1. Manufacturing / Advanced
Electronics Packaging

5. In-Circuit Resistance
Opens / Shorts Test on Net List
In-Circuit Capacitance
In-Circuit Inductance
Diodes and Transistor test
Delta Scan
Frame Scan

7. QFN Devices
ASIC BGA
Press Fit Connector
(custom tooling Rq’d)
Package on FPGA 1156 Ball
Package (POP)
devices
CSP (Chip
Scale
Packages)
Image Processor Board ‐
Super Hi Density ‐ Fine Line – Mix Technologies
Ceramic, metal, Plastic components – Populated both sides.
Assembly includes embedded flip chips under Xilinx PLD

8. • Re‐balling of high cost or long lead time ASIC / FPGA.
• Convert Pb Free device to Tin/Lead.

12. TJM works closely with CAM department to assure that paste layer is optimized
for proper paste deposition for leadless devices. This is key to successful surface
mount assembly of advanced packages.

13. IPC 7722 / 7721 Certified Repair

14. Automated Dispense