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Session III The View From The Top Supply Chain Challenges in Developing Markets
Agenda ,[object Object],[object Object],[object Object],[object Object]
The markets we serve ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
Technology Polyurethanes ,[object Object],Sodium Chloride Borohydrides SiC, ZnSe, ZnS Structures MgO Acrylic, Styrenic & Vinyl Acetate Copolymers and Multipolymers Biocides Acrylic Monomers Mercaptans & Sulfides Polyesters Photoactive Materials Organometallics Plating Systems Water Soluble Polymers Abrasives Pigment Dispersions Photoactive Materials Functionalized Polymers Polybutadiene, PVDC Organic Synthesis Inorganics Radical Polymerization Condensation Polymerization
Technology Organic Synthesis Radical Polymerization Process Chemicals  Automotive Coatings Coatings Consumer/ Industrial Specialties  Powder Coatings Coatings Microelectronics    Technologies Adhesives & Sealants Plastics Additives Process Chemicals Microelectronics Automotive Coatings Monomers Process Chemicals Plastics Additives  Adhesives & Sealants Functional Coatings Plastics Additives Morton Salt Adv. Materials CMP Technologies Circuit Board Technologies Circuit Board Technologies Organic Synthesis Inorganics Radical Polymerization Condensation Polymerization
Rohm and Haas Today
Rohm and Haas Today ,[object Object],[object Object],[object Object],[object Object]
Agenda ,[object Object],[object Object],[object Object],[object Object]
Logistics’ Priority: ,[object Object]
Rohm and Haas Inter-Regional Logistics ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
Air  Freight ,[object Object],[object Object]
Agenda ,[object Object],[object Object],[object Object],[object Object]
Electronic Materials ,[object Object],[object Object],Markets • Semiconductors • ICs • Microprocessors • Wafer Substrates • Disk Drives • Optics  Markets •  Electronic Components • Electronic Packaging • High Performance Finishes • Optoelectronics • Tin Mill Products  Markets •  ASICS • Logic • DRAM • Flash • Compound Semiconductors • Thin Film Head
Microelectronic Technologies Today -  ATC Cleanroom The ATC is currently outfitted with 1,500 ft² for cleanroom space, which is configured with one of the industry's most advanced 193 nm lithography cells. Another 3,500 ft² of cleanroom space is available for expansion and the ballroom-style cleanroom space enables easy access for demo and tool rotation.
Chemical Mechanical Polishing (CMP) Hsinchu Plant
Market Priorities ,[object Object],[object Object],[object Object]
Challenges ,[object Object],[object Object],[object Object],[object Object]
Current Issues - China ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
Current Issues – Shipment Status
Shipment Visibility – In House or Out Source?? ,[object Object],[object Object],[object Object],[object Object]
Evolution of information tools ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
Thank You!

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11. david pope

  • 1. Session III The View From The Top Supply Chain Challenges in Developing Markets
  • 2.
  • 3.
  • 4.
  • 5. Technology Organic Synthesis Radical Polymerization Process Chemicals Automotive Coatings Coatings Consumer/ Industrial Specialties Powder Coatings Coatings Microelectronics Technologies Adhesives & Sealants Plastics Additives Process Chemicals Microelectronics Automotive Coatings Monomers Process Chemicals Plastics Additives Adhesives & Sealants Functional Coatings Plastics Additives Morton Salt Adv. Materials CMP Technologies Circuit Board Technologies Circuit Board Technologies Organic Synthesis Inorganics Radical Polymerization Condensation Polymerization
  • 7.
  • 8.
  • 9.
  • 10.
  • 11.
  • 12.
  • 13.
  • 14. Microelectronic Technologies Today - ATC Cleanroom The ATC is currently outfitted with 1,500 ft² for cleanroom space, which is configured with one of the industry's most advanced 193 nm lithography cells. Another 3,500 ft² of cleanroom space is available for expansion and the ballroom-style cleanroom space enables easy access for demo and tool rotation.
  • 15. Chemical Mechanical Polishing (CMP) Hsinchu Plant
  • 16.
  • 17.
  • 18.
  • 19. Current Issues – Shipment Status
  • 20.
  • 21.

Notes de l'éditeur

  1. The presentation should address the following: Key Process Capabilities – improvements over current processes and areas of commonality across businesses How we are Organized – Who is leading the program. Phases and Timing – When will this occur. SAP R/3 – Answers what is the enabling solution. Implementation – Answers how.
  2. The presentation should address the following: Key Process Capabilities – improvements over current processes and areas of commonality across businesses How we are Organized – Who is leading the program. Phases and Timing – When will this occur. SAP R/3 – Answers what is the enabling solution. Implementation – Answers how.