1. ICMSES 2010
Shenzhen, China, December 11-12,2010
International Committee
2010 International Conference on Materials Science and
Engineering Science
Honorary Conference Chairs
Chin-Chen Chang, IEEE Fellow, Feng Chia Call For Paper
University, Taiwan
Jun Wang , The Chinese University of Hong Kong, Materials Science and Engineering Science (ICMSES 2010),December 11-12,Shenzhen,
Hong Kong
China. The objective of ICMSES 2010 is to provide a forum for researchers, educators,
Chris Price, Aberystwyth University, United
Kingdom engineers, and government officials involved in the general areas of Materials Science and
Engineering Science to disseminate their latest research results and exchange views on the
Organizing Chairs future research directions of these fields.
Honghua Tan, Wuhan Institute of Technology, China
Ziheng Liu, Huazhong Normal University, China All Accepted Papers will be published by Advanced Materials Research ISSN:
1022-6680, ISSN/ISO: Adv. Mater. Res. All published papers will be iindexed
Program Chairs by EI Compendex and ISTP.
Xu Gang, Shenzhen Univerisity, China
Wang Yuanzhi, International Communication Science
Association, China
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12 11-12
。文 英为须 必稿投。 索检 和 被 将，版出
Advanced Materials Research Ei ISTP
Publication Chair
Darry Zhu, South China Normal University, China Important Date
Paper Submission Deadline: July 30, 2010
International Committees Acceptance Notification: August 15, 2010
Ying Zhang, Wuhan Uniersity, China Camera Ready Due: August 30, 2010
Xueming Zhang, Beijing Normal University, China
Conference: December 11-12, 2010
Peide Liu, ShangDong Economic University, China
Dariusz Krol, Wroclaw University of Technology,
Poland The secretary of ICMSES 2010
Jason J. Jung,Yeungnam University, Republic of
Email: icmses2010reg@sina.cn
Korea.
Paul Davidsson, Blekinge Institute of Technology,
Tel: Mr. Wang+86 13866037886 or Miss Jia +86-27+62114455
Sweden For more detailed information on ICMSES 2010, please visit the conference website:
Cao Longbing,University of Technology Sydney,
Australia
Huaifeng Zhang, University of Technology Sydney,
Australia
Qian Yin, Beijing Normal University, China Co-sponored by