TonyC Chen

New Taipei City, Taiwan Taiwan

Sr. Package Engineer at VIA Labs, Inc.

Electronics / Computer Hardware

Well in communication in heterogenization working conditions. Proactive with different teams and backgrounds to figure scientific paths to set the design into production. Experienced in IC substrate surface finish process development, package assembly, and now as packaging engineer specified in high speed IC packaging design in USB 3.0/3.1 and Type-C application. Based on leadframe design into MP in OSATS. Easy going and proactive in learning new ideas and knowledge. Currently looking for new technology packaging engineering field. QUALIFICATION HIGHLIGHTS or TECHNICAL EXPERTISE • Experienced in develop FC+WB CSP hybrid substrate for Nokia mobile platform use. • Experienc