X3850x5techpresentation09 29-2010-101118124714-phpapp01

© 2009 IBM Corporation
IBM Confidential
x3850 X5 Technical Presentation
March 30, 2009
Ralph M. Begun
System Development Lead
begun@us.ibm.com
Michelle Gottschalk
WW Product Manager
mgottsc@us.ibm.com

System x and BladeCenter
2
IBM Confidential
NDA DISCLOSURE ONLY
x3850 X5 overview

3
IBM Confidential
NDA DISCLOSURE ONLY
IBM System x3850 X5
Flagship System x platform for leadership scalable performance
and capacity
Versatile 4-socket, 4U rack-optimized scalable enterprise server
provides a flexible platform for maximum utilization, reliability and
performance of compute- and memory-intensive workloads.
System Specifications
 4x Intel Xeon 7500-series CPUs
 64 DDR3 DIMMs, up to 96 with MAX5
 6 open PCIe slots (+ 2 additional)
 Up to 8x 2.5” HDDs or 16x 1.8” SSDs
 RAID 0/1 Std, Optional RAID 5/6
 2x 1GB Ethernet LOM
 2x 10GB Ethernet SFP+ Virtual Fabric / FCoEE
 Scalable to 8S, 128 DIMM
 Internal USB for embedded hypervisor
 IMM, uEFI & IBM Systems Director
Maximize Memory
– 64 threads and 1TB capacity for 3.3x database and 3.6x
the virtualization performance over industry 2-socket x86
(Intel Xeon 5500 Series) systems
– MAX5 memory expansion for 50% more virtual machines
and leadership database performance
Minimize Cost
– Lower cost, high performance configurations reaching
desired memory capacity using less expensive DIMMs
– eXFlash 480k internal IOPs for 40x local database
performance and $1.3M savings in equal IOPs storage
Simplify Deployment
– Pre-defined database and virtualization workload optimized
systems for faster deployment and faster time to value

© 2009 IBM Corporation4
System x® and BladeCenter
MAX5
x3850 X5 and x3950 X5 Models
x3850 X5 – Four Socket Scalable Server
IBM System x high end four-socket server with Intel 7500 Series processors, IMM,
RAID 0,1, dualGigE, Emulex 10GigE, 2x1975W power supplies x3850 X5
x3850 X5 – Memory Expanded Four Socket Scalable Server
IBM System x high end four-socket scalable server with MAX5, IMM, RAID 0,1,
dualGigE, Emulex 10GigE, 1x4QPI cable kit, 2x1975W power supplies
.
Workload Optimized Models
Richly-configured models optimized for virtualization environments or database workloads
x3850 X5
7145-1RY 2x E7520 4 Core 1.86GHz18MB x4.8 95W (S4S), 4x4GB
7145-2RY 2x E7530 6 Core 1.86GHzT,12MB x5.86 105W (S4S), 4x4GB
7145-3RY 2x E7540 6 Core 2.0GHzT,18MB x6.4 105W (S8S), 4x4GB
7145-4RY 2x X7550 8 Core 2.0GHzT,18MB x6.4 130W (S8S), 4x4GB
7145-5RY 2x X7560 8 Core 2.27GHzT,24MB x6.4 130W (S8S), 4x4GB
7145-E4Y
2x X7550 8 Core 2.0GHzT,18MB x6.4 130W (S8S), 4x4GB
x3850 X5
7145-2SY 4x E7530 6 Core 1.86GHzT,12MB x5.86 105W (S4S), 8x4GB + eX5 MAX5, 2x2GB
7145-4SY 4x X7550 8 Core 2.0GHzT,18MB x6.4 130W (S8S) 8x4GB + eX5 MAX5, 2x2GB
7145-5SY 4x X7560 8 Core 2.27GHzT,24MB x6.4 130W (S8S) 8x4GB + eX5 MAX5, 2x2GB
x3950 X5 Virtualization Optimized Models
7145-4DX
4x X7550 Turbo 2.0GHz/6.4GTS-18MB 8C 130W. 64x4GB, +eX5 MAX5, 32x4GB, VMWare
ESXi Hypervisor USB key
x3850 X5 Database Optimized Models
7145-5DY
2x X7560 Turbo 2.26GHz/6.4GTS-24MB 8C 4QPI, 8x4GB, 2x1975W, IMM, 1 x Intruder
backplane, dual GigE, Emulex 10GigE
7145-4FY 4 x X7550 Turbo 2.0GHz/6.4GTS-18MB 8C 130W, 32x4GB, 16x1.8” 200GB SSD,RAID 5,6
7145-5GY 4 x X7560 Turbo 2.26GHz/6.4GTS-24MB 8C 130W, 32x4GB, 16x1.8”200GB SSD,RAID 5,6
x3850 X5 w/ MAX5

Intel Xeon chipset

Intel Boxboro-EX 4S design
• Connectivity
– Fully-connected (4 Intel®
QuickPath
interconnects per socket)
– 6.4, 5.86, or 4.8 GT/s on all links
– Socket-LS
– With 2 IOHs: 82 PCIe lanes (72 Gen2
Boxboro lanes + 4 Gen1 lanes on unused
ESI port + 6 Gen1 ICH10 lanes)
• Memory
– CPU-integrated memory controller
– Registered DDR3-1066 DIMMs running at
speeds of 800, 978 or 1066 MHz via on-
board memory buffer
– 64 DIMM support (4:1 DIMM to buffer
ratio)
• Technologies & Enabling
– Intel®
Intelligent Power Node Manager
– Virtualization: VT-x, VT-d, & VT-c
– Security: TPM 1.2, Measured Boot, UEFI
– RAS features
MB
MBMB
MBMB
MBMB
MB
MB
MBMB
MBMB
MBMB
MB
Intel® QuickPath
interconnects
BoxboroBoxboro
X4
ESI
BoxboroBoxboro
ICH
10*
XeonXeon
XeonXeon
x8x8
2x4
x8 x4x8 x8x8
x16
x8 x4x8
x16
2x4
2x4
2x4
X4PCIeGen1
XeonXeon
XeonXeon
6

• Modified Boxboro-EX ingredients to offer a
new high-memory 2S platform
• Xeon 2S will only be validated with up to 2
IOHs
• Xeon 2S SKUs cannot scale natively (w/ QPI)
beyond 2skts
• Xeon 2S SKUs can scale beyond 2skts with a
node controller
• Comparison w/ Boxboro-EX & Tylersburg-EP:
Boxboro-EX 2S
(2 IOH)
Tylersburg-EP
(2 IOH)
# of cores per CPU Up to 8 Up to 4
QuickPath
Interconnect
4^ 2
# of DIMMs 32 18
PCIe lanes 72+10 72+6
BoxboroBoxboro
X4
ESI
BoxboroBoxboro
ICH
10*
XeonXeon XeonXeon
x8x8
2x4
x8
2x2
x4x8 x8x8
x16
x8
2x2
x4x8
x16
2x4
2x4
2x4
X4PCIeGen1
Intel® QuickPath
interconnects
Intel Boxboro-EX 2S Platform
Validated Configuration
7

Xeon® 7500/6500 Platform Memory
 4 Socket platform capability (64 DIMMs):
– Up to 16 DDR3 DIMMs per socket via up to four
Scalable Memory Buffers
– Support for up to 16GB DDR3 DIMMs
– 1TB with 16GB DIMMS
 Memory types supported:
– 1066MHz DDR3
– Registered (RDIMM)
– Single-rank (SR), dual-rank (DR), quad-rank (QR)
 Actual system memory speed depends on specific processor capabilities. (see NHM-EX
SKU stack for max SMI link speeds per SKU):
– 6.4GT/s SMI link speed capable of running memory speeds up to 1066Mhz
– 5.86GT/s SMI link speed capable of running memory speeds up to 978Mhz**
– 4.8GT/s SMI link speed capable of running memory speeds up to 800Mhz
RDI
MM
RDI
MM
RDI
MM
RDI
MM
SMB
XeonXeon
7500/65007500/6500
4 SMI 2 DDR3
Up to 16 DIIMS
^SMI^SMI/SMB = Intel Scalable Memory Interconnect / Scalable Memory Buffer
^SMI^SMI/SMB = Intel Scalable Memory Interconnect / Scalable Memory Buffer
** Memory speed sett by UEFI ; All channels in a system will run at the fastest common frequency
8

x3850 X5 system specifics

x3850 X5 – Chipset Basics
Intel
Xeon
Intel
Xeon
Intel
Xeon
Intel
Xeon
MB1MB
1
MB
1
MB1
MB1MB1 MB1MB1
Intel
Xeon
Intel
Xeon
MB1MB
1
MB
1
MB1
MB1MB1MB1MB1
Intel
Xeon
Intel
Xeon
Intel
BoxboroPCI-E
Intel
Boxboro PCI-E
DDR3 Memory DIMMs
Memory Buffer
SMI Link to CPU
Memory Card
MB1 MB2
1 3 8 6
2 4 7 5
Memory Controller
(1 of 2 per CPU)
CPU’s connect via
QPI bus 6.4 GT/s max
Quick Path Interconnect

x3850 X5 – Block Diagram
Intel Xeon Rack , Westmere EX drop in design, 4 CPUs, 64 DDR3, 7 PCIE, 8 HDD, QPI Cable to 8-socket
6.4GT/s
SMI (FBD2)
16 buses
Each @ 6.4GT/s
(2B Rd/1B Wr)
Cable
or Wrap
Xeon
CPU4
QPI
64 DDR3 DIMMs
32 buses @ 1066M
2 DIMMs per bus
QPI
Xeon
CPU1
Xeon
CPU2
x8
x8
x8
Slot 6
QPI
QPI
Xeon
CPU3
QPIQPI
Slot 1x16
x4
x8
x8
Slot 2
SAS
Slot 3
PC3-10600R LP DIMMs
1GB, x8, 1R, 1Gb
2GB, x8, 2R, 1Gb
4GB, x8, 4R, 1Gb
8GB, x8, 4R, 2Gb
16GB, x4, 4R, 2Gb
Xeon
8-core
2.27 GHz
IBM CONFIDENTIAL
Boxboro1
ESI x4
ICH10
Southbridge USB
LPC
DVD
5709 EN
ESI x4
x8
Slot 7
Slot 5
x4 + x4
Dual Gb
0
2
0
3
3
1
3
0
3
2
2
2
0
1
x4
Slot 4
1
0
1
0
1
1
Boxboro2
Memory Card 1
PROWL I/O and Power card
PCIe SAS connector
on CPU card
MB1 MB2
1 3
2 4
8 6
7 50 01 1
1
2
Memory Card 3
MB1 MB2
1 3
2 4
8 6
7 50 01 1
2
1
Memory Card 4
MB1 MB2
2 4
1 3
7 5
8 6
0 01 1
3
4
Memory Card 7
MB1 MB2
1 3
2 4
8 6
7 50 01 1
2
1
Memory Card 8
MB1 MB2
2 4
1 3
7 5
8 6
0 01 1
3
4
Memory Card 2
MB1 MB2
2 4
1 3
7 5
8 6
0 01 1
4
3
Memory Card 5
MB1 MB2
1 3
2 4
8 6
7 50 01 1
1
2
Memory Card 6
MB1 MB2
2 4
1 3
7 5
8 6
0 01 1
4
3
STARSCREAM CPU Card
iBMC, TPM
4 Back, 2 Front
8 Memory Cards
Cable
or Wrap 2 Int, 2 iBMC
SATA
PCIe Slots 1-4 Full Length
Slot 2 has x8 connector
PCIe Slots 5-7 Half Length
Dual 10Gb

x3850/x3950 X5 - 4 Socket 4U EX platform
6 Fans
2x – 1975 W P/S
4U Rack Mechanical Chassis
Front view
(2x) 1975W Rear Access Hot
Swap, Redundant P/S
(4x) Intel Xeon EX CPU’s
(8x) Memory Cards –
8 1066MHxDDR3 DIMMs per card
7x - PCIe Gen2 Slots
2x 60mm Hot Swap Fans
(8x) Gen2 2.5” Drives
(2x) 120mm Hot Swap Fans
Dual USB
DVD Drive
Light Path
Diagnostics
RAID Card

x3850 X5 rear view
QPI cables
Swap, Redundant P/S
w/120mm fan
(4x) PCIe full length
(3x) PCIe half length x8
Emulex 10Gb Ethernet
Dual Backplane –
SAS & SSD

x3850 X5 front view
Swap, Redundant P/S
(4x) Intel Xeon EX CPU’s
(8x) Memory Cards –
8 1066MHxDDR3 DIMMs per card
7x - PCIe Gen2 Slots
2x 60mm Hot Swap Fans
(8x) Gen2 2.5” Drives
(2x) 120mm
Hot Swap Fans
Dual USB Light Path Diagnostics
RAID Card
DVD Drive
10Gb Ethernet Adapter

System Images - Interior
PS1
PS2
Boxborro 2
Boxborro1
M5015 RAID
HS Fan Pack
PCIe x16
PCIe x4
PCIe x8
PCIe x8
PCIe x8
PCIe x8
PCIe x8
USB
System
Recovery
Jumpers
CPU1
CPU2
CPU3
CPU4Slot 7
Slot 6
Slot 5
Slot 4
Slot 3
Slot 2
Slot 1
Mem Card 1
Mem Card 2
Mem Card 3
Mem Card 4
Mem Card 5
Mem Card 6
Mem Card 7
Mem Card 8
SAS Backplanes + HDD Cage

New x3850 X5 memory card
Specifications :
64 DDR3 DIMMs
32 buses @ 1066M
2 DIMMs per bus
SMI - 16 buses
Each @ 6.4GT/s
(2B Rd/1B Wr)
PC3-10600R LP DIMMs
1GB, x8, 1R, 1Gb
2GB, x8, 2R, 1Gb
4GB, x8, 4R, 1Gb
8GB, x8, 4R, 2Gb
16GB, x4, 4R, 2Gb

17
IBM Confidential
NDA DISCLOSURE ONLY
System Images – Chassis View
Front Access 120mm fans
Rear I/O Shutttle
Rear Access HS PSUs
- lift up on handle then pull out
QPI Scalability Ports / Cables

18
IBM Confidential
NDA DISCLOSURE ONLY
System Images – CPU and Memory
Memory Cards
CPU and Heatsink installation

19
IBM Confidential
NDA DISCLOSURE ONLY
System Images - Options
M1015 RAID card and
Installation bracket
8 HDD SAS Backplane

20
IBM Confidential
NDA DISCLOSURE ONLY 20
CPU
MC2
MC1
Memory Buffer 2
Memory Buffer 2
Memory Buffer 1
Memory Buffer 1
DIMM 2
DIMM 1
DIMM 4
DIMM 3
DIMM 7 DIMM 5
DIMM 8 DIMM 6
DIMM 6DIMM 8
DIMM 7
DIMM 1 DIMM 3
DIMM 2 DIMM 4
DIMM 5
Memory Card 1
Memory Card 2
SMI Lane 1
SMI Lane 4
SMI Lane 2
SMI Lane 3
Channel 0
Channel 0
Channel 0
Channel 0 Channel 1
Channel 1
Channel 1
Channel 1
x3850 X5 DIMM Population Rules
General Memory Population Rules
• DIMM’s must be installed in matching
pairs
• Each memory card requires at least 2
DIMM’s
Memory Population Best Practices
• Populate 1 DIMM / Memory Buffer on
each SMI lane 1st
• Populate 1 DIMM / Memory Buffer
across all cards before moving to
populate the next channel on the
Memory Buffer
• Populate DIMMs furthest away from
Memory Buffer 1st
(ie – 1, 8, 3, 6) before
populating 2nd
DIMM in channel
• Memory DIMMs should be plugged in
order of DIMM size
• Plug largest DIMMs first, followed by
next largest size
• Each CPU & memory card should have
identical amounts of RAM
Optimally expandable memory config is 2 memory cards / CPU, 4 DIMMs / memory card, equal amounts of memory / card
20

21
IBM Confidential
NDA DISCLOSURE ONLY 21
Card # PCIe Slot #
1 1
2 5
3 3
4 6
5 4
6 7
7 2
x3850 X5 PCIe Slot Population
Plug one PCIe card / Boxboro before moving to next set of slots
21

22
IBM Confidential
NDA DISCLOSURE ONLY
x3850X5 Supported Internal ServRAID adapters
22
ServRAID M1015
Features and Functions
• Two x4 internal SAS / SATA
ports
• RAID Levels 0, 1, 10
• LSI SAS2008 RAID on Chip
(ROC)
• Low-profile PCIe ½ Length
card
• X8 PCIe Gen 2 host interface
ServRAID M5015
Features and Functions
• Two x4 internal SAS / SATA ports
• X8 PCI e Gen 2 host interface
• RAID Levels 0, 1, 5, 10, 50 (6, 60
Optional)
• 800MHz 72-bit ECC DDR2 SDRAM
Memory (512 MB)
• LSI SAS2108 6Gb/s RAID on Chip
• Low-profile PCIe ½ Length card
• Encryption Services
• Instant Secure Erase
• Local Key Management
• MegaRAID Management Suite
• MegaRAID Storage Manager
• MegaCLI (command-line
interface)
• WebBIOS
• Intelligent Battery Backup Unit
Multiple RAID Adapters to meet Multiple Performance Requirements
22
Bertram:
optional for x3850 X5, std on
x3690

23
IBM Confidential
NDA DISCLOSURE ONLY
Emulex 10Gb Ethernet adapters for eX5
 Superior 10Gb/s performance
– Dual-channel, 10Gb/s Ethernet Link speed
– 3.6m packets per second (pps), full line rate
– TCIP/IP stateless offloads
– TCP Chimney Offload
 Energy efficient design
– Industry-leading performance per watt
– Complements data center “green” initiatives
 One platform for network and storage connection
– Future-proof option to purchase an entitlement to enable
storage support (i.e. change personality)*
– Simplifies I/O hardware choices for IT managers
•Lower Capital Expense (CapEx)
•Lower Operational Expense (OpEx)
 Two Options
– Integrated for low cost, ordering ease
– Option for expandability, flexibility
Extended Edge
Connector
Integrated
Option

24
IBM Confidential
NDA DISCLOSURE ONLY
 Rebranded Emulex CNA keyed for
Slot 7 only
 Initial support for 10Gb Ethernet
 Shipped with Copper Connectors,
SFP+ Optics are Optional
 Interoperability with mutliple
vendors switches
– Upcoming BNT 10Gb ToR VFA Switch
for vNIC/NIC and FCoE functions
– Cisco N5K, Brocade 10GbE switches
for NIC/FCoE
 Integration into IBM UEFI menus
IBM x3850X5 Integrated 10Gb NIC
Extended Edge Connector
24

25
x3850 X5 – Hardware; Speeds and Feeds
Processors
 4 Socket Intel Xeon 7500 series
 (4) QPI Ports/Processor
 (4) SMI Ports/Processor
Memory
 (8) Memory Cards, 2 per CPU
 (16) Intel Memory Buffers total
• SMI Connected
 DDR3 DIMMs
 (64) Total DIMM Slots
 1066 MHz DDR3 speed
• Processor QPI Speed Dependant
 2, 4, 8 and 16GB Support
• Installed In Matched Pairs
 Memory Sparing and Mirroring Support
• Installed in Matched Quads
Chipset
 (2) Intel Boxboro IOH (QPI-to-PCIe Bridge)
• (36) PCIe Gen2 Lanes
• (2) QPI Ports
• (4) ESI Lanes To ICH10
 Intel ICH10 Southbridge
• (8) USB 2.0 Ports
• 3Gb/s SATA DVD Connection
Networking
 Broadcom BCM5709C
• Dual 1Gb connection
• x4 PCIe Gen2 Connection
 Emulex 10Gb dual port custom
• IBM Specific Adapter Option
• Installs in PCIe Slot 7, x8 PCIe Gen2
• V-NIC Capable
PCIe Slots
 Slot 1 PCIE Gen2 x16 Full Length
 Slot 2 PCIE Gen2 x4 Full Length (x8 mech)
 Slot 5 PCIE Gen2 x8 Half Length
 Slot 6 PCIE Gen2 x8 Half Length
 Slot 7 PCIE Gen2 x8 Half Length (10GbE)
All slots 5Gb/s, full height

26
x3850 X5 – Hardware; Speeds and Feeds Cont.
2.5” Storage
Up To (8) 2.5” HDD Bays
• Support For SAS / SATA and SSD
 SAS Drives
• 146GB / 10K / 6Gbps
• 300GB / 10K / 6Gbps
• 73GB / 15K / 6Gbps
• 146GB / 15K / 6Gbps
 SATA Drive
• 500GB / 7200rpm
 SSD Drive
• 50GB
 Configured with one or two 4-Drive backplanes
UEFI BIOS
 Next-generation replacement for BIOS-based firmware which
provides a richer management experience
 Removes limit on number of adapter cards—important in
virtualized environments
 Ability to remotely configure machines completely via command
scripts with Advance Settings Utility
IMM
 Common IMM Across Rack Portfolio
• x3550M2
• x3650M2
• x3750 X5
• x3850 X5
• x3950 X5
 300MHz, 32-bit MIPS Processor
 Matrox G200 Video Core
 128MB Dedicated DDR2 Memory
 Avocent Based Digital Video Compression
 Dedicated 10/100Mb Ethernet
 9-Pin Serial Port
 128-bit AES Hardware Encryption Engine
 IPMI v2.0
 Fan Speed Control
 Serial Over LAN
 Active Energy Manager/xSEC
 LightPath

x3850 X5 configuration flexibility
Base System
Shipping today
Memory Expansion
with MAX5
via QPI
Shipping today
Native Scaling
via QPI
Shipping today
Memory Expansion
and Scaling with MAX5
via QPI and EXA
Available 2011

Xeon 8-socket interconnect block diagram
QPI
Cable Links for QPI bus
Four QPI cables
1
24
3 3
42
1QPI
3
0
3
02 2
00
2 2 2 2
2002
3 3
3 3
1
3 3
1
Cable cross connects CPUs 2 and 3

x3850 X5 with native QPI scaling
Intel
Xeon
Intel
Xeon
Intel
Xeon
Intel
Xeon
MB1MB
1
MB
1
MB1
MB
1
MB1 MB1MB1
Intel
Xeon
Intel
Xeon
MB1MB
1
MB
1
MB1
MB1MB1MB1MB1
Intel
Xeon
Intel
Xeon
Intel
BoxboroPCI-E
Intel
Boxboro PCI-E
Intel
Xeon
Intel
Xeon
Intel
Xeon
Intel
Xeon
MB1MB
1
MB
1
MB1
MB
1
MB1 MB1MB1
Intel
Xeon
Intel
Xeon
MB1 MB
1
MB
1
MB1
MB1MB1MB1MB1
Intel
Xeon
Intel
Xeon
Intel
Boxboro
PCI-E Intel
Boxboro
PCI-E
Connects directly via
QPI bus
QPI Cables

x3850 8-socket QPI scaling
A DB C
REAR VIEW OF CHASSIS
QPI 1-2 QPI 3-4
x3850 #1
QPI 1-2 QPI 3-4
x3850 #2

x3850 X5 with MAX5 using QPI
Intel
Xeon
Intel
Xeon
Intel
Xeon
Intel
Xeon
MB1MB
1
MB
1
MB1
MB1MB1 MB1MB1
Intel
Xeon
Intel
Xeon
MB1MB
1
MB
1
MB1
MB1MB1MB1MB1
Intel
Xeon
Intel
Xeon
Intel
BoxboroPCI-E
Intel
Boxboro PCI-E
MAX5
MAX5
MB1MB
1
MB
1
MB1 MB1MB
1
MB
1
MB1
Connects directly to
each CPU via QPI bus
6.4 GT/s
MB1 MB2
1 3 8 6
2 4 7 5
DDR3 Memory DIMMs
Memory Buffer
SMI Link to Firehawk
EXA port

x3850 X5 to MAX5 QPI cabling
eX5 Memory Drawer End x3850 X5 End

8-socket x3850 X5 with MAX5 using QPI and EXA
Connects directly
to each CPU via
QPI bus 6.4 GT/s
Connects via EXA

MAX5 1U Rack Mechanical Chassis Top view
Memory Buffers
Redundant
650W Power
Supplies
QPI Link Ports EXA Scalability
Ports
Firehawk Chipset
32 Memory Dimms
Lightpath
Diagnostics
 QPI attaches to systems
 EXA Scalability to other memory drawers
Easy front access

MAX5 front and rear views

MAX5 for System x front and rear views
Redundant 675W Power Supplies
Lightpath
Diagnostics
QPI PortsEXA Ports
Hot swap fans
Front
Rear
System removes
from chassis for
easy access

MAX5 for System x top view
Memory Buffers
QPI Ports
EXA Ports
Firehawk Chipset
32 Memory Dimms
 QPI attaches to systems
 EXA Scalability to other memory drawers

38
MAX5 – Hardware; Speeds and Feeds
Processors
 None!
Memory
 (32) Total DIMM Slots
 DDR3 DIMMs
(8) Intel Memory Buffers total
• SMI Connected
1066MHz DDR3 Speed
• Processor QPI Speed Dependant
 1, 2, 4, 8 and 16GB Support
• Installed In Matched Pairs
 Memory Sparing and Mirroring Support
• Installed in Matched Quads
Chipset
 IBM Firehawk
• (8) SMI Lanes
• (4) QPI Ports
• (3) Scalability Ports
Usability
 Power sequences from host platform
 Memory configuration from host platform
 Multi-node configuration from host platform
 Lightpath enabled
 DSA supported

39
X6550
2Ghz / 18M / 6.4GT/s
E6540
2Ghz / 18M / 6.4GT/s
X7560
2.26Ghz / 24M / 6.4GT/s
X7550
2Ghz / 18M / 6.4GT/s
8S/Scalable 4S/Scalable
L7555
1.86Ghz / 24M / 5.86GT/s
E7530
1.86Ghz / 12M / 5.8GT/s
E7520
1.86Ghz / 18M / x4.8GT/s
X7542
2.66Ghz / 18M / 5.86GT/s
EX High Perf. LV
L7545
1.86Ghz / 18M / 5.86GT/s
E7540
2Ghz / 18M / 6.4GT/s
Turbo: 0/1/3/5
Turbo: 1/2/4/5
StandardBasic
6-8 Cores 95W
HT / Turbo / S8S
6 Cores 130W
Turbo / S8S
No Hyper-Threading
8 Cores
Hyper-Threading
Turbo: 1/2/3/3
130W
6 Cores
Hyper-Threading
Turbo: 0/1/1/2
105W
4 Cores
Hyper-Threading
95W-105W
95W
8C
6C
HPC
Turbo: 0/1/1/1
E6510
1.73Ghz / 12M / 4.8GT/s
2S Only. Not Scalable2S Only. Not Scalable
105W
2S/Scalable
x3850 X5 / x3950 X5 – supported processors
Advanced

System Population Guidelines
Processors
 Base Systems contain 2 CPU
 8-socket QPI scaling is supported with 4+4 CPU, all matching
Memory
 Each CPU needs at least one memory card
 Each memory card needs at least 2 DIMMs
 DIMMs must be installed in matching pairs
 Optimal memory performance requires 2 memory cards per CPU, with 4 DIMMs on
each memory card, equal amounts of memory per card.
 If memory mirrored, then DIMM’s must match in sets of 4
 MAX5 memory expansion works best with DIMMs in sets of 4
 MAX5 memory expansion works best with a ratio of 2/1 memory in host/expander
Drives
 Base systems contain backplane for 4 drives
 Maximum of 8 SFF SAS drives
I/O Adapters
 Alternate adapter population between IOH chipset devices; alternate between slots
(1-4) and (5-7)

4141
Trademarks
Trademarks
The following are trademarks of the International Business Machines Corporation in the United States and/or other countries. For a complete list of IBM Trademarks, see
www.ibm.com/legal/copytrade.shtml: AS/400, DBE, e-business logo, ESCO, eServer, FICON, IBM, IBM Logo, iSeries, MVS, OS/390, pSeries, RS/6000, S/30, VM/ESA, VSE/ESA,
WebSphere, xSeries, z/OS, zSeries, z/VM
The following are trademarks or registered trademarks of other companies
Lotus, Notes, and Domino are trademarks or registered trademarks of Lotus Development Corporation
Java and all Java-related trademarks and logos are trademarks of Sun Microsystems, Inc., in the United States and other countries
LINUX is a registered trademark of Linux Torvalds
UNIX is a registered trademark of The Open Group in the United States and other countries.
Microsoft, Windows and Windows NT are registered trademarks of Microsoft Corporation.
SET and Secure Electronic Transaction are trademarks owned by SET Secure Electronic Transaction LLC.
Intel is a registered trademark of Intel Corporation
* All other products may be trademarks or registered trademarks of their respective companies.
NOTES:
Performance is in Internal Throughput Rate (ITR) ratio based on measurements and projections using standard IBM benchmarks in a controlled environment. The actual throughput that
any user will experience will vary depending upon considerations such as the amount of multiprogramming in the user's job stream, the I/O configuration, the storage configuration, and the
workload processed. Therefore, no assurance can be given that an individual user will achieve throughput improvements equivalent to the performance ratios stated here.
IBM hardware products are manufactured from new parts, or new and serviceable used parts. Regardless, our warranty terms apply.
All customer examples cited or described in this presentation are presented as illustrations of the manner in which some customers have used IBM products and the results they may have
achieved. Actual environmental costs and performance characteristics will vary depending on individual customer configurations and conditions.
This publication was produced in the United States. IBM may not offer the products, services or features discussed in this document in other countries, and the information may be subject
to change without notice. Consult your local IBM business contact for information on the product or services available in your area.
All statements regarding IBM's future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only.
Information about non-IBM products is obtained from the manufacturers of those products or their published announcements. IBM has not tested those products and cannot confirm the
performance, compatibility, or any other claims related to non-IBM products. Questions on the capabilities of non-IBM products should be addressed to the suppliers of those products.
Prices subject to change without notice. Contact your IBM representative or Business Partner for the most current pricing in your geography.
References in this document to IBM products or services do not imply that IBM intends to make them available in every country.
Any proposed use of claims in this presentation outside of the United States must be reviewed by local IBM country counsel prior to such use.
The information could include technical inaccuracies or typographical errors. Changes are periodically made to the information herein; these changes will be incorporated in new editions of
the publication. IBM may make improvements and/or changes in the product(s) and/or the program(s) described in this publication at any time without notice.
Any references in this information to non-IBM Web sites are provided for convenience only and do not in any manner serve as an endorsement of those Web sites. The materials at those
Web sites are not part of the materials for this IBM product and use of those Web sites is at your own risk.

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