Thin Substrate Hanlding

1. Daetec
Experience
and
Success
Temporary
Adhesives
for
Thin
Substrate
Handling
&
Backside
Processing
Daetec,
LLC
2011
DAETEC
Diversified
Applica@ons
Engineering
Technologies
1

2. Product
Development Substrate
Handling
Fab Mftg
DAETEC
Support
Analytical
Testing
Bridging Your Success
Process
Toll Development
Intellectual
Property Support
DAETEC
Diversified
Applica@ons
Engineering
Technologies
2

3. Daetec
Business
Model
• What
We
Do:
Product
development
and
consul>ng
• How
We
Do
it:
Formulate
commercially
available
ingredients
&
apply
to
a
process
• Primary
Experience:
Coa>ngs
&
cleaning
products
• Deliverables:
New
product
or
ancillary
• Clients:
Materials
&
equipment
suppliers,
end-­‐
users
(manufacturing)
DAETEC
Diversified
Applica@ons
Engineering
Technologies
3

4. Product
&
Process
Development
Resin Application via Spin Coater
Thickness vs Spin Speed
FTIR of DUV Resist on Silicon
GATR Accessory
30.00 100.0
GenTak Adhesive 98.0
v = 3,600
25.00
Thickness
achieve
>25um
Static Dispense, 1min Spin 96.0
Hot Plate Cure 1min @100C
Thickness (um)
Transmittance (%)
94.0
1610 cm-1
20.00 92.0
v = 800 90.0
1510 cm-1 1450 cm-1
88.0
15.00 v = 300 86.0
Top: Resist Reference, 3um
v = 160 84.0
10.00 Bottom (2): 1) Resist @ 16A, 2) Blank 1170 cm-1
82.0
v = viscosity 80.0
5.00 1700 1600 1500 1400 1300 1200 1100
0 1000 2000 3000 4000 5000 6000 Wavenumber (cm-1)
Cure
Condi@ons
-­‐
Analy@cal
Spin Speed (rpm)
Eng.
Curves,
Adhesion
Equipment
Applica@ons
&
Diagnos@cs
Cleans
&
Stability
Tests
DAETEC
Diversified
Applica@ons
Engineering
Technologies
4

5. Concept
to
Commercializa>on
Daetec
Daetec
Daetec
Proof
of
Demo
Prototype
Concept
Client
Client
Daetec
Mass
Commercial
Technology
Produc@on
Scale-­‐Up
Transfer
Timing,
Demo
–
Tech
Transfer
~6mos
DAETEC
Diversified
Applica@ons
Engineering
Technologies
5

6. Daetec
Working
Rela>onship
Suppor2ng
Market
Leaders
• The
staff
at
Daetec
have
developed
products,
patents,
wriUen
papers,
and
presented
work
with
a
wide
number
of
leaders
in
the
industry.
Our
work
spans
temporary
adhesives
used
in
3DIC
to
PR
and
residue
removal
processes.
DAETEC
Diversified
Applica@ons
Engineering
Technologies
6

7. What
is
3DP?
• 3DP
–
3D
Packaging
(Chip
Stacking)
• Process:
Thinning,
TSVs
for
connec>vity,
metal
for
heat
dissipa>on,
stacking
• Similar
or
mul>ple
types
of
chips
DAETEC
Diversified
Applica@ons
Engineering
Technologies
7

8. Thin
Wafer
support
Thin
Wafer
Thickness
Chem
&
Single
Backside
Handling
Min
(um)
Therm
Wafer
or
Processing
Resistant
Batch
Support
Tape
>50
No
Both
No
Vacuum
>50
No
Single
No
Chuck
Adhesive
<25
Yes
Both
Yes
Bonded
Carrier
Thinner
is
Must
be
Versa@lity
Must
do
BeXer
Resistant
Is
Best
Backside
Processing
DAETEC
Diversified
Applica@ons
Engineering
Technologies
8

9. Temporary
Spin-­‐On
Adhesive
Coa@ng
and
Moun@ng
Model
Substrate
with
Coat
&
fix
on
substrate
So]/hard
bake
topography
Penetra@on
and
seng
Drive-­‐off
vola@les,
planarize
Bonding
to
carrier
Adhesion
on
cooling
Substrate
Thinning
Planarized
substrate
surface
Maintain
pressure
Grind,
polish,
stress
relief
Carrier
wafer
is
mounted
to
the
wafer
to
be
thinned
and
used
to
“handle”
or
“support”
the
thinned
wafer
through
all
the
steps
of
backside
processing
DAETEC
Diversified
Applica@ons
Engineering
Technologies
9

10. Integra>ng
Thin
Wafers
&
Bumping
Through Hole
Contact Bond Pad
Device Build Completed
Wafer
Full size wafer
Solder Bump
Bumps
Complete
Thinned Wafer
Carrier or no- Thinning
&
Back-­‐
carrier attached
Vias and Side
Processing
Using
metallization
Adhesive/Carrier
Flip-chip to
solder bump on
board lead
mount with Flip-­‐chip
mounted
epoxy
To
board
DAETEC
Diversified
Applica@ons
Engineering
Technologies
10

11. Range of Coatings Available
• Solvent or water casting
• Thermoplastic or thermoset
• Evaporative (bake) or UV initiated cure
• Thermal resistance min. 200C; systems
at >500C for extended time are possible
• Many are moisture and/or chemical
resistant
• Transparency is possible
DAETEC
Diversified
Applica@ons
Engineering
Technologies
11

12. Example Coating Systems
Chemistry
Cure
Thickness
Thermal
Moisture
Method
Resistance
Resistance
Epoxy
UV
<20um
>275C
Yes
Rubber
Evap
<15um
>250C
Yes
Poly-­‐phenylene
Evap
<10um
>330C
Yes
Imidazole
Evap.
<5um
>450C
Yes
Biphenyl
Evap.
<10um
>300C
No
Sulfonate
+
Polyester
Acrylic
UV
<20um
<250C
Yes
Silicone
Cataly@c
<10um
>300C
Yes
PEI
Evap
<10um
>400C
Yes
Hybrid
system
Evap
>50um
>500C
Yes
DAETEC
Diversified
Applica@ons
Engineering
Technologies
12

13. Tunable Properties
• Thickness – carrier solvent and solids
• Cure condition – material dependent
• Adhesion – neat, promoter, primer
• Outgas – process dependent (i.e. CVD)
• Hardness – crosslinking extent
• Scratch resistance – crosslink, additives
• Rework or cleans – inhibitor addition
DAETEC
Diversified
Applica@ons
Engineering
Technologies
13

14. Process
Development
Spin-­‐Coat
UV
Cure
Molding
Wafer
w/
devices
Spray
Heat
Cure
(Final)
DAETEC
Diversified
Applica@ons
Engineering
Technologies
14

15. Coating Application Options
Spin-Coating Spray-Coating
DAETEC
Diversified
Applica@ons
Engineering
Technologies
15

16. Define UV Operating Window
Resin Cutoff 405-415nm
I-line G-line
365nm 436nm
DAETEC
Diversified
Applica@ons
Engineering
Technologies
16

17. DAROCUR 1173 % in Acetonitrile Wavelength (nm) IRGACURE 184 % in Acetonitrile Wavelength (nm)
3 3
2.5 2.5
Absorbance
Absorbance
2 2
1.5 1.5
1 1
0.5 0.5
0 0
200 220 240 260 280 300 320 340 360 380 400 420 440 460 480 500 200 220 240 260 280 300 320 340 360 380 400 420 440 460 480 500
IRGACURE 754 % in Acetonitrile Wavelength (nm) IRGACURE 500 % in Acetonitrile Wavelength (nm)
Free Rad
3 3
2.5 2.5
Absorbance
Absorbance
2 2
1.5 1.5
Initiators
1 1
0.5 0.5
0 0
200 220 240 260 280 300 320 340 360 380 400 420 440 460 480 500 200 220 240 260 280 300 320 340 360 380 400 420 440 460 480 500
IRGACURE 369 % in Acetonitrile Wavelength (nm) IRGACURE 907 % in Acetonitrile Wavelength (nm)
3 3
2.5 2.5
Most are I-line
Absorbance
Absorbance
2 2
1.5 1.5
1 1
0.5 0.5
0 0
200 220 240 260 280 300 320 340 360 380 400 420 440 460 480 500 200 220 240 260 280 300 320 340 360 380 400 420 440 460 480 500
Few are G-line
IRGACURE 1300 % in Acetonitrile Wavelength (nm) IRGACURE 819 % in Acetonitrile Wavelength (nm)
3 3
2.5 2.5
Absorbance
Absorbance
2 2
1.5 1.5
1 1
0.5 0.5
0 0
200 220 240 260 280 300 320 340 360 380 400 420 440 460 480 500 200 220 240 260 280 300 320 340 360 380 400 420 440 460 480 500
IRGACURE 250 % in Acetonitrile Wavelength (nm) IRGACURE 784 % in 1-Methyl-2-pyrrolidone (NMP) Wavelength (nm)
1.0 3.5
3
0.8
2.5
Absorbance
Absorbance
0.6
2
1.5
0.4
1
0.2
0.5
0.0 0
200 220 240 260 280 300 320 340 360 380 400 420 440 460 480 500 250 300 350 400 450 500 550 600
0.10 0.010 0.001
DAETEC
Diversified
Applica@ons
Engineering
Technologies
17

18. Simple and Rapid UV Curing
Low emission source UV LED Lamp
UV LED Designed Source
DAETEC
Diversified
Applica@ons
Engineering
Technologies
18

19. LED vs. Hg-Arc LED
Narrow
Emission
DAETEC
Diversified
Applica@ons
Engineering
Technologies
19

20. Low Outgas Product for CVD
Targets for successful CVD processing:
• Low permeability coating
• High Tg
• If amorphous, high softening/melting point
• Softening/melt pt is > process temp
• Design cure program as > process temp
DAETEC
Diversified
Applica@ons
Engineering
Technologies
20

21. Barrier Usage for Reduced Outgas
Gas Barrier
Properties
Assist with
formulating low
outgas coatings
DAETEC
Diversified
Applica@ons
Engineering
Technologies
21

22. Process Overlay
SP – softening point
50 100 CVD
150 200 250
Cure
Program
SP
De-­‐Bond
50 100 150 200 250
Temperature
DAETEC
Diversified
Applica@ons
Engineering
Technologies
22

23. De-Bonding
Rubber,
olefinic
&
high
MW
hydrocarbon
polymers,
blends
Acrylic,
styrenic,
and
blends
Polyimide
&
silicone
DAETEC
Diversified
Applica@ons
Engineering
Technologies
23

24. Low COO Development for Solar
• Solar manufacturer of <10um thick substrates
• Suggest to eliminate spin-coating adhesive
with a film lamination practice
• Use SEMI Std E35 for COO comparison of
the technologies; use a ratio between COO2
(new) and COO1 (current)
• Assumptions: similar yield, internal costs,
scrap, life, maintenance, etc.
• Tool costs, service, support, etc., identified as
a factor of material costs
DAETEC
Diversified
Applica@ons
Engineering
Technologies
24

25. COO for Technology Comparison
Adhesive
Liquid
Spin-Coat Process
Adhesive
Film lamination Process
DAETEC
Diversified
Applica@ons
Engineering
Technologies
25

26. COO Comparison of Technologies
COO
=
F$+R$+Y$
Costs
=
L×T×Y×U
Product
Item
Defini@on
F$
Fixed
Costs
COO2 Film Adhesive
R$
Recurring
Costs
COO1 = Liquid Adhesive
Y$
Yield
Cost
(scrap)
L
Equipment
Life
T
Throughput
Y
Composite
Yield
U
U@liza@on
DAETEC
Diversified
Applica@ons
Engineering
Technologies
26

27. COO Calculations
COO
2
F$2+R$2+0
L×T×Y×U
COO
1
=
L×33T2×Y×U
X
F$ +R$ +0
1 1
COO
(0.38R$ +R$
)
0
2 = 2
2
=
.038R$2 = 0.0027
COO
1
33(0.087R$ +R$
)
R$
1 1 1
The COO for integrating a film adhesive is 0.3% of
the COO for a liquid adhesive.
DAETEC
Diversified
Applica@ons
Engineering
Technologies
27

28. Daetec’s
Experience
Temporary
Adhesive
Development
Date Description Customer Chemistry Product
Pre-2000 Wafer dicing & Johansen Rosin/ AquaBond
cleans Technology oligomer 55 & 85
2000 First spin-on GCC – Rosin/ GenTak 230
adhesive Motorola urethane
2004 First spin-on high- GCC – Silicone GenTak 330
temp thermoset INTEL
2005 First spin-on high BSI Rubber BSI HT1010
temp, acid resist
2009 First spin & spray SUSS Acrylic SS1101
wafer molding composite
2011 First wafer TCTI Urethane Adh-U
lamination for solar
DAETEC
Diversified
Applica@ons
Engineering
Technologies
28

29. Daetec Issued Patents
Temporary Adhesives for Thin Substrates
• US Patent #6,869,894: Spin-on adhesive for temporary
wafer coating and mounting to support wafer thinning and
backside processing
• US Patent #7,098,152: Adhesive support method for wafer
coating, thinning, and backside processing
• US Patent #7,232,770: High temperature and chemical
resistant process for wafer thinning and backside processing
• US Patent #7,678,861: Thermal and chemical-resistant acid
protection coating material and spin-on thermoplastic
adhesive
• Two additional applications in 2009 (not-issued)
DAETEC
Diversified
Applica@ons
Engineering
Technologies
29

30. Daetec
for
Temporary
Adhesives
• Include
an
expert
on
your
team
• Low-­‐cost
adhesives
are
available
• Increase
throughput
-­‐
migrate
from
single-­‐
wafer
to
batch
(from
6
wph
to
>100
wph)
• Process
tuning
to
your
process
• You
own
the
adhesive
and
process
• Conven>onal
comparison,
COO
is
<50%
and
<10%
depending
upon
usage
DAETEC
Diversified
Applica@ons
Engineering
Technologies
30

31. Contact for More Information
• DAETEC provides new product development,
consulting, and technical support to solve
manufacturing problems and introduce new
options of doing business.
• Diversified Applications Engineering
Technologies (DAETEC)
Camarillo, CA (USA) (805) 484-5546
jmoore@daetec.com; www.DAETEC.com
DAETEC
Diversified
Applica@ons
Engineering
Technologies
31