ Portfolio Ready to do Business
Anywhere
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Lenovo announced the latest additions to its ThinkPad portfolio including completely redesigned X13 and X13 Yoga with 16:10 aspect ratio displays and
updated T and L series. Also announcing, Lenovo is introducing refreshed ThinkPad mobile workstations featuring flexible processor options, discrete
graphics and improved displays. The ThinkPad P14s and P15s strike a balance between power and portability. Focused on enhancing business agility and
peace of mind through the disruptive shift to increased cloud-based environments, select ThinkPad models integrate better connectivity options including 5G
super-fast WWAN2 and Intel® Wi-Fi 6E3. Full HD web cameras4, improved displays with low blue light options and Dolby Vision®; and user-facing Dolby
Audio® Speaker System are designed to enhance the collaborative experience and maximize user engagement. Finally, the new ThinkVision P40w-20
premium display is the world’s first Thunderbolt 4 professional monitor deliver a superior desk-based user experience with extensive ports and enhanced
functionality. The new ThinkPad laptops offer customer choice to select the most appropriate configuration for their needs. Select models are available in
black or storm grey with options including 11th Gen Intel Core vPro processors or the latest AMD Ryzen 5000 Series Mobile Processors. ThinkPad P14s
mobile workstations can also be configured with AMD Radeon™ Pro or NVIDIA® graphics depending on the model. The laptops also improve Computer
Vision Experiences (CVx) with security options such as Match-on-Chip fingerprint reader, which is integrated into the power button for ease of use on some
models, and human presence detection sensor5 on Intel models offers zero-touch log-in through Windows Hello facial recognition. These enhancements add
to existing ThinkShield security features that help protect users.

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Micron (USA) Launches Low-Power Memory Qualified for Automotive
Safety Applications
19
Micron Technology, Inc. announced that it has begun sampling the industry’s first automotive low-power DDR5 DRAM (LPDDR5) memory that is
hardware-evaluated to meet the most stringent Automotive Safety Integrity Level (ASIL), ASIL D. The solution is part of Micron’s new portfolio of memory
and storage products targeted for automotive functional safety based on the International Organization for Standardization (ISO) 26262 standard. Micron’s
functional safety-evaluated DRAM is compatible with advanced-driver assistance system (ADAS) technologies, including adaptive cruise control, automatic
emergency braking systems, lane departure warning and blind spot detection systems.1 Micron’s LPDDR5’s high performance, superior power efficiency
and low latency provide the requisite performance and headroom to keep pace with increasing bandwidth requirements of next-generation automotive
systems. As electronic components in cars become integral for safety, automakers must meet strict functional safety standards that require mechanisms to
mitigate risk in the event of malfunctions. Recognizing the growing importance of functional safety, Micron has established an office dedicated to
collaborating with customers on the memory requirements of designing safe automotive systems. To help customers navigate complex compliance
obligations, this office has spearheaded the launch of LPDDR5 with a safety application note and the industry’s first supplier-provided hardware evaluation
report of DRAM. Micron’s hardware evaluation has also been independently assessed and verified by exida, a renowned expert in automotive safety. By
taking on this demanding evaluation in-house, Micron simplifies system design and speeds time to market for automotive customers.

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Murata (Japan): World’s smallest LoRaWAN® modem module reduces
current consumption
20
Murata announced the expansion of its Type 1SJ product line with the addition of a new LoRaWAN® modem solution. The
AT-command controlled modem module version measures only 10.0 mm x 8.0 mm x 1.6 mm, making it the smallest available in the
world. Operating from a single supply rail up to 3.9V DC, the device incorporates several low power modes that allow the real time
clock (RTC) to operate while drawing a typical current of just 1.3µA. This current consumption level assures that a single battery can
operate for years. Additionally, the resin mold package provides physical ruggedness with a -40ºC to +85ºC temperature range. Based
on a second-generation Semtech SX1262 radio frequency IC (RFIC), the Type 1SJ LoRaWAN® modem module comes preloaded
with AT Command controlled modem firmware and a LoRaWAN® stack with an AT Command middle layer. These features enable
a faster time-to-market and ease design challenges for IoT developers. The device currently supports the US915 band in North
America. Future adaptations of the module are intended for Europe, India, China and Pacific Rim markets. It is suitable for a wide
range of applications where a miniaturized footprint, long range, extended battery life, advanced security, and a competitive price
point are all critical requirements.

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ON Semiconductor (USA) Announce New 650V Silicon Carbide MOSFETs
Chinese Japanese Korean
21
ON Semiconductor driving energy efficient innovations, has announced a new range of silicon carbide (SiC) MOSFET devices for demanding
applications where power density, efficiency and reliability are key considerations. By replacing existing silicon switching technologies with the new
SiC devices, designers will achieve significantly better performance in applications such as electric vehicles (EV) on-board chargers (OBC), solar
inverters, server power supply units (PSU), telecoms and uninterruptible power supplies (UPS). ON Semiconductor’s new automotive AECQ101 and
industrial grade qualified 650 volt (V) SiC MOSFETs are based upon a new wide bandgap material that provides superior switching performance and
improved thermals when compared to silicon. This results in improved efficiency at the system level, enhanced power density, reduced electromagnetic
interference (EMI) and reduced system size and weight. The new generation of SiC MOSFETs employ a novel active cell design combined with
advanced thin wafer technology enabling best in class figure of merit Rsp for 650 V breakdown voltage. The VBG015N065SC1, NTBG015N065SC1,
NVH4L015N065SC1 and NTH4L015N065SC1 have the lowest Rdson (12 mOhm) in the market in D2PAK7L and To247 packages. This technology
is also optimized around energy loss figure of merits, optimizing performance in automotive and industrial applications. An internal gate resistor (Rg)
allows more flexibility to designers eliminating the need to slow down devices artificially with external gate resistors. Higher surge, avalanche
capability and short circuit robustness all contribute to enhanced ruggedness that delivers higher reliability and longer device lifetimes.

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Panasonic (Japan) Bets Big On Connected Living Solutions; Expands
Miraie Range
22
Reaffirming its commitment to enhance the everyday lives of consumers, Panasonic India, a diversified technology company announced the
expansion of its IoT & AI enabled Connected Living platform - Miraie and launched connected Refrigerator, Washing Machine, WiFi Fan, ROMA
Smart digital Switches and Smart WiFi Controller plugs and switches on the platform. The new range of Miraie appliances will be available across
Panasonic brand shops, large format retail outlets and online platforms from next week onwards. These new models are an addition to the first
generation of Miraie connected products including Connected Air Conditioners, Smart Door phones, Zigbee Plugs & Switches, which were
introduced last year; making it the widest range of connected products available under one platform. The new range of connected products have
been developed after carefully understanding the distinct consumer requirements and preferences. As per syndicated research commissioned by
Panasonic, over 56% of consumers aspire to purchase an IoT enabled Refrigerator and 39% of consumers showed interest in an IoT enabled
Washing Machine with comfort, convenience, and safety being the biggest drivers of demand. Also, according to a research by IFMA (Indian Fan
manufacturing association), 43% of consumers desire to purchase IoT enabled smart fans for the ease of use and value added benefit of
connectivity. The ongoing pandemic has led to a surge in need for tech-enabled solutions as consumers stay home longer, spurring the growth for
smart and connected home appliances.

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Qualcomm (USA) Redefining Wireless Audio with Launch of Qualcomm
Snapdragon Sound
23
Qualcomm Technologies International, Ltd. announced Qualcomm® Snapdragon Sound™ technology, an optimized chain of audio innovations
and software designed to provide seamless, immersive audio in, and across, devices including smartphones, wireless earbuds and headsets.
Snapdragon Sound is designed to provide a superior sound experience for consumers while listening to streaming music, communicating on the
phone, or wirelessly gaming. To coincide with this launch, Amazon Music and Qualcomm Technologies also announced a curated Snapdragon
Sound Playlist. There are many ways sound quality can be disrupted between users and devices. How devices connect with each other, breaks in
connectivity, audio dropouts and glitches, latency, and poor audio compression can all contribute to a tiring and distracting listening experience.
By optimizing interactions between Qualcomm technology stacks, Snapdragon Sound is designed to deliver a more robust and seamless wireless
listening experience, supporting high-resolution 24-bit 96kHz audio, ultra-low latency, improved pairing, and crystal-clear voice quality. To solve
end-to-end latency challenges, Snapdragon Sound can support Bluetooth latencies as low as 89 milliseconds (45% lower than a leading
competitor) for more immersive gaming and a better video watching experience. For those who prefer listening directly from the mobile device,
Snapdragon Sound incorporates the Qualcomm Aqstic™ DAC, designed to support formats of up to 384kHz 32-bit PCM and DSD with ultra-low
THD+N.

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Qualcomm (USA) Announces World’s First 10 Gigabit 5G Modem-RF
System
24
Qualcomm Technologies, Inc. announced the Snapdragon X65 5G Modem-RF System, its fourth-generation 5G modem-to-antenna solution. It is
the world’s first 10 Gigabit 5G and the first 3GPP release 16 modem-RF system, which is currently sampling to OEMs and targeting commercial
device launches in 2021. Snapdragon X65 is the Company’s biggest leap in 5G solutions since the commercialization of its first modem-RF
system. It is designed to support the fastest 5G speeds currently available with fiber-like wireless performance and makes best use of available
spectrum for ultimate network flexibility, capacity and coverage. In addition to the Snapdragon X65, Qualcomm Technologies also announced the
Snapdragon X62 5G Modem-RF System, a modem-to-antenna solution optimized for mainstream adoption of mobile broadband applications.
These and many other improvements in the Modem-RF System are designed to deliver a superior 5G experience with faster cellular speeds,
broader coverage and support for all-day battery life. Snapdragon X65 is poised to support a new generation of premium smartphones and the
expansion of 5G in segments such as PCs, mobile hotspots, industrial IoT, fixed wireless access, and 5G private networks. Qualcomm
Technologies is also introducing a widely accessible sibling of the Snapdragon X65 – the Snapdragon X62 5G Modem-RF System. The
Snapdragon X62 is a 5G modem-to-antenna solution supporting up to multi-Gigabit downloads for mobile broadband applications.

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Qualcomm (USA) Announces Next-Generation 5G RF Front End Solutions, Featuring
Use of Artificial Intelligence for Sleeker, High Performance 10 Gigabit 5G Devices
25
Qualcomm Technologies, Inc. announced its next generation of Qualcomm® RF Front End (RFFE) solutions for high-performance 5G
mobile devices. The solutions are designed to support advanced performance and power-efficiency capabilities in the newly announced
Qualcomm® Snapdragon™ X65 and X62 5G Modem-RF Systems – bringing together modem, RF transceiver, RF front-end components
with artificial intelligence (AI) assistance and mmWave antenna modules to enable OEMs to design premium 5G devices. The
comprehensive Qualcomm RFFE portfolio includes:
• Seventh-generation Qualcomm® Wideband Envelope Tracker (Qualcomm® QET7100) – World’s first multi-mode, multi-output,
multi-power amplifier, wideband envelope tracking solution supporting global 5G sub-6 GHz and LTE bands.
• Qualcomm® AI-Enhanced Signal Boost – World’s first 5G adaptive antenna tuning solution enhanced with AI designed to improve
context-based antenna performance and help OEMs address the growing number of antennas and frequency ranges required in 5G mobile
devices.
• New integrated 5G/4G Power Amplifier (PA) Modules and Diversity Modules.

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Qualcomm (USA) Announces Second-Generation 5G Fixed Wireless Access
Platform with 10 Gigabit 5G Connectivity for Homes and Businesses
26
Qualcomm Technologies, Inc. announced the Qualcomm 5G Fixed Wireless Access (FWA) platform gen 2. The new platform, powered by the
fourth-generation Qualcomm® Snapdragon™ X65 5G Modem-RF System, will enable new business opportunities for mobile operators by
allowing them to offer fixed internet broadband services to homes and businesses using their 5G network infrastructure. The new FWA platform
also features the second generation extended-range Qualcomm® QTM547 mmWave antenna module, support for extended-range high power 5G
sub-6 GHz, the world’s first 5G sub-6 GHz support with eight receive (RX) antennas, and support for Qualcomm® Dynamic Antenna Steering
technology. The platform also includes the Qualcomm 5G Fixed Wireless Access Platform gen 2 Reference Design, which will enable
manufacturers to commercialize 5G fixed wireless access devices quickly and cost-effectively, allowing consumers to experience a faster and more
reliable internet connection with peak speeds of up to 10 Gigabit 5G. This comprehensive platform is designed to expand fixed wireless access
reach and performance – helping operators to make this new “last mile” broadband option more widely available across urban, suburban and rural
environments using their 5G network infrastructure. Qualcomm Technologies is also announcing the new Snapdragon X12+ LTE Modem for FWA
devices that rely solely on 4G networks. The Snapdragon X12+ modem enables device manufacturers and operators the ability to upgrade FWA
devices with a LTE solution capable of achieving up to 600 Mbps.

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Renesas (Japan) and LUPAAccelerate Automotive Smart Camera Development
with Open Platform Turnkey Solutions
27
Renesas Electronics Corporation a premier supplier of advanced semiconductor solutions, and LUPA-Electronics GmbH, an automotive safety solution provider,
announced the Eagle CAM module, an open front camera solution, featuring Renesas’ R-Car V3H and R-Car V3M system-on-chip (SoC) devices. The all-in-one
scalable camera platform targets the latest Euro NCAP and C-NCAP requirements, such as automatic emergency braking, forward collision warning, lane keeping
assist, and traffic sign recognition. The jointly-developed solutions enable OEMs and Tier 1s to differentiate and extend their offering by integrating their
proprietary or third-party software that adds additional driving features. Most smart camera turnkey solutions on the market today take a black box solution
approach, making it challenging for OEMs and Tier 1s to address changing market demands and slowing down development. With EagleCAM featuring R-Car
SoCs, Renesas and LUPA introduce an open turnkey solution that delivers flexible, high-performance perception while shortening time to market and reducing the
bill of materials (BOM) costs. Based on Renesas’proven R-Car SoCs, EagleCAM supports low- to high-end front camera applications with extensions for surround
view, driver monitoring, and augmented reality. In addition to the R-Car SoCs, EagleCAM also includes Renesas’ automotive power management ICs (PMICs) to
further reduce BOM costs. With the recent update of the R-Car V3H, the new turnkey solutions benefit from the improved CNN performance of up to 3.7 TOPS,
ASIL-C capability of the real-time domain and camera support of up to 8 Megapixels. EagleCAM features a pre-validated hardware design, shortening the time
required to reach mass production. Customers can access best-in-class perception stacks that offer shorter turnaround time or stacks based on emerging
technologies, allowing them to achieve the best fit for their application needs.

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STMicroelectronics (Switzerland) Boosts Automotive Innovation with Longevity
Extension for Popular Body, Chassis, and Safety Microcontrollers
28
STMicroelectronics a global semiconductor leader serving customers across the spectrum of electronics applications,
is extending its long-term commitment to support customers of the Company’s SPC56 automotive microcontrollers,
which are deployed in millions of powertrain, chassis, and body-electronics applications worldwide. ST’s
semiconductor innovations are powering automotive electrification and smart-driving trends that increase economy,
safety, and reliability. The Company continues to develop new and more advanced products that define the state of the
art, while maintaining its lifetime commitment to meet the unique needs of customers. Customers can extend the
lifetime of their successful products and continue to count on SPC56 general-purpose and performance automotive
microcontrollers for new designs, thanks to the simple porting of a consolidated design and proven software into new
applications, saving development resources and costs.

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Class-D Amplifier for High-Definition Automotive Audio from STMicroelectron-
ics (Switzerland) Adds Diagnostics for Safety Alerting
29
The HFDA801A from STMicroelectronics is a high-resolution audio amplifier that is specifically designed for compact, cost-effective
automotive applications. The HFDA801A is a 2MHz switching pulse-width modulation (PWM) Class-D amplifier with a quad-bridge
configuration. An integrated high-performance digital-to-analog converter (DAC) ensures hi-fi quality sound under any load condition,
with noiseless turn-on/turn-off and without creating any output artifacts. With a signal-to-noise ratio of 121dB, 120dB dynamic range,
and only 10μV output noise, the HFDA801A delivers an extraordinary level of audio performance from an inexpensive small form-factor
component. The feedback configuration with integrated L-C low-pass filter provides an ultra-wide flat frequency response up to 80kHz
and minimizes dependence on external components. The wide bandwidth allows use in high-definition (HD) audio applications, letting
designers rely on excellent linearity and low distortion that are independent of the inductor and capacitor quality. The specific architecture
implemented derives all required voltages internally, enabling the HFDA801A to draw its supply from the vehicle battery without the
need for additional power converters. The amplifier benefits from a wide range of load capabilities, ensuring stable performance even
while driving high power on low-impedance loads of 2Ω on all four channels.

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STMicroelectronics (Switzerland) Speeds Smart Devices to Market with Extra
Software for Microsoft® Azure RTOS Projects on STM32 MCUs
30
STMicroelectronics a global semiconductor leader serving customers across the spectrum of electronics applications, is strengthening
support for the next generation of smart connected devices powered by Microsoft® Azure RTOS, by releasing the first in a series of
richly featured STM32Cube Expansion Packages for product design teams. ST and Microsoft announced seamless access to the
Azure RTOS suite through ST’s STM32Cube* ecosystem in 2020. Building on that initiative, the new software packs provide
additional code examples that help overcome common engineering challenges to accelerate time to market. Royalty free, developers
can use and customize the examples out of the box. The first expansion pack, X-CUBE-AZRTOS-H7, gives a head-start to projects
targeted at using ST’s STM32H7 microcontrollers (MCUs), the highest performing series in the STM32 MCU family. ST will release
similar packs for other STM32 MCUs over the course of 2021. The STM32H7 series contains over 100 single-core and dual-core
variants, delivering processing performance up to the industry’s highest benchmark scores for MCUs based on Arm® Cortex®-M
processors, with powerful graphics-handling capabilities and hardware-based cyber-security.

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STMicroelectronics (Switzerland) Reveals Extreme Low-Power STM32U5
Microcontrollers with Advanced Performance and Cybersecurity
31
STMicroelectronics a global semiconductor leader serving customers across the spectrum of electronics applications,
has announced a new generation of extreme power-saving microcontrollers (MCUs), the STM32U5* series, to meet
the most demanding power/performance requirements for smart applications including wearables, personal medical
devices, home automation, and industrial sensors. The industry-leading STM32 MCUs, built upon the highly
energy-efficient Arm® Cortex®-M processors, are already in billions of domestic appliances, industrial controls,
computer peripherals, communication devices, and equipment managing smart cities and infrastructure. The new
STM32U5 series teams the efficient Arm Cortex-M33 core with ST’s innovative proprietary power-saving features and
on-chip IP cutting down energy demand while pumping up performance. The line also adds new state-of-the-art
features needed by today’s applications, including advanced cybersecurity with new hardware-based protection
targeting PSA and SESIP assurance level 3, as well as graphics accelerators for rich user experiences.

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Precision, High-Voltage Bi-directional Current-Sense Amplifiers from STMicroelectronics
(Switzerland) Boost Robustness and Power Efficiency
32
STMicroelectronics has introduced three precision high-voltage bi-directional current-sense amplifiers that provide the extra convenience of a Shutdown pin to maximize
energy savings. The TSC2010, TSC2011, and TSC2012 amplifiers also allow designers to minimize power dissipation by leveraging their precision characteristics to
select low sense-resistor values. The offset voltage is within ±200µV at 25°C, with less than 5µV/°C drift, and gain accuracy is within 0.3%, enabling the devices to
detect a voltage drop as low as 10mV full-scale to provide consistent and trusted measurements. The gain variety — 20V/V for the TSC2010, 60V/V for the TSC2011,
and 100V/V for the TSC2012 — gives flexibility to build precision current measurement, overcurrent protection, current monitoring, and current-feedback circuits for
many different industrial and automotive systems. Uses include data acquisition, motor control, solenoid control, instrumentation, test and measurement, and process
control. With their bi-directional capability, the three new amplifiers help designers trim their bill of materials by allowing a single sensing circuit to measure current
flowing in forward and reverse directions. The devices are also suitable for high-side and low-side connection, enabling the same part number to be used in both
configurations for easier inventory management. All the new devices have a wide supply voltage range, from 2.7V to 5.5V, adding further to their flexibility. Their wide
input-voltage tolerance allows sensing over a range of common-mode voltages from -20V to 70V at any supply voltage. With high gain-bandwidth product and fast slew
rate — 820kHz and 7.5V/µs in the TSC2010 — they ensure high accuracy and fast response. The devices feature an integrated EMI filter and 2kV HBM (Human Body
Model) ESD tolerance, ensuring robust performance, and operate over the industrial temperature range -40°C to 125°C. Designers can accelerate time to market by taking
advantage of the accompanying STEVAL-AETKT1V2 evaluation kit for a fast start to projects using any of the three devices.

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STMicroelectronics (Switzerland) Reveals STPay-Mobile Platform, Driving
Flexible and Scalable Virtual Ticketing and Payments
33
STMicroelectronics has launched STPay-Mobile, a platform that simplifies virtualization of security-critical public transit
ticketing and payment cards on smartphones and wearables. STPay-Mobile helps mobile-device manufacturers leverage
the features of ST’s ST54 secure System-on-Chip (SoC) to handle contactless transactions and protect sensitive
information, such as data and authentication credentials. Highlighting the value STPay-Mobile adds to card virtualization,
ST has announced details of a new ticketing solution for public transit that leverages the OnBoard™ platform created by
Snowball Technology Co. Ltd. This platform, together with STPay-Mobile managing services on the ST54 secure SoC,
lets smartphones and wearables host virtual tickets that are easily created by transit agencies and are convenient for
travelers to buy and use. To date, Snowball’s OnBoard platform has been chosen by 50 transit agencies in over 125 cities
worldwide, including all major cities in China. The platform is compatible with over 330 different models of smartphones
and wearables from leading brands. Its urban reach now exceeds 680 million people.

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STMicroelectronics (Switzerland) Powers Affordable Edge AI Development
with Computer-Vision Launchpad for STM32 Microcontrollers
34
A new AI firmware function pack and camera-module hardware bundle from STMicroelectronics enable embedded developers to build affordable and powerful
computer-vision applications running locally, at the Edge, on STM32* microcontrollers (MCUs). The STM32Cube function pack, FP-AI-VISION1, contains
several code examples demonstrating complete computer-vision applications running a convolutional neural network (CNN) on STM32H747 and easily portable
on all STM32 MCUs. The firmware proposes several application examples but lets developers retrain the neural networks with their own choice of data sets, giving
freedom and flexibility to address a wide variety of use cases. New features include support for USB VC camera (webcam mode), which allows simple image
acquisition, and code examples for food classification and human-presence detection to create a convenient visual “wakeword” for reactivating a system from
power-save mode. An article is available in the STM32 wiki that shows how to use the Teachable Machine online tool with STM32Cube.AI and the
FP-AI-VISION1 function pack to create an image classification application. The B-CAMS-OMV camera bundle is optimized for use with FP-AI-VISION1 and
provides the hardware required for training and deployment. The bundle contains ST’s MB1379 5-Mpixel OV5640 color camera module fitted to an adapter card
compatible with all STM32 Discovery and Evaluation boards with a ZIF connector. The adapter card can also be used with the ST VG5661 automotive grayscale
global-shutter camera. In addition, Waveshare and OpenMV connectors let users attach various third-party infrared and visible-spectrum cameras to address a
wider range of computer-vision applications An STM32 wiki article is available that shows how to integrate code generated using STM32Cube.AI in the OpenMV
ecosystem.

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STMicroelectronics (Switzerland) Eases Design of USB Type-C™ Power
Adapters with Highly Efficient Power Delivery and PPS Reference Design
35
STMicroelectronics has revealed a USB Type-C™ Power Delivery 3.0 reference design with Programmable Power Supply (PPS) support to accelerate the design of easy-to-use,
compact, and efficient power adapters up to 27W with zero-power operation when no cable is connected. USB PPS helps to save power, and reduce device-charging times and heat
dissipation, contributing also to cut bill-of-materials costs on the device side. The STEVAL-USBPD27S reference design combines the STM32G071 microcontroller (MCU), which
integrates a complete USB Type-C Power Delivery controller on-chip, with the STCH03 state-of-the-art PWM controller and TCPP01-M12 USB Type-C protection IC. With this
reference design, users can quickly build fast-charging USB power adapters that meet the stringent European CoC version 5 Tier-2 and US DOE Level VI requirements for minimum
four-point average efficiency in active mode and standby power below 40mW. The STM32G071 MCU handles the entire digital control section, including the algorithm to control
VBUS on the secondary side as well as ST’s unique and patented algorithm for adaptive synchronous rectification, which enhances energy efficiency. The VBUS-control algorithm
meets the USB Type-C Power Delivery and PPS specifications and implements cable-drop compensation for precise control of the supplied voltage. PPS support enables the output
voltage to be adjusted in 20mV steps between 3.3V and 11V, as well as current limiting adjustment in 50mA increments, to minimize conversion losses during charging. As an
MCU-based solution, the reference design gives users extra flexibility to implement additional customized application layers and to incorporate ongoing improvements as the USB
Power Delivery standard evolves. The power section of the STEVAL-USBPD27S leverages ST’s highly integrated STCH03 PWM controller, which features built-in high-voltage
start-up circuitry, primary-side constant-current output regulation, and advanced power management. Designed for quasi-resonant zero-voltage switching (ZVS) flyback converters,
the STCH03 ensures high efficiency, ultra-low standby consumption, and excellent dynamic performance. The STD7N65M6 MDmesh M6 primary-side high-voltage STPOWER
MOSFET delivers extremely high efficiency with optimized switching behavior in hard and soft switching modes.

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Complete Energy-Meter Evaluation Board from STMicroelectronics (Switzerland)
Combines Low-Cost Sensors and Robust Galvanic Isolation
36
A new evaluation board from STMicroelectronics speeds design of 3-phase AC Watt meters that meet the most stringent international quality and accuracy standards using
low-cost, electromagnetic-immune shunt sensors and advanced galvanic-isolation technology for superior reliability and robustness. The EVALSTPM-3PHISO evaluation
board combines the high-accuracy STPMS2 metering front-end IC and the advanced STISO621 digital isolator, with customizable turn-key firmware running on an STM32
microcontroller to compute metrology and power-quality data. The sensing circuitry and PCB layout are optimized to ensure robustness against EMI and a strong
signal-to-noise ratio, for high-accuracy measurement and post-processing computation. The STPMS2, a two-channel 24-bit second-order sigma-delta modulator, measures
voltage and current for each phase through an on-board voltage divider and a shunt current sensor. It then oversamples the signal using a synchronized 4MHz clock distributed
by the microcontroller and multiplexes voltage and current sigma-delta bitstreams on a single output pin. Three STPMS2 are used in the 3-phase system to collect voltage and
current data from each phase. The provided firmware leverages digital filters for sigma-delta modulators (DFSDMs) integrated in the chosen STM32 microcontroller to convert
the six bitstreams into 24-bit voltage and current values and computes all metrology data in real-time every 200µs. The firmware also implements a virtual com port that
provides access to internal parameters for reading metrology data, modifying the internal configuration, and calibrating the board. The STISO621 dual-channel digital isolator
is the first in a new series of ICs that leverage ST’s 6kV thick-oxide galvanic-isolation technology to transfer data between isolated domains in a variety of industrial
applications. The STISO621 features two independent channels with Schmitt-trigger inputs that ensure high noise immunity and keeps pulse distortion below 3ns. With a
maximum data rate of 100Mbit/s, 6000V impulse withstand voltage (VIOTM), and 1200V maximum repeating isolation voltage (VIORM), the STISO621 ensures faster data
transmission, longer lifetime, and higher reliability than conventional optical isolators.

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Texas Instruments (USA): Integrated Grade 0 BLDC motor driver shrinks 48-V
motor-drive systems as much as 30% in mild hybrid electric vehicles
37
Texas Instruments introduced a highly integrated Grade 0 brushless DC (BLDC) motor driver for 48-V high-power motor
control systems, such as traction inverters and starter generators in mild hybrid electric vehicles (MHEVs). The
DRV3255-Q1 can help designers shrink their motor system size by as much as 30%, while providing the industry’s highest
gate-drive current for increased protection and output power. Meeting the most stringent safety requirements, the new
motor driver was designed according to TI’s TÜV SÜD-certified functional safety development process, helping enable
up to Automotive Safety Integrity Level (ASIL) D. To help decrease greenhouse gas emissions globally, automobile
manufacturers are increasing the production of MHEVs, which use 48-V motor-drive systems to help reduce emissions
from a vehicle’s internal combustion engine. The TI Functional Safety-Compliant DRV3255-Q1 allows manufacturers to
design a motor-drive system to help enable MHEV systems up to ASIL D, supplying as much as 30 kW of motor power
which can improve the response time of a 48-V motor-drive system in heavy vehicles.

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Toshiba (Japan) Launches Thin and Compact LDO Regulators that Help to
Reduce Device Size and Stabilize Power Line Output
38
Toshiba Electronic Devices & Storage Corporation has launched the “TCR5RG series” of 45 LDO regulators, all housed in a
thin, compact WCSP4F package. The industry-leading high ripple rejection ratio of the new LDO regulators bring enhanced
power stabilization to DC power lines for mobile devices, such as wearables. Volume shipments start. The TCR5RG series
features an industry-leading high ripple rejection ratio of 100dB (typ.), achieved by combining a wide-gap circuit, a low-pass
filter that allows only extremely low frequencies to pass, and a low-noise, high-speed operational amplifier. They also feature
low output voltage noise and high output voltage accuracy. Together, these features enable the regulators to contribute to the
stabilization of power lines. The line-up includes 45 products with a maximum output current of 500mA, and output voltages
in the range of 0.9V to 5.0V, allowing users to select the output voltage best suited to their application. Housed in thin and
compact WCSP4F packages that measure 0.645mm x 0.645mm, the new LDO regulators are suitable for power line
applications in cameras and small devices such as smartphones and wearables requiring high density mounting.

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Toshiba (Japan) Announces 18TB MG09 Series Hard Disk Drives
39
Toshiba Electronic Devices & Storage Corporation announces the 18TB MG09 Series HDD, Toshiba’s first HDD models with energy-assisted
magnetic recording. The MG09 Series features Toshiba’s third-generation, 9-disk Helium-sealed design and Toshiba’s innovative Flux Control –
Microwave Assisted Magnetic Recording (FC-MAMR) technology, to advance Conventional Magnetic Recording (CMR) density to 2TB per disk,
achieving a total capacity of 18TB. Sample shipments of 18TB MG09 Series HDD to customers are expected to start sequentially at the end of
March 2021. With 12.5% more capacity than prior 16TB models, 18TB MG09 CMR drives are compatible with the widest range of applications
and operating systems. The MG09 are adapted to mixed random and sequential read and write workloads in both cloud-scale and traditional data
center use cases. The MG09 features 7,200rpm performance, a 550TB per year workload rating, and a choice of SATA and SAS interfaces—all in
a power-efficient Helium-sealed industry-standard, 3.5-inch form factor. The MG09 Series further illustrates Toshiba’s commitment to advancing
HDD design to meet the evolving needs for storage devices in cloud-scale servers and Object and File storage infrastructure. With its improved
power efficiency and 18TB capacity, the MG09 Series helps cloud-scale infrastructure advance storage density to reduce capex and improve TCO.
As data growth continues at an explosive pace, advanced 18TB MG09 with FC-MAMR technology will help cloud-scale service providers and
storage solution designers achieve higher storage densities for cloud, hybrid-cloud and on-premises rack-scale storage.

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Xilinx (USA) Revolutionizes the Modern Data Center with Software-Defined,
Hardware Accelerated Alveo SmartNICs
40
Addressing the demands of the modern data center, Xilinx, Inc. announced a range of new data center products and solutions, including a new
family of Alveo SmartNICs, smart world AI video analytics applications, an accelerated algorithmic trading reference design for sub-microsecond
trading, and the Xilinx App Store. most demanding and complex applications, from networking and AI analytics to financial trading, require
low-latency and real-time performance. Achieving this level of performance has been limited to expensive and lengthy hardware development.
With these new products and solutions, Xilinx is eliminating the barriers for software developers to quickly create and deploy software-defined,
hardware accelerated applications on Alveo accelerator cards. The Xilinx® Alveo™ SN1000 is the industry’s first family of composable
SmartNICs offering software-defined hardware acceleration for all function offloads. SN1000 SmartNICs directly offload CPU intensive tasks to
optimize networking performance, with an open architecture that can accelerate a broad range of network functions at line rate. Using the Vitis™
Networking platform and industry standard, high-level programming languages such as P4, C, and C++, software developers can create network
functions, protocols, and applications that operate in hardware on the SmartNIC. Vitis Networking allows organizations to quickly and easily
compose new, and tweak existing, network functions to handle new protocols and applications without replacing hardware, future proofing
investments.

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Kioxia and Western Digital (USA) Announce 6th-Generation 3D Flash
Memory
41
Kioxia Corporation and Western Digital Corp. announced that the companies have developed their sixth-generation, 162-layer 3D flash memory
technology. Marking the next milestone in the companies' 20-year joint-venture partnership, this is the companies' highest density and most
advanced 3D flash memory technology to date, utilizing a wide range of technology and manufacturing innovations. This sixth-generation 3D flash
memory features advanced architecture beyond conventional eight-stagger memory hole array and achieves up to 10 percent greater lateral cell
array density compared to the fifth-generation technology. This lateral scaling advancement, in combination with 162 layers of stacked vertical
memory, enables a 40 percent reduction in die size compared to the 112-layer stacking technology, optimizing cost. The Kioxia and Western Digital
teams also applied Circuit Under Array CMOS placement and four-plane operation, which together deliver nearly 2.4 times improvement in
program performance and 10 percent improvement in read latency compared to the previous generation. I/O performance also improves by 66
percent, enabling the next-generation interface to support the ever-increasing need for faster transfer rates. Overall, the new 3D flash memory
technology reduces the cost per bit, as well as increases the manufactured bits per wafer by 70 percent, compared with the previous generation.
Kioxia and Western Digital continue to drive innovation to ensure continued scaling to meet the needs of customers and their diverse applications.

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Seagate (Ireland) Unveils Lyve Cloud Built to Store, Activate, and Manage
the Massive Surge in Data
42
Seagate Technology plc a world leader in data storage and management solutions, introduced LyveTM Cloud storage-as-a-service platform, an
S3-compatible storage-only cloud. Lyve Cloud enables always-on mass capacity data storage and activation. It is designed as a simple, trusted, and
efficient service allowing enterprises to unlock the value of their massive unstructured datasets. Seagate is collaborating with Equinix, the world’s
digital infrastructure company, to make Lyve Cloud accessible to more customers. This collaboration will provide extensive interconnect
opportunities for additional cloud services and geographical expansion. By locating Lyve Cloud infrastructure in close proximity to Equinix Metal
™ within Equinix International Business Exchange™ (IBX®) data centers, customers can consume the scale and efficiency of object storage as a
service at the metro edge, while leveraging Equinix Fabric™ to interconnect sources of data to a variety of edge and cloud-based applications for
hybrid and multicloud architectures. Placing Lyve Cloud infrastructure in metro edge colocation data centers also enables reduced latency because
data is stored and processed closer to where it is generated. Lyve Cloud offers privacy, no lock-in, and no egress fees, allowing customers to retain
full control of their data while lowering TCO for storing massive datasets. Lyve Cloud’s ISO27001 and SOC2 certifications meet the data security
needs of enterprise customers and provide always-on encryption for data in motion and at rest.

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STMicroelectronics (Switzerland) Boosts Security Along with AI and IoT
Application Development with STM32MP1 Ecosystem Extensions
43
STMicroelectronics has announced extensions to the broad ecosystem that supports development with STM32MP1* dual-core microprocessors, including new
software packages and support for cutting-edge open-source security initiatives. By providing code for security mechanisms such as OP-TEE (Open Portable
Trusted Execution Environment) and the TF-A (Trusted Firmware-A) project, ST helps STM32MP1 developers address the key concepts of information security
in their applications: confidentiality, integrity, availability, and authenticity verification. In addition, ST has extended the roster of Authorized Partners in embedded
security with Sequitur Labs. EmSPARK Security Suite works with the Arm® TrustZone® architecture integral to the STM32MP1 and assists with secure
provisioning to simplify deploying connected devices while keeping secrets safe. In this, it is optimized for applications such as industrial control, building
automation, smart-home equipment, machine vision, automotive communication, and medical devices. These new resources join the STM32MP1 ecosystem
alongside solutions from Authorized Partners Prove&Run, TimeSys, and Witekio, which provide reliable and field-tested solutions to security-software
development challenges. ProvenRun helps STM32MP1 customers integrate security in their design by providing custom security engineering services (secure
boot, secure firmware, OP-TEE) and more advanced solutions leveraging on ProvenCore, a secure OS that has been certified. The TimeSys Vigiles® Vulnerability
Management Suite is embedded in OpenSTLinux and constantly watches for relevant vulnerabilities that open devices to cyberattacks. Vigiles also provides
remediation information for device lifecycle management. Witekio’s FullMetalUpdate open-source over-the-air (OTA) solution helps IoT platform operators
manage their own OTA updates, combining security with flexibility and economy.

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Delta (Taiwan) Named Supplier Engagement Leader in CDP's Supplier Engagement
Rating (SER) for Its Continuous Development of a Sustainable Value Chain
44
Delta, a global leader in power and thermal management solutions, announced it has been awarded the highest rating of "A"—Supplier Engagement Leader
in the 2020 Supplier Engagement Rating (SER) conducted by CDP. The aforementioned “A” rating derives from the highest scores in the key rating items,
namely "Supplier Engagement" (Note 1), "Scope 3 Emissions" (Note 2), and "Overall CDP Climate Change Performance," ranking among the top 7%
assessed enterprises. This Supplier Engagement Leader recognition also follows Delta’s success in attaining "double-A (leadership level)" rating in the 2020
CDP evaluation for two major environmental items: "Climate Change" and "Water Security", thus, three key honors by CDP for Delta in 2020. These
accolades demonstrate that Delta not only responds to climate change with actions, but also collaborates with business partners actively to build a sustainable
value chain, and its efforts and outcomes are highly recognized internationally. Delta regards suppliers as long-term partners and is committed to enhancing
the management of environmental, social, governance (ESG) aspects of the green supply chain and implementing the Supplier Sustainability Management
Regulations. In addition, it conducts relevant ESG questionnaire surveys for different types of suppliers each year to cover the operation of the entire supply
chain system and be more informed of different types of suppliers, to increase the completion rate of risk identification significantly, while reducing the risk
of supplier chain disruption effectively through audits, corrections, counseling, and training. Furthermore, Delta has continued to enhance operational
management and risk identification, and conducted in-depth analyses of the supplier chain disruption risk caused by drought risks under climate change.
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KYOCERA (Japan) Recognized as Supplier Engagement Leader by
Non-Profit CDP for Two Consecutive Years
45
Kyocera Corporation announced that it has been recognized as a “Supplier Engagement Leader” by international
non-profit CDP for the second consecutive year, on the basis of Kyocera’s initiatives to reduce greenhouse gas emissions
throughout its value chain. Based on CDP’s fifth annual survey of suppliers, the 2020 “Supplier Engagement
Leaderboard” lists companies recognized for outstanding environmental records and targets. The Kyocera Group has set
a medium- and long-term environmental target*1 of reducing greenhouse gas emissions. CDP praised Kyocera’s
comprehensive approach to reducing greenhouse gas emission and named Kyocera as a leading company on the list. This
year, CDP recognized approximately 400 companies, representing just 7% of the total candidates. The 2020 list includes
approximately 80 Japanese companies. The Kyocera Group will continue to contribute to the realization of a sustainable,
decarbonized society by pursuing new greenhouse gas reduction approaches beyond conventional frameworks.
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Lenovo (Hong Kong) Recognized as CDP Supplier Engagement Leader
46
Lenovo has been recognized by CDP (formerly known as Carbon Disclosure Project) as a Supplier Engagement Leader,
acknowledging its efforts to measure and limit greenhouse gas emissions throughout its supply chain. Lenovo’s recognition
as a Supplier Engagement Leader puts it in the top 7% of companies who disclosed their information in the full CDP climate
questionnaire. The recognition was awarded for Lenovo’s 2020 performance in key areas like governance, targets for
emissions reduction, and accounting of Scope 3 emissions (as measured by supplier evaluations). Scope 3 greenhouse gas
emissions relate to emissions created through out a company’s value chain, and as referenced by CDP’s Sonya Bhonsle, are
greater than scope 1 and 2 direct greenhouse gas emissions and more difficult to measure. In 2020, Lenovo announced its next
generation of emission reduction targets. The new targets represent ambitious goals to reduce scope 1, 2, and 3 greenhouse
gas emissions by 2030. The goals are aligned to and approved by the Science Based Targets initiative, ensuring that they are
contributing to a wider body of collaborative efforts to understand and limit climate change.
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Murata (Japan) ID Solutions and Bayer receive logistics award for RFID
and Blockchain project
47
Murata Manufacturing Co., Ltd.’s subsidiary Murata ID Solutions received the award “Il logistico dell’Anno 2020" together with
Bayer S.p.A. for the “RFID and Blockchain project”. The award for the innovative approach to Technology and Logistics 4.0 was
given by the Italian logistics Association “Assologistica”. The Pioneering RFID project has enabled Bayer to gain full and real-time
visibility over its distribution processes, improving security, transparency, traceability and efficiency. The RFID-based project is the
first large-scale application of this technology in the pharmaceutical supply chain. Bayer serves up to 17,000 customers in Italy
relying on an extensive distribution network. The RFID system developed by ID Solutions allows the comprehensive tracking of
individual boxes of pharmaceutical products as well as the sustainable GreenPallets on which they are shipped. Before implementing
RFID, Bayer could not track deliveries in real-time nor did they have visibility of the shipments’ transit in all transportation hubs and
subsidiaries. Any problems, such as missing goods, were only discovered when the customers received their deliveries. each box of
products and every GreenPallet are provided with an RFID tag and scanned at every single stage of the supply chain providing
real-time visibility of the entire distribution process.
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Ethisphere announces ON Semiconductor (USA) as one of the 2021 World’s Most
Ethical Companies for the Sixth Consecutive Time Chinese Japanese Korean
48
ON Semiconductor driving energy-efficient innovations, has been recognized by Ethisphere, a global leader in
defining and advancing the standards of ethical business practices, as one of the World’s Most Ethical Companies. This
is the sixth consecutive year ON Semiconductor has received the honor and is one of only three honorees in the
semiconductor industry. The company is dedicated to maintaining high ethical business standards with employees,
customers, shareholders and other stakeholders. In living up to the company’s core values, the actions of every
employee reflect an individual and collective effort to create an ethical work environment for their co-workers and
business partners, driving further shareholder value.
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TE Connectivity (Switzerland) named one of the World's Most Ethical
Companies for seventh year
49
As a sign of its longstanding commitment to ethical business practices, TE Connectivity, a world leader in connectors and sensors,
has been named as one of the 2021 World's Most Ethical Companies by Ethisphere. TE has been recognized for seven years in a row
and is one of only two 2021 honorees in the electronics and components industry. Ethisphere honored 135 companies this year,
spanning 22 countries and 47 industries. TE's ethics and compliance culture is designed to empower its employees and partners to do
business in a way that does not compromise the company's core values of integrity, accountability, teamwork and innovation. TE
offers a multitude of resources to ensure employees understand the company's values, including Ethical Connections, a tool that
enables managers to facilitate discussions about ethical dilemmas with their teams. TE managers have conducted nearly 18,000 of
these conversations since it was created in 2013. The World's Most Ethical Companies assessment process includes more than 200
questions on culture, environmental and social practices, ethics and compliance activities, governance, diversity and initiatives to
support a strong value chain. This year, the question set was expanded to gauge how applicants are adapting and responding to the
global health pandemic, environmental, social, and governance factors, safety, equity, and inclusion and social justice.
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Toshiba (Japan) Recognized by CDP as Supplier Engagement Leader in
Efforts to Counter Climate Change throughout Value Chain
50
Toshiba Corporation has been recognized as a “Supplier Engagement Leader” in the Supplier Engagement Rating (SER) conducted by CDP,
an international non-profit organization. The selection is based on Toshiba Group’s efforts to reduce greenhouse gas emissions throughout its
value chain. SER measures how effectively companies are engaging with their suppliers on climate change. CDP assesses companies and their
SER on the basis of responses to an annual climate-change related questionnaire that covers governance, targets, Scope 3 emissions, and value
chain engagement. In FY2020, CDP assessed over 5,500 companies worldwide, and 396 companies, including Toshiba, were selected for the
prestigious Supplier Engagement Rating Leaderboard. Toshiba Group’s management, motivated by the Group’s basic commitment,
“Committed to People, Committed to the Future,” positions the environment as a top priority, and promotes initiatives toward realizing a
sustainable society. Toshiba Group’s “Environmental Future Vision 2050,” announced in November 2020, clearly positions "Response to
Climate Change" as an important pillar for action. Toward contributing to net zero greenhouse gas (GHG) emissions in society by 2050,
Toshiba Group aims to cut emissions throughout its value chain by 50% in FY2030, against FY2019. Toshiba Group’s GHG reduction targets
for FY2030 have been approved as “science-based” by the Science Based Targets initiative.
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Western Digital (USA) Named One of the World's Most Ethical Companies
by Ethisphere for the Third Year in a Row
51
Western Digital Corp. a leader in data infrastructure, announced it has been recognized by the Ethisphere Institute for
the third year in a row as one of the World's Most Ethical Companies. Ethisphere Institute, a global leader in defining
and advancing the standards of ethical business practices, recognized a total of 135 honorees this year, spanning 22
countries and 47 industries. Western Digital was one of just six companies recognized in the technology industry for
its strong leadership and ongoing commitment to establishing honest and ethical conduct. In addition to Ethisphere
assessing data responsive to more than 200 questions on a company's culture, environmental, ethics and diversity
initiatives, this year's process also evaluated how applicants were adapting and responding to the global health
pandemic, environmental, social and governance factors, as well as safety, equity, inclusion and social justice.
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American Airlines And Amadeus (USA) Lead The Way In Enhanced
Travel Retailing
52
American Airlines and Amadeus, two world leaders in shaping a new age of airline retailing, announce that they’ve renewed their content
distribution agreement, continuing to make the airline’s flights and services available to Amadeus-powered travel agencies and corporations
around the world via the Amadeus Travel Platform. Included in the agreement is New Distribution Capability (NDC)-enabled content from
American Airlines that will go live globally in the Amadeus Travel Platform in the coming months. This new content will equip travel advisors
to purchase a Main Plus offer, which includes a Main Cabin Extra or Preferred Seat along with an additional free checked bag and Group 5
boarding privileges. This new feature will be for all NDC-enabled agencies booking travel on any American-operated flight. This marks a
significant milestone for both companies as they’ve worked hand-in-hand in recent years to make enhanced content via NDC an industry
reality at scale and beneficial to all parties involved in buying and selling airline travel. agreement seals American Airlines and Amadeus’
collaboration for years to come. As the saying goes, content is king, and American Airlines will provide enhanced content and functionality
to deliver greater choice for travelers, and new selling experiences for travel agencies. Delivering this experience is the Amadeus Travel
Platform, a robust technology platform based on fully open systems with the broadest range of global travel content.
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Taiwan’s Eztravel Joins Amadeus’ NDC [X] To Spearhead Innovation
With NDC-Enabled API
53
EzTravel, Taiwan’s leading online travel agency (OTA), is implementing the cutting-edge Amadeus Travel API. This
NDC-enabled solution gives OTAs in Asia Pacific and across the world access to new content and fares from airlines
via NDC connectivity. NDC is modernizing retailing, but it requires the right technical infrastructure. This is why
ezTravel chose Amadeus NDC [X] as its partner to help implement and power the new standard. The new
NDC-enabled Amadeus Travel API will give ezTravel access to aggregated NDC and non-NDC content. Through this
solution, ezTravel will also have access to the main servicing capabilities that an agency requires once a booking via
NDC has been made, such as changes, cancellations, or adding ancillaries. As the first travel agency in Taiwan to adopt
an NDC-enabled web services solution to fit the needs of OTAs, ezTravel customers will be empowered to shop, order,
and pay for flights and related services, and to add ancillaries and services to the booking, using the NDC standard.
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ASML (Netherland) signs 10-year green power purchase agreement with
RWE
54
ASML and RWE, one of the world’s leading renewable energy companies and a major player in global energy trading,
have signed a power purchase agreement (PPA). Under the terms of the 10-year agreement starting in 2021, ASML will
be provided with 257 gigawatt hours of green electricity per year from RWE. The power will be delivered from a
portfolio of various renewable energy sources across different technologies: two new RWE onshore wind farms in the
Netherlands, a Belgian offshore wind farm and a Dutch solar plant. The two RWE windfarms Oostpolderdijk and
Westereems are located near Eemshaven and will be commissioned during 2021. The offshore wind farm Noordwester
2, off the coast of Zeebrugge, is operated by the Belgian company Parkwind, and the solar plant, owned by a company
in which RWE holds a minority share, is situated near Borssele.
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I-Byte Technology March 2021

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