Conformal coating is applied to PCBs to protect against temperature, moisture and chemicals. This presentation was developed as a webinar to inform users of the options for spray, brush and dip coating. The methods are outlines and the best alternatives given for masking and de-masking for conformal coating of PCBs.
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Masking for Conformal Coating
The problem being solved
What gets coated? What does not get coated.
Methods Available
•Tape dots
•Tape shapes
•Manual taping
•Silicone boots
•3-D printed boots
•Liquid latex
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Conformal Coating Techniques
(What normally gets masked)
• Connectors
• Test points
• Switches , relays and other unsealed components
• Mating sockets, pins, test and grounding points
• Actuators and other electromechanical components
• Batteries
• Mounting holes
RF filters and other devices where CC can modify values
Spacers and fasteners
• Potentiometers and variable capacitors
• Photodiodes and sensors
• Components stressed by coating eg glass MELFs
• Wires for stress relief
• EMI shields
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Conformal Coating Techniques
Sides of metallic locations
Beneath or below components
Backside of leads
Sides of hermetically sealed locations
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Conformal Coating Drawings
What should a drawing have on it?
•Coated vs uncoated areas should be obvious
•What is the tolerance or overlap allowed
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2D vs 3D Drawings
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Conformal Coating Techniques
Techniques for Conformal Coating
•Brushing
•Spraying
•Dipping
•Vacuum Chamber
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Traditional Methods
Choosing the right tape, Typical Options
– Crepe masking tapes
– Polyester masking tapes
- Kapton ™ tapes
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Ion Chromotagraphy-Sample
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Traditional Methods
Choosing the right tape, Typical Options
Evaluate on…..
A.Coating dewetting?
B.Filtering of CC material
C.Tape residue
D.Time for mask and de-mask
E.Ability to be easily shaped so tape goes
down to PCB and component surfaces
F.Ability to prevent CC for going somewhere
where you do NOT want it to go
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Dewetting
NASA 8739 Specification
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Traditional Methods
Ionizer should be used!
ALL masking and demasking
procedures should be done in
vicinity of an ionizing air
blower – ESD generation
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Traditional Methods
Tape Dots
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Traditional Methods Tape Position
Acceptable
Defect
Prior to masking
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Traditional Methods
Tape Position- Prior to masking
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Traditional Methods
Tape Position-defect
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Traditional Methods
Tape Shapes
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Traditional Methods
Tape Shapes
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Traditional Methods
Tape Shapes
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Traditional Methods
Manual Shaping/Cutting of Tape
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Traditional Methods
Boots
Pealable
mask to
seal off
boot
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Traditional Methods
Boots3D Printed Boot
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Traditional Methods
Peelable Mask
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Traditional Methods
Pealable Mask
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Masking Alternatives for
Conformal Coating
Review why? Want the protection of CC but only in designated areas. This protection is in the CC area and it prevents the CC from going into areas where it may harm components
Where we are coning from?
Looking for better ways to reduce labor NA view. Low volume. High Mix.
Do not have a conformal coating dept so highly skilled people are performing masking functions
Take out the labor
CC protects PCBs against damage due to moisture, chemicals, corrosion and mechanical stresses
It is applied to act as a protection against potential failure to the above over prolonged or extreme exposure
AR-acrylic, UR Polyurethane, ER-Epoxy, SR-silicones
Process steps
Determine what you are trying to protect the PCB from
Ensure assembly can be coated
Determine keep out areas, spray patterns, coupon reqts etc. This is the step on the process where the kind of masking ois chosen and tooling for the masking needs to be chosen
Develop the process flow-cleaning, testing, spraying, curing
Clean and dry the assembly
Mask the assembly
Apply coating
Cure coating
Unmask
Repair , touch up and inspect
The previous were the process steps where masking fits in
As important, all component edges must be entirely masked;
The objective is to remove any surface breaches, eliminating coating leakage into the component.
Right angle leads show their backside lead surfaces
Datasheet will help determine whether sealed or unsealed
Sometimes you have to see them to make that call
Where to Coat –the drawing
Requires no operator “interpretation”
• Drawing should indicate where coating MUST go
• Drawing should indicate where coating MUST NOT go
(keep out zones)
• Drawing should indicate the tolerance in the keep out
Zones
Drwing notes about what to do if it is outsider these boundaries
2D drawings only do so much good
Vucuum CC not covered because not done inside of EMS firm
Need to coinsider the method of coating. Dipping is more difficult and intensive process-liquid flows everywhere
Type of mask chosen is a function of: types of coating-compatability, PCB’s surface geometry, the type of part to be masked and production volume
Materials left behind by the tape
SIR measurements
Ionic cleanliness measurements-ion chromotograpohy (Should the test we used for SNPeel be sample?
Make sure black lights are in the area for inspection
Masking Tape Test
To see if tape material stands up to the rigors of processing chemicals and temperatures AND will it adequately mask the areas given the adhesive system used
HOW Apply tapes and spray of dip coat
Problems with certain tapes-dewetting-silicone coated slitting knives in tape mfg
Leaving adhesive residues-Ionic cleanliness, SIR
Allow bleeding/leaking under the tape
De-masking--------Tearing of tape can leave remnants and reliability concern
Compatibility with a variety of CC materials
Chlorides and some bromides will propagate electrochemical migration errors
Sulfates can be corrosive and lead to dendritic growth
Weak Organic Acids- WOAs – can lead to moisture absorption on the board
Sodium Conductive path can be formed
Ammine NH4+
Potassium, Calcium and Magnesium can also cause current leakage-
Masking and demasking-pulling off of the tpe
Bopard to be placed on static dissipative surface-make sure that the rest of the area per EOS/ESD 2020 guidelines
Widely used masking methood
Come in lots of standard sizes die cut and placed on rolls-many companies will have a variety of tapes in stock
Make sure in contact with the board
Make sure in contact with thesurface of the device being masked or the area being masked
Adverse effects between the tape and CC can lead to demasking
CC can seep underneath the tape-may cause expensive rework
Adhesive residues from the tape..
Masking not flush with the board surface
Top surface of the connector is not covered
VERY time consuming
Lot faster than masking tape….does allow for some seepage or wicking
Reduces labor-especially on complex parts
May need to use liquid solder mask in addition to the modlds
Nor appropriate for dipping
Use a test coupon
Great for high volume parts
Multiple uses depending on care, material, type of coating
Simple method-
As an aside there are some hot melts being used
More effective than tape dots for features with height
Easier to remove than tape when wet. Put enough on there so you can remove it
No fringe of dried coating at the edges does not tend to lift up the coating
Application time about the same….can use it in dispense system to take out some of inconsistencies. Viscosity consistency is a challenge
The pealable mask is later peeled off exposing the contact pads.
In both cases above it is a good idea to remove the pealable mask or dot soon after the coating is dry to prevent tearing the coating during removal.
One more good tip for clean removal of masking is to use a little thinner on a cotton bud to dampen the area at the edge of the masking. This will soften the coating eliminating tears
Ensure that the latex materials are compatable with the PCB-some have heavy concentrations of Ammonia
Dries too hard then can damage components upon removal
Dries too soft then can break up easily and residues trapped underneath the devices
JSTD-001 How to apply
IPC-A-610 for inspection criteria
NASA STD 8739
IPC CC-830
MIL-I-46058C