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NVIDIA A100 ampere GPU

NVIDIA’s new generation Graphics Processing Unit (GPU) with TSMC CoWoS, 40GB Samsung HBM2, 2.5D and 3D packaging.

More information: https://www.systemplus.fr/reverse-costing-reports/nvidia-a100-ampere-gpu/

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NVIDIA A100 ampere GPU

  1. 1. ©2021 System Plus Consulting | SP20579 NVIDIA A100 Ampere GPU | Sample 1 22 Bd Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16 info@systemplus.fr www.systemplus.fr NVIDIA A100 Ampere GPU NVIDIA’s new generation Graphics Processing Unit (GPU) with TSMC CoWoS, 40GB Samsung HBM2, 2.5D and 3D packaging. SP20579 - Advanced Packaging report by Belinda Dube Laboratory Analysis by Véronique Le Troadec February 2021 – Sample REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
  2. 2. ©2021 System Plus Consulting | SP20579 NVIDIA A100 Ampere GPU | Sample 2 Table of Contents Overview / Introduction 4 o Executive Summary o Reverse Costing Methodology Company Profile 8 o 2.5D & 3D Packaging Market o High Bandwidth Memory o TSMC CoWoS o TSV Technology o NVIDIA Company Profile o NVIDIA Ampere A100 Characteristics o GPU Supply Chain Physical Analysis 31 o Summary of the Physical Analysis o Physical Analysis Methodology o NVIDIA Ampere A100 Teardown o Package ✓ Views & Dimensions ✓ Passives Assembly ✓ Laminate & IHS Cross-Section o DRAM Die ✓ View, Dimensions & Marking ✓ µBumps & TSVs ✓ HBM2 Stack Cross-Section o GPU Die ✓ View, Dimensions & Marking ✓ µBumps ✓ GPU Cross-Section o Filler Die ✓ View, Dimensions & Marking ✓ Filler Cross-Section o Interposer Die ✓ View, Dimensions & Marking ✓ µBumps & TSVs ✓ Interposer Cross-Section o Comparison with AMD Fury X including SK-Hynix HBM1 Manufacturing Process Flow 160 o Global Overview o GPU Process Description & Foundry o Interposer Process Flow & Foundry o HBM2 Stack Process Flow & Foundry o CoWoS Process Flow & Foundry Cost Analysis 191 o Summary of the Cost Analysis o Yields Explanation & Hypotheses o GPU Front-End & Die Cost o HBM2 Stack ✓ TSV Manufacturing Cost ✓ Micro-Bumping Manufacturing Cost ✓ Dies Cost (DRAM + Logic) ✓ HBM2 Stack Cost o Interposer ✓ TSV Manufacturing Cost ✓ Microbumping Cost ✓ Interposer Cost o CoWoS Assembly Manufacturing Cost o Final Component Cost Estimated Price Analysis 213 o Manufacturer Financial Ratios o Component Manufacturer Price Feedback 216 System plus Consulting Services 218
  3. 3. ©2021 System Plus Consulting | SP20579 NVIDIA A100 Ampere GPU | Sample 3 O V E R V I E W METHODOLOGY
  4. 4. ©2021 System Plus Consulting | SP20579 NVIDIA A100 Ampere GPU | Sample 4 Overview / Introduction o Executive Summary o Reverse Costing Methodology o Glossary Company Profile & Supply Chain Physical Analysis Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedback Related Reports About System Plus Executive Summary • The high end electronic packaging market was worth more than $880 million dollars in 2019. The biggest market for high end performance packaging comes from telecom and infrastructure. It has more than a 50% market share according to Yole Développement’s report High-End Performance Packaging: 3D/2.5D Integration 2020. • The NVIDIA Ampere A100 targets high performance data centers, artificial intelligence applications, data analytics, and High-Performance Computing (HPC). It uses advanced technologies, including TSMC’s 7nm FinFET chip, 3D stacked memory with 2.5D integration on a silicon interposer in a Chip-on-Wafer-on-Substrate (CoWoS) process. • The new generation GPU provides significantly higher performance compared to the previous generation. The NVIDIA Ampere A100 provides the consumer market with 40GB or 80GB of Samsung’s high bandwidth memory (HBM2). Samsung’s HBM2 is engineered to sustain and support high speed data transfer. The HBM2 DRAM solution satisfies the market need for high performance, energy efficiency, and compact integration. The NVIDIA Ampere A100 is characterized by GPU Memory Bandwidth of 1,555 GB/s. A 3D assembly process yields HBM2 stacks composed of eight 1GB memory dies and one logic die, connected with via-middle through-silicon vias and micro-bumps. • More than 6,000mm² of silicon area is integrated in a single 55mm x 55mm 12-layer ball grid array (BGA) package of the NVIDIA Ampere A100. Two major semiconductor leaders, Samsung and TSMC, collaborate to deliver this much silicon in a single package. TSMC is the main provider for the NVIDIA Ampere A100. Using its 2.5D CoWoS platform, it manufactures the world’s largest processor built on 7nm process technology. This GPU die features a 7nm FinFET transistor process and 54 billion transistors on a single chip. It also produces a large silicon interposer on which the GPU and HBM2 memory is assembled at the wafer-level. • The report includes a complete physical analysis of the package, the GPU die, interposer die and the HBM2 DRAM. Along with the manufacturing process of the silicon dies, CoWoS process and final assembly, this report comes with a cost analysis and a price estimation of the NVIDIA Ampere A100. Finally, the report includes a comparison to highlight the similarities and differences between the NVIDIA Ampere A100 and NVIDIA’s Tesla P100 and V100.
  5. 5. ©2021 System Plus Consulting | SP20579 NVIDIA A100 Ampere GPU | Sample 5 PHYSICAL ANALYSIS
  6. 6. ©2021 System Plus Consulting | SP20579 NVIDIA A100 Ampere GPU | Sample 6 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Graphic Card View & Teardown o Package X-Ray Images o Package Overview o Package Opening o Package Cross Section o HBM Stack-Logic/DRAM Die o HBM Stack Cross Section o GPU Die o Cross-Section – GPU o Filler Die o Cross-Section – Filler o Interposer Die o Cross-Section – Interposer Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedback Related Reports About System Plus Graphic Card Teardown NVIDIA Ampere A100 Teardown – PCB Front Side ©2021 by System Plus Consulting NVIDIA Ampere A100 Teardown – PCB Back Side ©2021 by System Plus Consulting
  7. 7. ©2021 System Plus Consulting | SP20579 NVIDIA A100 Ampere GPU | Sample 7 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Graphic Card View & Teardown o Package X-Ray Images o Package Overview o Package Opening o Package Cross Section o HBM Stack-Logic/DRAM Die o HBM Stack Cross Section o GPU Die o Cross-Section – GPU o Filler Die o Cross-Section – Filler o Interposer Die o Cross-Section – Interposer Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedback Related Reports About System Plus NVIDIA Ampere A100 X-Ray Image ©2021 by System Plus Consulting NVIDIA AMPERE 100 Package - XRAY Images-
  8. 8. ©2021 System Plus Consulting | SP20579 NVIDIA A100 Ampere GPU | Sample 8 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Graphic Card View & Teardown o Package X-Ray Images o Package Overview o Package Opening o Package Cross Section o HBM Stack-Logic/DRAM Die o HBM Stack Cross Section o GPU Die o Cross-Section – GPU o Filler Die o Cross-Section – Filler o Interposer Die o Cross-Section – Interposer Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedback Related Reports About System Plus Package Opening
  9. 9. ©2021 System Plus Consulting | SP20579 NVIDIA A100 Ampere GPU | Sample 9 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Graphic Card View & Teardown o Package X-Ray Images o Package Overview o Package Opening o Package Cross Section o HBM Stack-Logic/DRAM Die o HBM Stack Cross Section o GPU Die o Cross-Section – GPU o Filler Die o Cross-Section – Filler o Interposer Die o Cross-Section – Interposer Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedback Related Reports About System Plus Package Cross Section Package Cross Section ©2021 by System Plus Consulting
  10. 10. ©2021 System Plus Consulting | SP20579 NVIDIA A100 Ampere GPU | Sample 10 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Graphic Card View & Teardown o Package X-Ray Images o Package Overview o Package Opening o Package Cross Section o HBM Stack-Logic/DRAM Die o HBM Stack Cross Section o GPU Die o Cross-Section – GPU o Filler Die o Cross-Section – Filler o Interposer Die o Cross-Section – Interposer Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedback Related Reports About System Plus Board Cross-Section
  11. 11. ©2021 System Plus Consulting | SP20579 NVIDIA A100 Ampere GPU | Sample 11 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Graphic Card View & Teardown o Package X-Ray Images o Package Overview o Package Opening o Package Cross Section o HBM Stack-Logic/DRAM Die o HBM Stack Cross Section o GPU Die o Cross-Section – GPU o Filler Die o Cross-Section – Filler o Interposer Die o Cross-Section – Interposer Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedback Related Reports About System Plus Package Cross-Section – HBM2 Stack HBM Stack Cross-Section – SEM View ©2021 by System Plus Consulting
  12. 12. ©2021 System Plus Consulting | SP20579 NVIDIA A100 Ampere GPU | Sample 12 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Graphic Card View & Teardown o Package X-Ray Images o Package Overview o Package Opening o Package Cross Section o HBM Stack-Logic/DRAM Die o HBM Stack Cross Section o GPU Die o Cross-Section – GPU o Filler Die o Cross-Section – Filler o Interposer Die o Cross-Section – Interposer Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedback Related Reports About System Plus Package Cross-Section – HBM2 Stack
  13. 13. ©2021 System Plus Consulting | SP20579 NVIDIA A100 Ampere GPU | Sample 13 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Graphic Card View & Teardown o Package X-Ray Images o Package Overview o Package Opening o Package Cross Section o HBM Stack-Logic/DRAM Die o HBM Stack Cross Section o GPU Die o Cross-Section – GPU o Filler Die o Cross-Section – Filler o Interposer Die o Cross-Section – Interposer Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedback Related Reports About System Plus Package Cross-Section – GPU – Interposer Bumps
  14. 14. ©2021 System Plus Consulting | SP20579 NVIDIA A100 Ampere GPU | Sample 14 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Graphic Card View & Teardown o Package X-Ray Images o Package Overview o Package Opening o Package Cross Section o HBM Stack-Logic/DRAM Die o HBM Stack Cross Section o GPU Die o Cross-Section – GPU o Filler Die o Cross-Section – Filler o Interposer Die o Cross-Section – Interposer Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedback Related Reports About System Plus Die Cross-Section – GPU
  15. 15. ©2021 System Plus Consulting | SP20579 NVIDIA A100 Ampere GPU | Sample 15 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Graphic Card View & Teardown o Package X-Ray Images o Package Overview o Package Opening o Package Cross Section o HBM Stack-Logic/DRAM Die o HBM Stack Cross Section o GPU Die o Cross-Section – GPU o Filler Die o Cross-Section – Filler o Interposer Die o Cross-Section – Interposer Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedback Related Reports About System Plus Package Cross-Section – Interposer (under GPU Die)
  16. 16. ©2021 System Plus Consulting | SP20579 NVIDIA A100 Ampere GPU | Sample 16 Overview / Introduction Company Profile & Supply Chain Physical Analysis o Summary o Graphic Card View & Teardown o Package X-Ray Images o Package Overview o Package Opening o Package Cross Section o HBM Stack-Logic/DRAM Die o HBM Stack Cross Section o GPU Die o Cross-Section – GPU o Filler Die o Cross-Section – Filler o Interposer Die o Cross-Section – Interposer Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedback Related Reports About System Plus Package Cross-Section – Interposer Interposer Cross-Section – SEM View ©2021 by System Plus Consulting
  17. 17. ©2021 System Plus Consulting | SP20579 NVIDIA A100 Ampere GPU | Sample 17 P H Y S I C A L COMPARISON
  18. 18. ©2021 System Plus Consulting | SP20579 NVIDIA A100 Ampere GPU | Sample 18 Overview / Introduction Company Profile & Supply Chain Physical Analysis Comparison V100/ P100/ A100 o Characteristics o Package o HBM Stack o Interposer o Summary Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedback Related Reports About System Plus Comparison NVIDIA Tesla V100, P100 and Ampere A100- Package Cross Section
  19. 19. ©2021 System Plus Consulting | SP20579 NVIDIA A100 Ampere GPU | Sample 19 MANUFACTURING PROCESS FLOW
  20. 20. ©2021 System Plus Consulting | SP20579 NVIDIA A100 Ampere GPU | Sample 20 Overview / Introduction Company Profile & Supply Chain Physical Analysis Comparison V100/ P100/ A100 Manufacturing Process Flow o Global Overview o GPU Process o GPU Wafer Fab Unit o HBM Process o HBM Wafer Fab Unit o Interposer & CoW Process o Interposer Wafer Fab Unit o Final Assembly Process o Final Assembly Unit Cost Analysis Selling Price Analysis Feedback Related Reports About System Plus HBM Stacking Process Flow (2/4)
  21. 21. ©2021 System Plus Consulting | SP20579 NVIDIA A100 Ampere GPU | Sample 21 Overview / Introduction Company Profile & Supply Chain Physical Analysis Comparison V100/ P100/ A100 Manufacturing Process Flow o Global Overview o GPU Process o GPU Wafer Fab Unit o HBM Process o HBM Wafer Fab Unit o Interposer & CoW Process o Interposer Wafer Fab Unit o Final Assembly Process o Final Assembly Unit Cost Analysis Selling Price Analysis Feedback Related Reports About System Plus Interposer – CoW Process Flow (2/7)
  22. 22. ©2021 System Plus Consulting | SP20579 NVIDIA A100 Ampere GPU | Sample 22 C O S T ANALYSIS
  23. 23. ©2021 System Plus Consulting | SP20579 NVIDIA A100 Ampere GPU | Sample 23 Overview / Introduction Company Profile & Supply Chain Physical Analysis Comparison V100/ P100/ A100 Manufacturing Process Flow Cost Analysis o Summary o Supply Chain o Yields o GPU Cost o HBM Stack Cost o Interposer Cost o CoW Assembly Cost o Component Cost Selling Price Analysis Feedback Related Reports About System Plus GPU Wafer & Die Cost
  24. 24. ©2021 System Plus Consulting | SP20579 NVIDIA A100 Ampere GPU | Sample 24 Overview / Introduction Company Profile & Supply Chain Physical Analysis Comparison V100/ P100/ A100 Manufacturing Process Flow Cost Analysis o Summary o Supply Chain o Yields o GPU Cost o HBM Stack Cost o Interposer Cost o CoW Assembly Cost o Component Cost Selling Price Analysis Feedback Related Reports About System Plus DRAM Microbumping Cost
  25. 25. ©2021 System Plus Consulting | SP20579 NVIDIA A100 Ampere GPU | Sample 25 Overview / Introduction Company Profile & Supply Chain Physical Analysis Comparison V100/ P100/ A100 Manufacturing Process Flow Cost Analysis o Summary o Supply Chain o Yields o GPU Cost o HBM Stack Cost o Interposer Cost o CoW Assembly Cost o Component Cost Selling Price Analysis Feedback Related Reports About System Plus DRAM Wafer & Die Cost
  26. 26. ©2021 System Plus Consulting | SP20579 NVIDIA A100 Ampere GPU | Sample 26 Overview / Introduction Company Profile & Supply Chain Physical Analysis Comparison V100/ P100/ A100 Manufacturing Process Flow Cost Analysis o Summary o Supply Chain o Yields o GPU Cost o HBM Stack Cost o Interposer Cost o CoW Assembly Cost o Component Cost Selling Price Analysis Feedback Related Reports About System Plus HBM Stack Cost
  27. 27. ©2021 System Plus Consulting | SP20579 NVIDIA A100 Ampere GPU | Sample 27 Overview / Introduction Company Profile & Supply Chain Physical Analysis Comparison V100/ P100/ A100 Manufacturing Process Flow Cost Analysis o Summary o Supply Chain o Yields o GPU Cost o HBM Stack Cost o Interposer Cost o CoW Assembly Cost o Component Cost Selling Price Analysis Feedback Related Reports About System Plus Chip-on-Wafer (CoW) Stack Wafer Cost
  28. 28. ©2021 System Plus Consulting | SP20579 NVIDIA A100 Ampere GPU | Sample 28 Overview / Introduction Company Profile & Supply Chain Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis Selling Price Analysis Feedbacks Related Reports About System Plus REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING Related Reports MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT ADVANCED PACKAGING • Computing for Datacenter Servers 2021 • Processor Quarterly Market Monitor REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING ADVANCED PACKAGING • NVIDIA Tesla P100 GPU with HBM2 • Intel Foveros 3D Packaging Technology
  29. 29. ©2021 System Plus Consulting | SP20579 NVIDIA A100 Ampere GPU | Sample 29 COMPANY SERVICES
  30. 30. ©2021 System Plus Consulting | SP20579 NVIDIA A100 Ampere GPU | Sample 30 Overview / Introduction Company Profile & Supply Chain Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis Cost Comparison Selling Price Analysis Feedback Related Analyses About System Plus o Company services o Contact A Structure, Process and Cost Analysis Reverse Costing® consists in disassembling a device or a system, in order to identify its technology and determine its manufacturing processes and cost, using in-house models and tools. OUR CORE ACTIVITY : THE REVERSE COSTING®
  31. 31. ©2021 System Plus Consulting | SP20579 NVIDIA A100 Ampere GPU | Sample 31 Overview / Introduction Company Profile & Supply Chain Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis Cost Comparison Selling Price Analysis Feedback Related Analyses About System Plus o Company services o Contact FIELDS OF EXPERTISE
  32. 32. ©2021 System Plus Consulting | SP20579 NVIDIA A100 Ampere GPU | Sample 32 Overview / Introduction Company Profile & Supply Chain Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis Cost Comparison Selling Price Analysis Feedback Related Analyses About System Plus o Company services o Contact BUSINESS MODEL
  33. 33. ©2021 System Plus Consulting | SP20579 NVIDIA A100 Ampere GPU | Sample 33 Overview / Introduction Company Profile & Supply Chain Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis Cost Comparison Selling Price Analysis Feedback Related Analyses About System Plus o Company services o Contact WORLDWIDE PRESENCE 100+ collaborators in 8 different countries Headquarters › Nantes – System Plus Consulting › Lyon – Yole Développement Boise Cornelius Raleigh Phoenix Austin Singapore Hsinchu Tokyo Shenzhen Seoul Frankfurt Nantes Lyon
  34. 34. ©2021 System Plus Consulting | SP20579 NVIDIA A100 Ampere GPU | Sample 34 Overview / Introduction Company Profile & Supply Chain Physical Analysis Physical Comparison Manufacturing Process Flow Cost Analysis Cost Comparison Selling Price Analysis Feedback Related Analyses About System Plus o Company services o Contact CONTACTS HEADQUARTER & CUSTOM PROJECT SERVICES 22 Bd Benoni Goullin 44200 Nantes, France sales@systemplus.fr - +33 2 40 18 09 16 REPORTS & MONITORS WEBSITE www.systemplus.fr TRACKS WEBSITE www.reverse-costing.com MARKETING, COMMUNICATION & PR Camille Veyrier, Marketing & Communication camille.veyrier@yole.fr - +33 472 83 01 01 Sandrine Leroy, Public Relations sandrine.leroy@yole.fr - +33 4 72 83 01 89 Western US & Canada Steve Laferriere - steve.laferriere@yole.fr + 1 310 600 8267 Eastern US & Canada Chris Youman - chris.youman@yole.fr +1 919 607 9839 Europe and RoW Lizzie Levenez - lizzie.levenez@yole.fr +49 15 123 544 182 Benelux, UK & Spain Marine Wybranietz - marine.wybranietz@yole.fr +49 69 96 21 76 78 India and RoA Takashi Onozawa - takashi.onozawa@yole.fr +81 80 4371 4887 Greater China Mavis Wang - mavis.wang@yole.fr +886 979 336 809 +86 136 6156 6824 Korea Peter Ok - peter.ok@yole.fr +82 10 4089 0233 Japan Miho Ohtake - miho.ohtake@yole.fr +81 34 4059 204 Japan and Singapore Itsuyo Oshiba - itsuyo.oshiba@yole.fr +81 80 3577 3042 Japan Toru Hosaka – toru.hosaka@yole.fr +81 90 1775 3866 Follow us on REPORTS, MONITORS & TRACKS

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