In the CXL Forum Theater at SC23 hosted by MemVerge, Samsung described their the architecture and use cases of their hybrid drive that includes DRAM and Flash memory
During the CXL Forum at OCP Global Summit, Mahesh Wagh, CXL Consortium TTF Co-chair and Senior Fellow at AMD, presented and update of the CXL Consortium mission and road map.
All Presentations during CXL Forum at Flash Memory Summit 22Memory Fabric Forum
The document summarizes a full-day forum hosted by the CXL Consortium and MemVerge on CXL. The morning agenda includes presentations on CXL from representatives of Google, Intel, PCI-SIG, Marvell, Samsung, and Micron. The afternoon agenda includes panels on CXL usage models from Meta, OCP, Anthropic, and MemVerge. A keynote presentation provides an update on the CXL Consortium and the recently released CXL 3.0 specification, including its expanded fabric capabilities and management features. The specification is aimed at enabling new usage models for memory sharing and expansion to address industry trends toward increased data processing demands.
During the CXL Forum at OCP Global Summit, Dharmesh Jani of Meta and Siamak Tavalllei of the CXL Consortium describe the extensive work being done by the Open Compute Project related to CXL
During the CXL Forum at OCP Global Summit 23, Rick Kutcipal and Sreeni Bagalkote of Broadcom presented their PCIe/CXL Roadmap and announced their Atlas 4 CXL switch.
During the CXL Forum at OCP Global Summit, Enfabrica CEO Rochan Sankar described how to bridge the network and memory worlds with their accelerated compute fabric switch.
During the CXL Forum at OCP Global Summit, Jeff Hilland of HPE explained what CXL, PCI SIG, DMTF, OFA, OCP, and SNIA are doing to make CXL fabric, memory and device management interoperable.
During the CXL Forum at OCP Global Summit, Mahesh Wagh, CXL Consortium TTF Co-chair and Senior Fellow at AMD, presented and update of the CXL Consortium mission and road map.
All Presentations during CXL Forum at Flash Memory Summit 22Memory Fabric Forum
The document summarizes a full-day forum hosted by the CXL Consortium and MemVerge on CXL. The morning agenda includes presentations on CXL from representatives of Google, Intel, PCI-SIG, Marvell, Samsung, and Micron. The afternoon agenda includes panels on CXL usage models from Meta, OCP, Anthropic, and MemVerge. A keynote presentation provides an update on the CXL Consortium and the recently released CXL 3.0 specification, including its expanded fabric capabilities and management features. The specification is aimed at enabling new usage models for memory sharing and expansion to address industry trends toward increased data processing demands.
During the CXL Forum at OCP Global Summit, Dharmesh Jani of Meta and Siamak Tavalllei of the CXL Consortium describe the extensive work being done by the Open Compute Project related to CXL
During the CXL Forum at OCP Global Summit 23, Rick Kutcipal and Sreeni Bagalkote of Broadcom presented their PCIe/CXL Roadmap and announced their Atlas 4 CXL switch.
During the CXL Forum at OCP Global Summit, Enfabrica CEO Rochan Sankar described how to bridge the network and memory worlds with their accelerated compute fabric switch.
During the CXL Forum at OCP Global Summit, Jeff Hilland of HPE explained what CXL, PCI SIG, DMTF, OFA, OCP, and SNIA are doing to make CXL fabric, memory and device management interoperable.
During the CXL Forum at OCP Global Summit, MemVerge CEO Charles Fan presented accomplishments of the CXL industry since 2019, the development of concept cars occurring today, and his predictions for the future of CXL
During the CXL Forum at OCP Global Summit, MemVerge software architect Steve Scargall defines the CXL software stack and where the development is being done.
Q1 Memory Fabric Forum: Intel Enabling Compute Express Link (CXL)Memory Fabric Forum
- Memory intensive workloads are dominating computing and increasing memory capacity just with CPU-attached DRAM is getting expensive.
- CXL allows augmenting system memory footprint at lower cost by running over existing PCIe links to add memory outside of the CPU package.
- Intel Xeon roadmap fully supports CXL starting with 5th Gen Xeons, and Intel CPUs offer unique hardware-based tiering modes between native DRAM and CXL memory without depending on the operating system.
- CXL has full industry support as the standard for coherent input/output.
During the CXL Forum at OCP Global Summit, memory system architect Jungmin Choi of SK hynix talks about the need for memory bandwidth and capacity, and the SK hynix Niagara solution.
CXL Memory Expansion, Pooling, Sharing, FAM Enablement, and SwitchingMemory Fabric Forum
The document discusses CXL, a new open standard protocol for efficient CPU and memory connectivity. CXL allows for memory disaggregation and pooling across devices by enabling high-bandwidth, low-latency connections between CPUs, GPUs, accelerators, and memory. This helps address the growing CPU-memory bottleneck by allowing expansion of memory capacity beyond what can physically connect to the CPU. CXL also enables memory tiering by providing different performance and cost options for "near" directly attached memory versus "far" switched or fabric attached memory.
During the CXL Forum at OCP Global Summit, SMART Modular Director Product Marketing Arthur Sainio, provides an overview of the company's CXL memory cards and modules.
In the CXL Forum Theater at SC23 hosted by MemVerge, the Open Compute Project provided an overview of CXL, as well as CXL-related hardware and software projects at OCP
PCI Express* based Storage: Data Center NVM Express* Platform TopologiesOdinot Stanislas
This document discusses PCI Express based solid state drives (SSDs) for data centers. It covers the growth opportunity for PCIe SSDs, topology options using various form factors like SFF-8639 and M.2, and validation tools. It also discusses hot plug support on Intel Xeon processor based servers and upcoming industry workshops to advance the PCIe SSD ecosystem.
Arm: Enabling CXL devices within the Data Center with Arm SolutionsMemory Fabric Forum
During the CXL Forum at OCP Summit, Arm Director of Segment Marketing Parag Beeraka provides and overview of the Arm portfolio of CXL products for the Data Center
Q1 Memory Fabric Forum: Memory Processor Interface 2023, Focus on CXLMemory Fabric Forum
Thibault Grossi, Sr. Technology & Market Analyst, shares excerpts from the recently published report, Memory Processor Interface, Focus on CXL. The reports provides a taxonomy of CXL market segments and revenue forecasts through 2028.
The number of internet-connected devices is growing exponentially, enabling an increasing number of edge applications in environments such as smart cities, retail, and industry 4.0. These intelligent solutions often require processing large amounts of data, running models to enable image recognition, predictive analytics, autonomous systems, and more. Increasing system workloads and data processing capacity at the edge is essential to minimize latency, improve responsiveness, and reduce network traffic back to data centers. Purpose-built systems such as Supermicro’s short-depth, multi-node SuperEdge, powered by 3rd Gen Intel® Xeon® Scalable processors, increase compute and I/O density at the edge and enable businesses to further accelerate innovation.
Join this webinar to discover new insights in edge-to-cloud infrastructures and learn how Supermicro SuperEdge multi-node solutions leverage data center scale, performance, and efficiency for 5G, IoT, and Edge applications.
Q1 Memory Fabric Forum: Compute Express Link (CXL) 3.1 UpdateMemory Fabric Forum
OCP Steering Committee member and ex-President of the CXL Consortium, Siamak Tavallaei, provides an update on the CXL specifications with a focus on the recently released 3.1 specification.
CXL is enabling new memory architectures by connecting CPUs and GPUs to shared memory pools. Early CXL 1.1 focused on memory expansion by connecting processors to DRAM modules. CXL 2.0 allowed for small memory pools accessible by a few servers. CXL 3.0 supports larger shared memory fabrics by connecting thousands of nodes and enabling true shared memory regions accessible coherently by multiple hosts and accelerators. However, shared memory fabrics using CXL 3.0 may experience greater latency variability and congestion compared to single-host or small memory pooling configurations.
Project Gismo introduces a global I/O-free shared memory object (Gismo) library that utilizes CXL to provide direct memory access across nodes. This allows distributed applications to access remote objects as fast as local memory, eliminating object serialization and data copying. Demo results show Gismo can improve performance of AI/ML workloads like Ray by up to 675% and reduce database synchronization times. The Gismo API provides functions to connect, create, access, and manage shared memory objects globally without I/O.
MemVerge CEO Charles Fan describes why memory-hungry generative AI is a driver for CXL technology, the new computing model for AI, and MemVerge software for CXL and AI.
If AMD Adopted OMI in their EPYC ArchitectureAllan Cantle
AMD's EPYC Architecture has paved the way forward towards Heterogeneous Data Centric Computing, but it is still limited by it's parallel DDR interfaces. This presentation shows the potential for the EPYC architecture if it adopted the Open Memory Interface, OMI, for it's Near Memory interface.
PCI Express is a high-speed serial computer expansion bus standard that was created to replace older standards like PCI, PCI-X, and AGP. It provides dedicated bandwidth to devices through the use of lanes and is commonly used as the interface for graphics cards, hard drives, and other peripherals. PCIe has gone through several generations that have increased its maximum bandwidth. It uses a layered protocol architecture and is designed for compatibility while providing scalable bandwidth and other advantages over older standards.
The document describes a hybrid memory subsystem (HMS) developed by BittWare that combines different memory technologies including Samsung zNAND, Samsung DDR4 SDRAM, and Everspin MRAM. The HMS has a capacity of 1.5TB or 3TB, uses an OpenCAPI 3.0 interface, and is optimized for sequential workloads with an average read latency of around 1us and bandwidth of 20GB/s. It is designed to provide memory expansion and persistence without major application changes at a lower cost than using only DRAM.
During the CXL Forum at OCP Global Summit, MemVerge CEO Charles Fan presented accomplishments of the CXL industry since 2019, the development of concept cars occurring today, and his predictions for the future of CXL
During the CXL Forum at OCP Global Summit, MemVerge software architect Steve Scargall defines the CXL software stack and where the development is being done.
Q1 Memory Fabric Forum: Intel Enabling Compute Express Link (CXL)Memory Fabric Forum
- Memory intensive workloads are dominating computing and increasing memory capacity just with CPU-attached DRAM is getting expensive.
- CXL allows augmenting system memory footprint at lower cost by running over existing PCIe links to add memory outside of the CPU package.
- Intel Xeon roadmap fully supports CXL starting with 5th Gen Xeons, and Intel CPUs offer unique hardware-based tiering modes between native DRAM and CXL memory without depending on the operating system.
- CXL has full industry support as the standard for coherent input/output.
During the CXL Forum at OCP Global Summit, memory system architect Jungmin Choi of SK hynix talks about the need for memory bandwidth and capacity, and the SK hynix Niagara solution.
CXL Memory Expansion, Pooling, Sharing, FAM Enablement, and SwitchingMemory Fabric Forum
The document discusses CXL, a new open standard protocol for efficient CPU and memory connectivity. CXL allows for memory disaggregation and pooling across devices by enabling high-bandwidth, low-latency connections between CPUs, GPUs, accelerators, and memory. This helps address the growing CPU-memory bottleneck by allowing expansion of memory capacity beyond what can physically connect to the CPU. CXL also enables memory tiering by providing different performance and cost options for "near" directly attached memory versus "far" switched or fabric attached memory.
During the CXL Forum at OCP Global Summit, SMART Modular Director Product Marketing Arthur Sainio, provides an overview of the company's CXL memory cards and modules.
In the CXL Forum Theater at SC23 hosted by MemVerge, the Open Compute Project provided an overview of CXL, as well as CXL-related hardware and software projects at OCP
PCI Express* based Storage: Data Center NVM Express* Platform TopologiesOdinot Stanislas
This document discusses PCI Express based solid state drives (SSDs) for data centers. It covers the growth opportunity for PCIe SSDs, topology options using various form factors like SFF-8639 and M.2, and validation tools. It also discusses hot plug support on Intel Xeon processor based servers and upcoming industry workshops to advance the PCIe SSD ecosystem.
Arm: Enabling CXL devices within the Data Center with Arm SolutionsMemory Fabric Forum
During the CXL Forum at OCP Summit, Arm Director of Segment Marketing Parag Beeraka provides and overview of the Arm portfolio of CXL products for the Data Center
Q1 Memory Fabric Forum: Memory Processor Interface 2023, Focus on CXLMemory Fabric Forum
Thibault Grossi, Sr. Technology & Market Analyst, shares excerpts from the recently published report, Memory Processor Interface, Focus on CXL. The reports provides a taxonomy of CXL market segments and revenue forecasts through 2028.
The number of internet-connected devices is growing exponentially, enabling an increasing number of edge applications in environments such as smart cities, retail, and industry 4.0. These intelligent solutions often require processing large amounts of data, running models to enable image recognition, predictive analytics, autonomous systems, and more. Increasing system workloads and data processing capacity at the edge is essential to minimize latency, improve responsiveness, and reduce network traffic back to data centers. Purpose-built systems such as Supermicro’s short-depth, multi-node SuperEdge, powered by 3rd Gen Intel® Xeon® Scalable processors, increase compute and I/O density at the edge and enable businesses to further accelerate innovation.
Join this webinar to discover new insights in edge-to-cloud infrastructures and learn how Supermicro SuperEdge multi-node solutions leverage data center scale, performance, and efficiency for 5G, IoT, and Edge applications.
Q1 Memory Fabric Forum: Compute Express Link (CXL) 3.1 UpdateMemory Fabric Forum
OCP Steering Committee member and ex-President of the CXL Consortium, Siamak Tavallaei, provides an update on the CXL specifications with a focus on the recently released 3.1 specification.
CXL is enabling new memory architectures by connecting CPUs and GPUs to shared memory pools. Early CXL 1.1 focused on memory expansion by connecting processors to DRAM modules. CXL 2.0 allowed for small memory pools accessible by a few servers. CXL 3.0 supports larger shared memory fabrics by connecting thousands of nodes and enabling true shared memory regions accessible coherently by multiple hosts and accelerators. However, shared memory fabrics using CXL 3.0 may experience greater latency variability and congestion compared to single-host or small memory pooling configurations.
Project Gismo introduces a global I/O-free shared memory object (Gismo) library that utilizes CXL to provide direct memory access across nodes. This allows distributed applications to access remote objects as fast as local memory, eliminating object serialization and data copying. Demo results show Gismo can improve performance of AI/ML workloads like Ray by up to 675% and reduce database synchronization times. The Gismo API provides functions to connect, create, access, and manage shared memory objects globally without I/O.
MemVerge CEO Charles Fan describes why memory-hungry generative AI is a driver for CXL technology, the new computing model for AI, and MemVerge software for CXL and AI.
If AMD Adopted OMI in their EPYC ArchitectureAllan Cantle
AMD's EPYC Architecture has paved the way forward towards Heterogeneous Data Centric Computing, but it is still limited by it's parallel DDR interfaces. This presentation shows the potential for the EPYC architecture if it adopted the Open Memory Interface, OMI, for it's Near Memory interface.
PCI Express is a high-speed serial computer expansion bus standard that was created to replace older standards like PCI, PCI-X, and AGP. It provides dedicated bandwidth to devices through the use of lanes and is commonly used as the interface for graphics cards, hard drives, and other peripherals. PCIe has gone through several generations that have increased its maximum bandwidth. It uses a layered protocol architecture and is designed for compatibility while providing scalable bandwidth and other advantages over older standards.
The document describes a hybrid memory subsystem (HMS) developed by BittWare that combines different memory technologies including Samsung zNAND, Samsung DDR4 SDRAM, and Everspin MRAM. The HMS has a capacity of 1.5TB or 3TB, uses an OpenCAPI 3.0 interface, and is optimized for sequential workloads with an average read latency of around 1us and bandwidth of 20GB/s. It is designed to provide memory expansion and persistence without major application changes at a lower cost than using only DRAM.
Ecosystem Alliance Manager Michael Ocampo talks about the CXL industry's effort to break through the memory wall, memory bound use cases, CXL for modular shared infrastructure, and critical CXL collaboration that's happening now.
Computer memory, also known as RAM, is temporary storage that allows the computer to perform tasks by holding instructions and data in an easily accessible location. There are two main types of computer memory: volatile and non-volatile. Volatile memory, like RAM, loses its contents when power is removed while non-volatile types like ROM retain data without power. Over time, RAM technologies have evolved from SIMMs to DIMMs and SDRAM to DDR, DDR2, and DDR3, with each generation offering faster speeds and higher capacities. Proper identification and installation of the correct RAM type is important for system functionality and performance.
Computer memory, also known as RAM, is temporary storage that allows the computer to perform tasks by holding instructions and data in an easily accessible location. There are two main types of computer memory: volatile and non-volatile. Volatile memory, like RAM, loses its contents when power is removed while non-volatile types like ROM retain data without power. Over time, RAM technologies have evolved from SIMMs to DIMMs and SDRAM to DDR, DDR2, and DDR3, with each generation offering faster speeds and higher capacities. Proper identification and installation of the correct RAM type is important for system functionality and performance.
Non-Volatile DIMMs, or NVDIMMs, have emerged as a go-to technology for boosting performance for next generation storage platforms. The standardization efforts around NVDIMMs have paved the way to simple, plug-n-play adoption. This session will highlight the state of NVDIMMs today and give a glimpse into the future – what customers, storage developers, and the industry would like to see to fully unlock the potential of NVDIMMs.
Q1 Memory Fabric Forum: ZeroPoint. Remove the waste. Release the power.Memory Fabric Forum
Nilesh Shah provide an overview of the ZeroPoint portable, hardware IP portfolio for lossless memory compression and compaction. The IP boosts memory capacity 2-4x, bandwidth and performance/watt by 50%, and is 1,000x faster than competitors.
This document proposes a software-defined approach called SDPM (Software-Defined Persistent Memory) to abstract the heterogeneity of emerging persistent memory technologies and enable their use across different hardware configurations. It describes SDPM's design goals of supporting various local and remote persistent memory attach points while providing a unified programming model. The proposed architecture introduces a persistent memory manager and a file system to manage data placement and provide memory-like and storage-like access. An evaluation shows the prototype delivering near-optimal performance for local and remote persistent memory configurations.
Internet of Things (IoT) data frequently has a location and time component. Getting value out of this "geotemporal" data can be tricky. We'll explore when and how to leverage Cassandra, DSE Search and DSE Analytics to surface meaningful information from your geotemporal data.
At the Virtual HPC User Forum Special Event, CEO of MemVerge, introduces MemVerge and provides and overview of Big Memory Computing and Memory Machine software.
RedisConf18 - Re-architecting Redis-on-Flash with Intel 3DX Point™ MemoryRedis Labs
The document discusses re-architecting Redis-on-Flash with Intel 3D XPoint memory. It introduces 3D XPoint memory as a new type of memory that is persistent, has high capacity of 6 TB per system, and is cheaper than DRAM. RedisLabs and Intel are collaborating to build the next version of Redis-on-Flash using 3D XPoint memory to increase scalability through larger memory modules and reduce costs compared to DRAM. The challenges include higher latency compared to DRAM and evolving standards.
Crossbar ARM TechCon 2016 presentation Crossbarinc
This document discusses how RRAM (resistive random-access memory) technology can help address limitations of NAND flash storage and enable new capabilities for hyperconverged infrastructure and computing. Key points:
1 - RRAM offers 1000x faster speeds and 100x greater endurance than NAND flash, helping overcome flash storage bottlenecks in hyperconverged servers.
2 - By integrating RRAM into storage solutions like NVMe SSDs and memory modules, latency can be reduced to microseconds versus milliseconds for flash. This shifts the performance bottleneck from storage to computing.
3 - RRAM-enabled hyperconverged servers could deliver over 1 million IOPS per server and over 1 gigabyte of storage bandwidth per
Q1 Memory Fabric Forum: Memory expansion with CXL-Ready Systems and DevicesMemory Fabric Forum
Ravi Gummaluri, Director, CXL System Architecture at Micron describes use cases for memory expansion with tiered DRAM and CXL memory, along with performance data.
Torry Steed, Sr. Product Marketing Manager at SMART Modular, provides an overview of CXL PCIe Add-in Cards (AICs) and memory modules that can be used to expand capacity in servers or in external memory pooling systems.
Virtualization techniques like RAMinate can unify emerging non-volatile memory devices with DRAM into a single memory space seen by the operating system. RAMinate uses a hypervisor to optimize page mapping and relocate data between faster DRAM and slower non-volatile memory. The presentation also describes software-based and FPGA-based emulation approaches for evaluating hybrid memory systems and new error permissive computing designs that aim to improve performance by controlling hardware error rates.
Software Defined Memory (SDM) uses new technologies like non-volatile RAM and flash storage to treat memory and storage as a unified persistent resource without traditional performance tiers. This can optimize Oracle database I/O performance by bypassing buffer caches and using fast kernel threads. Benchmarks showed a Plexistor SDM solution outperforming a traditional two-node Oracle RAC cluster. The best approach is to use fast storage like 3D XPoint as the secondary tier to maintain high performance even with cache misses. Combining SDM with solutions like FlashGrid and Oracle RAC could provide extremely high performance.
Q1 Memory Fabric Forum: Micron CXL-Compatible Memory ModulesMemory Fabric Forum
Michael Abraham, Director of Product Management at Micron, discusses data center challenges, the memory and storage hierarchy, Micron CZ120 memory modules, database (TPC-H) improvements, AI inferencing improvements, and how to enabling in your company.
Similaire à Samsung: CMM-H Tiered Memory Solution with Built-in DRAM (20)
Q1 Memory Fabric Forum: Building Fast and Secure Chips with CXL IPMemory Fabric Forum
Gary Ruggles, Sr Product Manger for PCIe and CXL Controller IP, provides an provides example use cases for adoption of CXL, an introduction to Synopsys CXL IP Solutions, interop and proof points.
Q1 Memory Fabric Forum: Using CXL with AI Applications - Steve Scargall.pptxMemory Fabric Forum
MemVerge product manager and software architect Steve Scargall discusses key factors related to the use of CXL with AI apps including, memory expansion form factors, latency and bandwidth memory placement strategies, RDBMS investigation and results, vector database investigation, and results understanding your application behavior.
Q1 Memory Fabric Forum: CXL-Related Activities within OCPMemory Fabric Forum
OCP steering committee member, and former President of the CXL Consortium, Siamak Tavallaei, provides an overview of CXL-related activities happening within the Open Compute Project.
Q1 Memory Fabric Forum: CXL Controller by Montage TechnologyMemory Fabric Forum
For CXL AIC and memory module designers, Nilesh Shah of Montage provides and overview of their CXL memory controller product, technology, and performance.
Nick Kriczsky and Gorden Getty provide an overview of Teledyne LeCroy’s Austin Labs portfolio of products to services including: 1) testing for protocol and electrical compliance, interoperability, data integrity, and performance, 2) In depth protocol training (PCIe, USB, NVMe, NVMe-oF, Fibre Channel), and 3) Automation (solutions for analysis, jamming, generation)
Torry Steed, Sr. Staff Product Manager at SMART Modular, covers the changing shape of memory leading to new categories of CXL form factors. He dives deeper to address EDSFF and AIC variations, mechanical sizes, installation locations, capacity considerations, and power ratings.
Q1 Memory Fabric Forum: Memory Fabric in a Composable SystemMemory Fabric Forum
Eddie McMorrow, Sr. Product Manager at GigaIO, defines composable infrastructure and memory fabrics, then provides and overview of the FabreX memory fabric.
Q1 Memory Fabric Forum: Advantages of Optical CXL for Disaggregated Compute ...Memory Fabric Forum
Ron Swartzentruber, Director of Engineering at Lightelligence, explains why optical connectivity is needed for CXL fabrics, and provides an overview of the Photowave line of port expander PCIe cards and active optical cables.
Arvind Jagannath of VMware makes the case for bridging the CPU-Memory imbalance with memory tiering, describes their vision for memory disaggregation, and explains that VMware will support CXL Expanders – Specific Configurations, Memory Tiering to reduce overall TCO, and Memory Accelerators to enable CXL-based use-cases.
MemVerge Field CTO Yong Tian shows what memory expansion costs with an analysis of various server configurations with up to 8TB of tiered DRAM and CXL memory.
In the CXL Forum Theater at SC23 hosted by MemVerge, Lightelligence describes CXL's need for optical connectivity and their portfolio of CXL optical expander cards and cables
Synopsys: Achieve First Pass Silicon Success with Synopsys CXL IP SolutionsMemory Fabric Forum
This document discusses Synopsys' CXL IP solutions for enabling first pass silicon success. It provides an overview of:
- How large data sets are driving the need for CXL and larger, more efficient cache coherent storage.
- How CXL allows memory expansion by enabling one interface to connect to various memory types like DDR, LPDDR, and persistent memory.
- Synopsys' complete CXL IP solution which uses proven PCIe IP to provide a highly efficient 512-bit controller and 32GT/s PHY for maximum bandwidth and low latency.
- Synopsys' work with XConn to achieve first pass silicon success on a 256 lane CXL 2.0 switch SOC
Ivanti’s Patch Tuesday breakdown goes beyond patching your applications and brings you the intelligence and guidance needed to prioritize where to focus your attention first. Catch early analysis on our Ivanti blog, then join industry expert Chris Goettl for the Patch Tuesday Webinar Event. There we’ll do a deep dive into each of the bulletins and give guidance on the risks associated with the newly-identified vulnerabilities.
Generating privacy-protected synthetic data using Secludy and MilvusZilliz
During this demo, the founders of Secludy will demonstrate how their system utilizes Milvus to store and manipulate embeddings for generating privacy-protected synthetic data. Their approach not only maintains the confidentiality of the original data but also enhances the utility and scalability of LLMs under privacy constraints. Attendees, including machine learning engineers, data scientists, and data managers, will witness first-hand how Secludy's integration with Milvus empowers organizations to harness the power of LLMs securely and efficiently.
For the full video of this presentation, please visit: https://www.edge-ai-vision.com/2024/06/building-and-scaling-ai-applications-with-the-nx-ai-manager-a-presentation-from-network-optix/
Robin van Emden, Senior Director of Data Science at Network Optix, presents the “Building and Scaling AI Applications with the Nx AI Manager,” tutorial at the May 2024 Embedded Vision Summit.
In this presentation, van Emden covers the basics of scaling edge AI solutions using the Nx tool kit. He emphasizes the process of developing AI models and deploying them globally. He also showcases the conversion of AI models and the creation of effective edge AI pipelines, with a focus on pre-processing, model conversion, selecting the appropriate inference engine for the target hardware and post-processing.
van Emden shows how Nx can simplify the developer’s life and facilitate a rapid transition from concept to production-ready applications.He provides valuable insights into developing scalable and efficient edge AI solutions, with a strong focus on practical implementation.
GraphRAG for Life Science to increase LLM accuracyTomaz Bratanic
GraphRAG for life science domain, where you retriever information from biomedical knowledge graphs using LLMs to increase the accuracy and performance of generated answers
Let's Integrate MuleSoft RPA, COMPOSER, APM with AWS IDP along with Slackshyamraj55
Discover the seamless integration of RPA (Robotic Process Automation), COMPOSER, and APM with AWS IDP enhanced with Slack notifications. Explore how these technologies converge to streamline workflows, optimize performance, and ensure secure access, all while leveraging the power of AWS IDP and real-time communication via Slack notifications.
Digital Marketing Trends in 2024 | Guide for Staying AheadWask
https://www.wask.co/ebooks/digital-marketing-trends-in-2024
Feeling lost in the digital marketing whirlwind of 2024? Technology is changing, consumer habits are evolving, and staying ahead of the curve feels like a never-ending pursuit. This e-book is your compass. Dive into actionable insights to handle the complexities of modern marketing. From hyper-personalization to the power of user-generated content, learn how to build long-term relationships with your audience and unlock the secrets to success in the ever-shifting digital landscape.
Taking AI to the Next Level in Manufacturing.pdfssuserfac0301
Read Taking AI to the Next Level in Manufacturing to gain insights on AI adoption in the manufacturing industry, such as:
1. How quickly AI is being implemented in manufacturing.
2. Which barriers stand in the way of AI adoption.
3. How data quality and governance form the backbone of AI.
4. Organizational processes and structures that may inhibit effective AI adoption.
6. Ideas and approaches to help build your organization's AI strategy.
Main news related to the CCS TSI 2023 (2023/1695)Jakub Marek
An English 🇬🇧 translation of a presentation to the speech I gave about the main changes brought by CCS TSI 2023 at the biggest Czech conference on Communications and signalling systems on Railways, which was held in Clarion Hotel Olomouc from 7th to 9th November 2023 (konferenceszt.cz). Attended by around 500 participants and 200 on-line followers.
The original Czech 🇨🇿 version of the presentation can be found here: https://www.slideshare.net/slideshow/hlavni-novinky-souvisejici-s-ccs-tsi-2023-2023-1695/269688092 .
The videorecording (in Czech) from the presentation is available here: https://youtu.be/WzjJWm4IyPk?si=SImb06tuXGb30BEH .
How to Get CNIC Information System with Paksim Ga.pptxdanishmna97
Pakdata Cf is a groundbreaking system designed to streamline and facilitate access to CNIC information. This innovative platform leverages advanced technology to provide users with efficient and secure access to their CNIC details.
Driving Business Innovation: Latest Generative AI Advancements & Success StorySafe Software
Are you ready to revolutionize how you handle data? Join us for a webinar where we’ll bring you up to speed with the latest advancements in Generative AI technology and discover how leveraging FME with tools from giants like Google Gemini, Amazon, and Microsoft OpenAI can supercharge your workflow efficiency.
During the hour, we’ll take you through:
Guest Speaker Segment with Hannah Barrington: Dive into the world of dynamic real estate marketing with Hannah, the Marketing Manager at Workspace Group. Hear firsthand how their team generates engaging descriptions for thousands of office units by integrating diverse data sources—from PDF floorplans to web pages—using FME transformers, like OpenAIVisionConnector and AnthropicVisionConnector. This use case will show you how GenAI can streamline content creation for marketing across the board.
Ollama Use Case: Learn how Scenario Specialist Dmitri Bagh has utilized Ollama within FME to input data, create custom models, and enhance security protocols. This segment will include demos to illustrate the full capabilities of FME in AI-driven processes.
Custom AI Models: Discover how to leverage FME to build personalized AI models using your data. Whether it’s populating a model with local data for added security or integrating public AI tools, find out how FME facilitates a versatile and secure approach to AI.
We’ll wrap up with a live Q&A session where you can engage with our experts on your specific use cases, and learn more about optimizing your data workflows with AI.
This webinar is ideal for professionals seeking to harness the power of AI within their data management systems while ensuring high levels of customization and security. Whether you're a novice or an expert, gain actionable insights and strategies to elevate your data processes. Join us to see how FME and AI can revolutionize how you work with data!
Skybuffer SAM4U tool for SAP license adoptionTatiana Kojar
Manage and optimize your license adoption and consumption with SAM4U, an SAP free customer software asset management tool.
SAM4U, an SAP complimentary software asset management tool for customers, delivers a detailed and well-structured overview of license inventory and usage with a user-friendly interface. We offer a hosted, cost-effective, and performance-optimized SAM4U setup in the Skybuffer Cloud environment. You retain ownership of the system and data, while we manage the ABAP 7.58 infrastructure, ensuring fixed Total Cost of Ownership (TCO) and exceptional services through the SAP Fiori interface.
Ocean lotus Threat actors project by John Sitima 2024 (1).pptxSitimaJohn
Ocean Lotus cyber threat actors represent a sophisticated, persistent, and politically motivated group that poses a significant risk to organizations and individuals in the Southeast Asian region. Their continuous evolution and adaptability underscore the need for robust cybersecurity measures and international cooperation to identify and mitigate the threats posed by such advanced persistent threat groups.
Ocean lotus Threat actors project by John Sitima 2024 (1).pptx
Samsung: CMM-H Tiered Memory Solution with Built-in DRAM
1. CMM-H
Tiered Memory Solution with Built-in DRAM
Dr. Shuyi Pei
Ph.D., Sr. Engineer @Memory Solutions Lab.
Samsung Semiconductor Inc.
2. Larger capacity memory device at lower TCO
best suited for tiered memory solutions
Speed comparable to DRAM with NAND storage backed
and external battery power supply
Persistent memory option
CMM-H (CXL Memory Module, H: Hybrid)
Better system TCO
64-byte cache-granular fine grained access
to meet modern AI/ML workload needs
Small granularity access
Expanding capacity and utilization of memory for AI
3. • DRAM cache to move/store small-
sized data chunks suitable for AI/ML
Applications
• Improve data store efficiency by
writing data at the DRAM speed
• Low latency enabled by CXL.
mem protocol
Optimized for AI workloads
CMM-H Architecture
Computer System
Normal
I/O
Small
I/O
CXL.memory
DRAM Cache
CXL.io
NAND Flash
4KB
64 Bytes
128 Bytes
4. 0
1
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**Compared to PCIe Gen4 NVMe SSD
• Small granularity data access
enable performance scales
with cache hits
• Direct memory access
advantage
• Large memory capacity at
lower TCO
Memory Reads per Second (Million)
Tiered Memory
8.0
2.2
1.6
1.4
1.3
1.2
1.1
1.0
1.0
0.9
16.3
3.6
2.4
2.0
1.7
1.5
1.4
1.2
1.1
1.0
1.1 1.2 1.3
1.5
1.8
2.2
2.7
3.6
5.9
32.7
43
9.9
4.9
3.2
2.4
1.9
1.66
1.4
1.2
1.1
512B
256B
128B
64B
100.0
10.0
1.0
0.1
10 20 30 40 50 60 70 80 90 100
Cache Hit Rate (%)
5. 0
1
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5
• Battery-backed DRAM with
speed comparable to DDR5
• Persistence achieved with data
dumps to NAND flash
• Supports flush-on-fail with CXL
2.0 GPF feature
Persistent Memory
Operations per Second (Million)
0
35
70
105
140
100% Write 50% Write: 50% Read 10% Write: 90% Reads
DDR5 DRAM
CMM-H
Persistent Memory
Persistent Memory Competitor
6. 0
1
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**Compared to PCIe Gen4 NVMe SSD
• Direct memory access
advantage; no software cache
overhead
• Up to ~10x better end-to-end
performance with FPGA-based
PoC**
0
12500
25000
37500
50000
0 28 55 83 110
Inferences
per
Second
Cache Hit Ratio (%)
End-to-End Performance
Block IO
CMM-H
Block IO + Host Memory Cache
DRAM Memory
7. 0
1
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7
Movie Recommendation System Demo
Notes de l'éditeur
1 TB MS-SSD memory with 8GB internal cache; Prototype performance scales for smaller granular memory accesses also as cache hit rate increases
16GB MS-SSD persistent memory; FPGA-based Prototype performance better than competitors (Optane) and close to DDR5 performance
End-to-end recommendation inference performance also scales as cache hit rate increases and comes closer to higher performance and cost DDR5
Movie Recommendation system is one good example to show MS-SSD’s performance. MS-SSD is HW device with Cache based ; most cost and power efficient AI recommendation system
** 40X better IO performance : PCIe Gen4 NVMe SSD 4KB Random read(0.9M IOPS) vs MS-SSD 64Byte (42.9M IOPS)
(Embedding table column size for DLRM is 64Byte)
https://ai.facebook.com/blog/dlrm-an-advanced-open-source-deep-learning-recommendation-model/