This document provides an overview of NVIDIA's new A100 Ampere GPU. Some key points: - It uses TSMC's 7nm process and CoWoS packaging to integrate over 6,000mm2 of silicon onto a single 55mm x 55mm package. - It features a 7nm GPU die with 54 billion transistors and 40/80GB of HBM2 memory in a 3D stacked configuration connected via microbumps and TSVs. - The report includes a physical analysis of the package, dies, and assembly, as well as a cost analysis and estimated price. It finds the A100 provides significantly higher performance than previous generations like the V100.

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22 Bd Benoni Goullin
44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr
NVIDIA A100 Ampere GPU
NVIDIA’s new generation Graphics Processing Unit (GPU) with TSMC
CoWoS, 40GB Samsung HBM2, 2.5D and 3D packaging.
SP20579 - Advanced Packaging report by Belinda Dube
Laboratory Analysis by Véronique Le Troadec
February 2021 – Sample
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

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Table of Contents
Overview / Introduction 4
o Executive Summary
o Reverse Costing Methodology
Company Profile 8
o 2.5D & 3D Packaging Market
o High Bandwidth Memory
o TSMC CoWoS
o TSV Technology
o NVIDIA Company Profile
o NVIDIA Ampere A100 Characteristics
o GPU Supply Chain
Physical Analysis 31
o Summary of the Physical Analysis
o Physical Analysis Methodology
o NVIDIA Ampere A100 Teardown
o Package
✓ Views & Dimensions
✓ Passives Assembly
✓ Laminate & IHS Cross-Section
o DRAM Die
✓ View, Dimensions & Marking
✓ µBumps & TSVs
✓ HBM2 Stack Cross-Section
o GPU Die
✓ View, Dimensions & Marking
✓ µBumps
✓ GPU Cross-Section
o Filler Die
✓ View, Dimensions & Marking
✓ Filler Cross-Section
o Interposer Die
✓ View, Dimensions & Marking
✓ µBumps & TSVs
✓ Interposer Cross-Section
o Comparison with AMD Fury X including SK-Hynix HBM1
Manufacturing Process Flow 160
o Global Overview
o GPU Process Description & Foundry
o Interposer Process Flow & Foundry
o HBM2 Stack Process Flow & Foundry
o CoWoS Process Flow & Foundry
Cost Analysis 191
o Summary of the Cost Analysis
o Yields Explanation & Hypotheses
o GPU Front-End & Die Cost
o HBM2 Stack
✓ TSV Manufacturing Cost
✓ Micro-Bumping Manufacturing Cost
✓ Dies Cost (DRAM + Logic)
✓ HBM2 Stack Cost
o Interposer
✓ TSV Manufacturing Cost
✓ Microbumping Cost
✓ Interposer Cost
o CoWoS Assembly Manufacturing Cost
o Final Component Cost
Estimated Price Analysis 213
o Manufacturer Financial Ratios
o Component Manufacturer Price
Feedback 216
System plus Consulting Services 218

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O V E R V I E W
METHODOLOGY

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Overview / Introduction
o Executive Summary
o Reverse Costing
Methodology
o Glossary
Company Profile & Supply
Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedback
Related Reports
About System Plus
Executive Summary
• The high end electronic packaging market was worth more than $880 million dollars in 2019. The biggest market for
high end performance packaging comes from telecom and infrastructure. It has more than a 50% market share
according to Yole Développement’s report High-End Performance Packaging: 3D/2.5D Integration 2020.
• The NVIDIA Ampere A100 targets high performance data centers, artificial intelligence applications, data analytics, and
High-Performance Computing (HPC). It uses advanced technologies, including TSMC’s 7nm FinFET chip, 3D stacked
memory with 2.5D integration on a silicon interposer in a Chip-on-Wafer-on-Substrate (CoWoS) process.
• The new generation GPU provides significantly higher performance compared to the previous generation. The NVIDIA
Ampere A100 provides the consumer market with 40GB or 80GB of Samsung’s high bandwidth memory (HBM2).
Samsung’s HBM2 is engineered to sustain and support high speed data transfer. The HBM2 DRAM solution satisfies the
market need for high performance, energy efficiency, and compact integration. The NVIDIA Ampere A100 is
characterized by GPU Memory Bandwidth of 1,555 GB/s. A 3D assembly process yields HBM2 stacks composed of eight
1GB memory dies and one logic die, connected with via-middle through-silicon vias and micro-bumps.
• More than 6,000mm² of silicon area is integrated in a single 55mm x 55mm 12-layer ball grid array (BGA) package of the
NVIDIA Ampere A100. Two major semiconductor leaders, Samsung and TSMC, collaborate to deliver this much silicon in
a single package. TSMC is the main provider for the NVIDIA Ampere A100. Using its 2.5D CoWoS platform, it
manufactures the world’s largest processor built on 7nm process technology. This GPU die features a 7nm FinFET
transistor process and 54 billion transistors on a single chip. It also produces a large silicon interposer on which the GPU
and HBM2 memory is assembled at the wafer-level.
• The report includes a complete physical analysis of the package, the GPU die, interposer die and the HBM2 DRAM. Along
with the manufacturing process of the silicon dies, CoWoS process and final assembly, this report comes with a cost
analysis and a price estimation of the NVIDIA Ampere A100. Finally, the report includes a comparison to highlight the
similarities and differences between the NVIDIA Ampere A100 and NVIDIA’s Tesla P100 and V100.

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PHYSICAL
ANALYSIS

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Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Summary
o Graphic Card View &
Teardown
o Package X-Ray Images
o Package Overview
o Package Opening
o Package Cross Section
o HBM Stack-Logic/DRAM Die
o HBM Stack Cross Section
o GPU Die
o Cross-Section – GPU
o Filler Die
o Cross-Section – Filler
o Interposer Die
o Cross-Section – Interposer
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedback
Related Reports
About System Plus
Graphic Card Teardown
NVIDIA Ampere A100 Teardown – PCB Front Side
©2021 by System Plus Consulting
NVIDIA Ampere A100 Teardown – PCB Back Side
©2021 by System Plus Consulting

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Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Summary
o Graphic Card View &
Teardown
o Package X-Ray Images
o Package Overview
o Package Opening
o Package Cross Section
o HBM Stack-Logic/DRAM Die
o HBM Stack Cross Section
o GPU Die
o Cross-Section – GPU
o Filler Die
o Cross-Section – Filler
o Interposer Die
o Cross-Section – Interposer
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedback
Related Reports
About System Plus
NVIDIA Ampere A100 X-Ray Image
©2021 by System Plus Consulting
NVIDIA AMPERE 100 Package - XRAY Images-

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Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Summary
o Graphic Card View &
Teardown
o Package X-Ray Images
o Package Overview
o Package Opening
o Package Cross Section
o HBM Stack-Logic/DRAM Die
o HBM Stack Cross Section
o GPU Die
o Cross-Section – GPU
o Filler Die
o Cross-Section – Filler
o Interposer Die
o Cross-Section – Interposer
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedback
Related Reports
About System Plus
Package Opening

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Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Summary
o Graphic Card View &
Teardown
o Package X-Ray Images
o Package Overview
o Package Opening
o Package Cross Section
o HBM Stack-Logic/DRAM Die
o HBM Stack Cross Section
o GPU Die
o Cross-Section – GPU
o Filler Die
o Cross-Section – Filler
o Interposer Die
o Cross-Section – Interposer
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedback
Related Reports
About System Plus
Package Cross Section
Package Cross Section
©2021 by System Plus Consulting

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Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Summary
o Graphic Card View &
Teardown
o Package X-Ray Images
o Package Overview
o Package Opening
o Package Cross Section
o HBM Stack-Logic/DRAM Die
o HBM Stack Cross Section
o GPU Die
o Cross-Section – GPU
o Filler Die
o Cross-Section – Filler
o Interposer Die
o Cross-Section – Interposer
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedback
Related Reports
About System Plus
Board Cross-Section

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Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Summary
o Graphic Card View &
Teardown
o Package X-Ray Images
o Package Overview
o Package Opening
o Package Cross Section
o HBM Stack-Logic/DRAM Die
o HBM Stack Cross Section
o GPU Die
o Cross-Section – GPU
o Filler Die
o Cross-Section – Filler
o Interposer Die
o Cross-Section – Interposer
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedback
Related Reports
About System Plus
Package Cross-Section – HBM2 Stack
HBM Stack Cross-Section – SEM View
©2021 by System Plus Consulting

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Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Summary
o Graphic Card View &
Teardown
o Package X-Ray Images
o Package Overview
o Package Opening
o Package Cross Section
o HBM Stack-Logic/DRAM Die
o HBM Stack Cross Section
o GPU Die
o Cross-Section – GPU
o Filler Die
o Cross-Section – Filler
o Interposer Die
o Cross-Section – Interposer
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedback
Related Reports
About System Plus
Package Cross-Section – HBM2 Stack

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Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Summary
o Graphic Card View &
Teardown
o Package X-Ray Images
o Package Overview
o Package Opening
o Package Cross Section
o HBM Stack-Logic/DRAM Die
o HBM Stack Cross Section
o GPU Die
o Cross-Section – GPU
o Filler Die
o Cross-Section – Filler
o Interposer Die
o Cross-Section – Interposer
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedback
Related Reports
About System Plus
Package Cross-Section – GPU – Interposer Bumps

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Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Summary
o Graphic Card View &
Teardown
o Package X-Ray Images
o Package Overview
o Package Opening
o Package Cross Section
o HBM Stack-Logic/DRAM Die
o HBM Stack Cross Section
o GPU Die
o Cross-Section – GPU
o Filler Die
o Cross-Section – Filler
o Interposer Die
o Cross-Section – Interposer
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedback
Related Reports
About System Plus
Die Cross-Section – GPU

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Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Summary
o Graphic Card View &
Teardown
o Package X-Ray Images
o Package Overview
o Package Opening
o Package Cross Section
o HBM Stack-Logic/DRAM Die
o HBM Stack Cross Section
o GPU Die
o Cross-Section – GPU
o Filler Die
o Cross-Section – Filler
o Interposer Die
o Cross-Section – Interposer
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedback
Related Reports
About System Plus
Package Cross-Section – Interposer (under GPU Die)

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Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
o Summary
o Graphic Card View &
Teardown
o Package X-Ray Images
o Package Overview
o Package Opening
o Package Cross Section
o HBM Stack-Logic/DRAM Die
o HBM Stack Cross Section
o GPU Die
o Cross-Section – GPU
o Filler Die
o Cross-Section – Filler
o Interposer Die
o Cross-Section – Interposer
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedback
Related Reports
About System Plus
Package Cross-Section – Interposer
Interposer Cross-Section – SEM View
©2021 by System Plus Consulting

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P H Y S I C A L
COMPARISON

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Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Comparison V100/ P100/ A100
o Characteristics
o Package
o HBM Stack
o Interposer
o Summary
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedback
Related Reports
About System Plus
Comparison NVIDIA Tesla V100, P100 and Ampere A100- Package Cross Section

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MANUFACTURING
PROCESS FLOW

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Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Comparison V100/ P100/ A100
Manufacturing Process Flow
o Global Overview
o GPU Process
o GPU Wafer Fab Unit
o HBM Process
o HBM Wafer Fab Unit
o Interposer & CoW Process
o Interposer Wafer Fab Unit
o Final Assembly Process
o Final Assembly Unit
Cost Analysis
Selling Price Analysis
Feedback
Related Reports
About System Plus
HBM Stacking Process Flow (2/4)

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Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Comparison V100/ P100/ A100
Manufacturing Process Flow
o Global Overview
o GPU Process
o GPU Wafer Fab Unit
o HBM Process
o HBM Wafer Fab Unit
o Interposer & CoW Process
o Interposer Wafer Fab Unit
o Final Assembly Process
o Final Assembly Unit
Cost Analysis
Selling Price Analysis
Feedback
Related Reports
About System Plus
Interposer – CoW Process Flow (2/7)

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C O S T
ANALYSIS

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Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Comparison V100/ P100/ A100
Manufacturing Process Flow
Cost Analysis
o Summary
o Supply Chain
o Yields
o GPU Cost
o HBM Stack Cost
o Interposer Cost
o CoW Assembly Cost
o Component Cost
Selling Price Analysis
Feedback
Related Reports
About System Plus
GPU Wafer & Die Cost

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Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Comparison V100/ P100/ A100
Manufacturing Process Flow
Cost Analysis
o Summary
o Supply Chain
o Yields
o GPU Cost
o HBM Stack Cost
o Interposer Cost
o CoW Assembly Cost
o Component Cost
Selling Price Analysis
Feedback
Related Reports
About System Plus
DRAM Microbumping Cost

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Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Comparison V100/ P100/ A100
Manufacturing Process Flow
Cost Analysis
o Summary
o Supply Chain
o Yields
o GPU Cost
o HBM Stack Cost
o Interposer Cost
o CoW Assembly Cost
o Component Cost
Selling Price Analysis
Feedback
Related Reports
About System Plus
DRAM Wafer & Die Cost

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Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Comparison V100/ P100/ A100
Manufacturing Process Flow
Cost Analysis
o Summary
o Supply Chain
o Yields
o GPU Cost
o HBM Stack Cost
o Interposer Cost
o CoW Assembly Cost
o Component Cost
Selling Price Analysis
Feedback
Related Reports
About System Plus
HBM Stack Cost

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Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Comparison V100/ P100/ A100
Manufacturing Process Flow
Cost Analysis
o Summary
o Supply Chain
o Yields
o GPU Cost
o HBM Stack Cost
o Interposer Cost
o CoW Assembly Cost
o Component Cost
Selling Price Analysis
Feedback
Related Reports
About System Plus
Chip-on-Wafer (CoW) Stack Wafer Cost

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Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Feedbacks
Related Reports
About System Plus
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
Related Reports
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ADVANCED PACKAGING
• Computing for Datacenter Servers 2021
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REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
ADVANCED PACKAGING
• NVIDIA Tesla P100 GPU with HBM2
• Intel Foveros 3D Packaging Technology

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COMPANY
SERVICES

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Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedback
Related Analyses
About System Plus
o Company services
o Contact
A Structure, Process and Cost Analysis
Reverse Costing® consists in disassembling a device or a system, in order
to identify its technology and determine its manufacturing processes and
cost, using in-house models and tools.
OUR CORE ACTIVITY : THE REVERSE COSTING®

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Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedback
Related Analyses
About System Plus
o Company services
o Contact
FIELDS OF EXPERTISE

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Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedback
Related Analyses
About System Plus
o Company services
o Contact
BUSINESS MODEL

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Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedback
Related Analyses
About System Plus
o Company services
o Contact
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Overview / Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Cost Comparison
Selling Price Analysis
Feedback
Related Analyses
About System Plus
o Company services
o Contact
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