ams’ NanEye Mini Camera

©2021 by System Plus Consulting | SPR21585 ams’ NanEye Mini Camera | Sample 1
22 bd Benoni Goullin
44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr
ams’ NanEye Mini Camera
Cost-effective 1 mm2 miniature camera with customizable wafer-level optics for
endoscopy and novel medical imaging devices.
SPR21585 – Imaging report by Peter BONANNO, Audrey LAHRACH and Taha AYARI
Laboratory analysis by Nicolas RADUFE
January 2021 – Sample
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

Table of Contents
Overview / Introduction _4
o Executive Summary
o Reverse Costing Methodology
o Glossary
Company Profile & Market 8
o ams
o Partners
o NanEye Datasheet
o Market
Physical Analysis 19
o Summary of the Physical Analysis
o NanEye Camera & Demo Kit
o Camera Module
✓ Overview and dimensions
✓ Cross-section
✓ TSV
✓ Redistribution
o CMOS Image Sensor
✓ Overview and dimensions
✓ Delayering
✓ Cross-section
o Comparison
Manufacturing Process 50
o Global Overview
o CMOS Image Sensor Front-End Process & Fabrication Unit
o Wafer Level Packaging Process Flow & Fabrication Unit
o Wafer Level Optics Process Flow & Fabrication Unit
Cost Analysis 64
o Summary of the Cost Analysis
o Yields Explanation & Hypotheses
o CIS Wafer Cost
✓ Pixel Array
✓ Color Filter and AR Coating
o Wafer Level Package Wafer Cost
o Wafer Level Optic Wafer Cost
o NanEye Camera Cost
o Cost Comparison
Selling Price Analysis 80
Feedback 84
SystemPlus Consulting Services 86

Overview / Introduction
o Executive Summary
o Reverse Costing Methodology
o Glossary
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price
Feedbacks
Related Reports
About System Plus
The global single-use endoscopes and endoscopy capsule market was valued in 2020 at $1.4B with an expected compound annual
growth rate of 23% over the next five years. [1] This growth is driven by superior sterility compared to reusable endoscopic
equipment, freedom from maintenance and reprocessing costs, and innovative new technologies. As a leader in wafer-level
optics (WLO) and tiny cameras, ams is well positioned to service this market. Perhaps their most iconic product in this space is
the NanEye miniature camera.
This full reverse-costing study was conducted to provide insights into the technology, process flow, manufacturing cost and selling
price of the NanEye. The NanEye is can be ordered with a variety of possible configurations. In this study, we look at the
configuration with the RGB sensor and minimum necessary optical complexity.
To achieve an exceedingly small size and minimal cost, the NanEye relegates memory and image processing functionality off-chip
and uses low-voltage differential signaling to stream image data at 38 Mbps. The NanEye includes a wafer-level packaged (WLP) 1
x 1 mm2 249 x 250-pixel front-side illuminated CMOS image sensor designed by AWAIBA (acquired by ams in 2015) and WLO
technology developed by Heptagon (acquired by ams in 2016). Through-silicon via technology connects the sensor to the 4-pad
solder-masked ball grid array package on the backside, facilitating integration into novel imaging products. The camera can be
ordered with several preset optical configurations with an F-stop range of F2.4 - 6.0 and a field of view (FOV) range of 90° - 160°.
The version analyzed in this report has an F-stop of F#4.0 and FOV of 120°.
This report divides the technology and cost analysis into three parts: the CMOS image sensor, WLP, and WLO. For each there is a
complete physical analysis, manufacturing hypothesis, and costing estimate. Also included is a comparison of the NanEye with
Omnivision's OVM6948 CameraCubeChip and Nemotek's wafer-level camera.
Executive Summary
[1] Yole Développement. “Status of medical imaging equipment and detectors 2020.”

Physical Analysis
o Camera Module
o Overview & Dimensions
o Cross-Section
o TSV
o Redistribution
o CMOS Image Sensor
o Delayering
o Cross-section
o Comparison
Cost Analysis
Selling Price
Feedbacks
Related Reports
About System Plus
Still from Awaiba(ams) “NanEye NanoUSB2 Setup” (annotated)
Uploaded 2017. https://www.youtube.com/watch?v=mLGX4tXvXr8
NanEye
Camera
LED
NanEye Camera with black coating
removed from top side face
©2021 by System Plus Consulting
NanEye Camera and NanoUSB2 demo kit

Physical Analysis
o Camera Module
o Cross-Section
o TSV
o Redistribution
o CMOS Image Sensor
o Delayering
o Cross-section
o Comparison
Cost Analysis
Selling Price
Feedbacks
Related Reports
About System Plus
Camera Module - Overview
Camera without black coating – Optical View
©2021 by System Plus Consulting Camera – Cross-Section – Optical View

Physical Analysis
o Camera Module
o Cross-Section
o TSV
o Redistribution
o CMOS Image Sensor
o Delayering
o Cross-section
o Comparison
Cost Analysis
Selling Price
Feedbacks
Related Reports
About System Plus
Camera Module - Cross-Section
Camera – Cross-Section – Optical View ©2021 by System Plus Consulting
Top of Camera – Cross-Section axis
Back of Camera – Cross-Section axis
120 µm

Physical Analysis
o Camera Module
o Cross-Section
o TSV
o Redistribution
o CMOS Image Sensor
o Delayering
o Cross-section
o Comparison
Cost Analysis
Selling Price
Feedbacks
Related Reports
About System Plus
Camera Module - Cross-Section of TSV
TSV – Cross-Section – SEM View ©2021 by System Plus Consulting
Camera – Cross-Section – Optical View

Physical Analysis
o Camera Module
o Cross-Section
o TSV
o Redistribution
o CMOS Image Sensor
o Delayering
o Cross-section
o Comparison
Cost Analysis
Selling Price
Feedbacks
Related Reports
About System Plus
Camera Module - Cross-Section of TSV
Camera – Cross-Section –
Optical View ©2021 by
System Plus Consulting
TSV – Cross-Section – SEM View ©2021 by System Plus Consulting

Physical Analysis
o Camera Module
o Cross-Section
o TSV
o Redistribution
o CMOS Image Sensor
o Delayering
o Cross-section
o Comparison
Cost Analysis
Selling Price
Feedbacks
Related Reports
About System Plus
Image Sensor Die Cross-section
CIS Cross Section – SEM View ©2021 by System Plus Consulting

Physical Analysis
o Global Overview
o CIS Die Front-End Process
o CIS Process Flow
o CIS Fabrication Unit
o WLP Process Flow
o WLP Fabrication Unit
o WLO Process Flow
o WLO Fabrication Unit
Cost Analysis
Selling Price
Feedbacks
Related Reports
About System Plus
Wafer Level Packaging Flow – Partial Dicing
Cross-Section showing partial dicing– Optical View ©2021 by System Plus Consulting

Physical Analysis
Cost Analysis
o Cost Analysis Summary
o Yields Explanation &
Hypotheses
o CIS Wafer Cost
o WLP Wafer Cost
o WLO Wafer Cost
o Camera Module Cost
o Cost Comparison
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
WLO Wafer Cost

Market Analysis
Physical Analysis
Cost Analysis
Technical & Cost Comparison
Feedback
Related Reports
About System Plus
o Company services
o Contact
Related Reports
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
IMAGING
• OmniVision’s OVM6948 CameraCubeChip
• Smartphone Camera Module Comparison 2020 Vol. 1
• Smartphone 3D Sensing Modules Comparison 2020
MARKET & TECHNOLOGY ANALYSES - YOLE DEVELOPPEMENT
IMAGING
• Status of CMOS Image Sensor Industry 2020
• Status of Medical Imaging Equipment and Detectors 2020
• Bonding and Lithography Equipment Market for More than Moore Devices
• CMOS Image Sensor Quarterly Market Monitor

COMPANY
SERVICES

Market Analysis
Physical Analysis
Cost Analysis
Feedback
Related Reports
About System Plus
o Company services
o Contact
Business Models Fields of Expertise
Custom Analyses
(>130 analyses per year)
Reports
(>60 reports per year)
Costing Tools
Trainings

Market Analysis
Physical Analysis
Cost Analysis
Feedback
Related Reports
About System Plus
o Company services
o Contact
Contact
www.systemplus.fr
NANTES
Headquarters
FRANKFURT/MAIN
Europe Sales Office
LYON
YOLE HQ
TOKYO
YOLE KK
GREATER CHINA
YOLE
KOREA
YOLE
Headquarters
22 bd Benoni Goullin
44200 Nantes
FRANCE
+33 2 40 18 09 16
sales@systemplus.fr
Europe Sales Office
Lizzie LEVENEZ
Frankfurt am Main
GERMANY
+49 151 23 54 41 82
llevenez@systemplus.fr
Asia Sales Office
Takashi ONOZAWA
Tokyo
JAPAN
T : +81 804 371 4887
onozawa@yole.fr
Mavis WANG
TAIWAN
T :+886 979 336 809
CN: +8613661566824
wang@yole.fr
America Sales Office
Steve LAFERRIERE
WESTERN US
T : +1 310 600 8267
laferriere@yole.fr
Chris YOUMAN
EASTERN US & CANADA
T : +1 919 607 9839
chris.youman@yole.fr
CORNELIUS
YOLE Inc.

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