Personal Information
Entreprise/Lieu de travail
New Taipei City, Taiwan Taiwan
Profession
Sr. Package Engineer at VIA Labs, Inc.
Secteur d’activité
Electronics / Computer Hardware
À propos
Well in communication in heterogenization working conditions. Proactive with different teams and backgrounds to figure scientific paths to set the design into production. Experienced in IC substrate surface finish process development, package assembly, and now as packaging engineer specified in high speed IC packaging design in USB 3.0/3.1 and Type-C application. Based on leadframe design into MP in OSATS.
Easy going and proactive in learning new ideas and knowledge. Currently
looking for new technology packaging engineering field.
QUALIFICATION HIGHLIGHTS or TECHNICAL EXPERTISE
• Experienced in develop FC+WB CSP hybrid substrate for Nokia mobile platform use.
• Experienc
Mots-clés
親子;手機;
Tout plus
Personal Information
Entreprise/Lieu de travail
New Taipei City, Taiwan Taiwan
Profession
Sr. Package Engineer at VIA Labs, Inc.
Secteur d’activité
Electronics / Computer Hardware
À propos
Well in communication in heterogenization working conditions. Proactive with different teams and backgrounds to figure scientific paths to set the design into production. Experienced in IC substrate surface finish process development, package assembly, and now as packaging engineer specified in high speed IC packaging design in USB 3.0/3.1 and Type-C application. Based on leadframe design into MP in OSATS.
Easy going and proactive in learning new ideas and knowledge. Currently
looking for new technology packaging engineering field.
QUALIFICATION HIGHLIGHTS or TECHNICAL EXPERTISE
• Experienced in develop FC+WB CSP hybrid substrate for Nokia mobile platform use.
• Experienc
Mots-clés
親子;手機;
Tout plus