post-SMT-formable LED pcb substrate

1. A stunning choice for “3D structuring LED Light”
TacLED-3D
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2. Structure and Features
 Structure
Dielectric
Available Metal
(Al2O3 filled PTFE)
Cu
Grade
Dielectric Thermal
Thickness Thickness
Conductivity Type
(㎛) (mm)
(W/m·K)
Base Metal
Aluminium 0.6
TacLED-3D- (A-5052), 1.0
1.0 85
10/85 Copper 1.5
(C-106) 2.0
 Features
● Bendable and formable for 3D LED light
● Excellent heat dissipation
● Ultra high thermal resistance
● Superior dielectric adhesion strength on Al and Copper
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3. General Properties
Typical Values
Properties Test Method Unit TacLED-3D-10/85
Thermal Conductivity(k) ASTM E1461 W/m∙K 1.0
Dielectric Thickness(t) - µm 85
Thermal Impedance(t/k)*1 - ℃ in2/W 0.13
kg/cm 2.0
IPC-TM-650 2.4.8
Peel Strength(1oz ED Cu)
(Test Condition A)
lbs/in 11
ASTM D149
Dielectric Breakdown kV(kV/mm) > 3(35.0)
(Test Condition A)
Dielectric Constant @10GHz - 4.2
IPC-TM-650 2.5.5.5.1 mod.
Dissipation Factor @10GHz - 0.0016
Solder Resistance(@300℃) - min > 20
Surface Resistivity IPC-TM-650 2.5.17.1 Ω 1.5E+13
Volume Resistivity IPC-TM-650 2.5.17.1 Ω∙㎝ 2.5E+12
Moisture Absorption IPC-TM-650 2.6.2.1 % < 0.05
Tg*2 - ℃ 327
CTE[α1(50℃~250℃), X=Y/Z axis] ASTM D3386(TMA) ppm/℃ 18/65
Flammability Rating UL-94 - On process
*1 Calculated Value, *2 Melting Point
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4. Applications for 3D LED Light
 DK Thermal’s products
(WWW.DKThermal.co.uk)
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5. Hi-Pot Test in 3D Structure
☞ Bend Hi-Pot Test ( Compare to TacLED )
√. Test Condition
- Peak Voltage : DC3000 volts and limited current 1mA
- Ramp rate to peak voltage : 1000 volts per second
- Hold time at peak voltage : 2 seconds
√. Specimen Trace lengthXwidth : 180mmX200㎛
√. Degree of bend
90° 45° 20°
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6. ▶ Stretched Result ( Bending with dielectric on outside )
3.5 3.5
TacLED-3D 10/85 C2/Al1.5mm TacLED-3D 10/85 C2/Al1.0mm
3.0 3R 3.0
4R 3R
2.5 2.5
conventional 4R
2.0 2.0
1.5 1.5
1.0 1.0
0.5 0.5
0.0 0.0
no bend 90° 45° 20° no bend 90° 45° 20°
3.5 3.5
TacLED-3D 10/85 C1/Al 0.8mm TacLED-3D 10/85 C1/Al 0.6mm
3.0 3.0
3R
2.5 3R
2.5
4R
4R
2.0 2.0
1.5 1.5
1.0 1.0
0.5 0.5
0.0 0.0
no bend 90° 45° 20° no bend 90° 45° 20°
※ All specimens passed 3KV Hi-Pot test in Compressed Bending
( Bending with dielectric on inside )
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7. ▶ Complex bending ( Stretched + Compressed ) ▶ Twist Bending ( Stretched )
1 2 3 4 5 1 2 3 4 5
1 2 3 4 5
Items No Bend Complex 90° Complex 45° Twist
1 TacLED-3D 10/85 C2/Al 1.5mm 3 KV Pass 1.670 KV 1.359 KV 1.625 KV
2 TacLED-3D 10/85 C2/Al 1.0mm 3 KV Pass 1.658 KV 1.362 KV 1.354 KV
3 TacLED-3D 10/85 C2/Al 0.8mm 3 KV Pass 1.658 KV 1.293 KV 1.423 KV
4 TacLED-3D 10/85 C2/Al 0.6mm 3 KV Pass 1.598 KV 1.230 KV 1.326 KV
5 TacLED 10/85 C1/Al 1.5mm 3 KV Pass 0.667 KV 0.564 KV 0.661 KV
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8. Complex bending ( Stretched + Compressed )+Twist Bending ( Stretched )
3.5
3D C2/Al 1.5mm
3.0
3D C2/Al 1.0mm
2.5 3D C2/Al 0.8mm
3D C2/Al 0.6mm
2.0
TacLED C1/Al .5mm
1.5
1.0
0.5
0.0
No Bend Complex 90° Complex 45° Twist
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9. ▶ TacLED-3D-10/85 C2/Al1.5 ▶ TacLED -10/85 C2/Al1.5
No microcrack Microcrack
in PTFE in epoxy
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10. Bending Test
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11. Repeated Bending with 45 degree /4x bending
K Volts
3.5
TacLED-3D 10/85 stanfard copper
TacLED-3D 10/85 High Elongation copper
3.0
TacLED 10/85 stanfard copper
2.5
2.0
1.5
1.0
0.5
0.0
0 1 2 3
times
※ Circuit of TacLED 10/85 was opened
after twice repeated bending
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12. Bending Hi-Pot Property (standard copper type vs. high elongation copper)
K Volts
3.5
3.0
2.5
2.0
1.5
1.0 TacLED-3D 10/85 stanfard copper ( 3R)
TacLED-3D 10/85 stanfard copper ( 4R)
0.5 TacLED-3D 10/85 High Elongation copper(3R)
TacLED-3D 10/85 High Elongation copper(4R)
0.0
No bend 90° 45° 20°
times
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13. Bending Reliability Check by X-Ray
√. Specimen : -. TacLED-10/85 C2/Al1.5mm without/with solder resist ink coating
-. TacLED-3D-10/85 C2/Al1.5mm without/with solder resist ink coating
√. Bending : -. Angle : No bend -> 90 ° , 45 °, 20 ° & twist
-. Direction : Stretched , Compressed
( hard to define defect after compressed direction bending )
√. Test Equipment : X- eye SF160 model
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14. No Bend 90° 45° 20° Twist
With solder resist coating
Without solder resist coating
TacLED-
10/85 C2/Al
1.5mm With solder resist coating Without solder resist coating
flexible solder
resist req.
※ open circuit and pad (land) lifting after bending
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15. No Bend 90° 45° 20° Twist
With solder resist coating
Without solder resist coating
TacLED-
10/85-3D
C2/Al
1.5mm With solder resist coating Without solder resist coating
※ No open circuit after bending but corner of pad was slightly
lifted after 20 ° bending
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16. Heat Dissipation
 Overall Thermal Conductivity and Dielectric Thermal Impedance
Base Metal
Trace Dielectric Dielectric Overall
Copper Thermal Conductivity Thermal Impedance*1 Thermal Conductivity*2
(oz) Al-5052 Cu (W/m·K) (℃㎠/W) / (℃in2/W) (W/m·K)
(mm) (mm)
1 1.0 1 0.85 / 0.13 25.0
1 1.0 1 0.85 / 0.13 34.0
*1 Calculated Data
*2 Measured in Laser Flash in Ajou Univ. Lab. in 2010
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17. Thermal Resistance
 Specimen : 2” x 2”, n=12
 Test Condition : Floating for 30min @300℃
Solder Float Tester (Solder Pot)
 Result : No Blister and No Delamination
1 2 3 4 5 6 7 8 9 10 11 12
OK OK OK OK OK OK OK OK OK OK OK OK
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18. Peel Strength
 Specimen : 2oz Cu / Al 1.5mm Peel Strength Tester (Instron)
 Test Condition : A Condition
E-0.5/260
D-2/100
 Result : [Unit : lbs/in]
Item 1 2 3 4 5 6 7 8 9 10 AVG.
A 18.9 16.3 16.3 16.2 17.8 17.5 17.7 16.2 17.3 17.3 17.1
E-0.5/260 16.6 12.8 11.9 17.6 13.9 14.6
D-2/100 18.9 17.6 16.1 15.9 17.4 17.2
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19. How To Order
 Available Size
 Standard : 18”x24”
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