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Laser Beam Machining

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This slide contains the working process of Laser, their types and how they are used for machining purposes.

Publié dans : Ingénierie
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Laser Beam Machining

  1. 1. LASER BEAM MACHINING SAHIL DEV (10406EN016) MECH IDD PART V 1
  2. 2. Contents  Laser Beam Machining  Laser  Type of Laser  Laser Application  Parameters Affecting LBM  Advantage  Disadvantage  References 2
  3. 3. What is Laser  LASER is the acronym for Light Amplified Stimulated Emission of Radiation  Laser is a device which generates or amplifies light  Stimulated emission of electromagnetic radiation  Coherent, monochromatic, directional and high power laser beam is used 3
  4. 4. Elements of Laser  Lasing Medium (Gas, liquid, solid)  Pumping process  Optical feedback element 4
  5. 5. Laser Beam Machining  Used light energy from a laser to remove material by vaporization and ablation  Energy is concentrated optically  Laser emits either continuous or pulsed light beam 5 Source: Google Images
  6. 6. Effect of Laser Beam on Material 6 Source: Internet
  7. 7. Gas Laser Types of Laser Solid State Laser Excimer Laser 7
  8. 8. Gas Laser  Electric current is discharged through a gas to produce a coherent light  Operate on the principle of converting electric energy into laser light output  Gas acts as pumping medium to attain the necessary population inversion  Common gas laser are CO2 Gas Laser, He-Ne Gas Laser 8
  9. 9. He-Ne Gas Laser 9 Source: Google Images
  10. 10. Solid State Laser  Constructed by doping a rare earth element into a variety of host materials  Pumped optically by arc lamps or flash lamps  Respond well to Q-switching  Ruby or Nd:YAG is the most common host material 10
  11. 11. Ruby Laser 11 Source: HowStuffWorks
  12. 12. Excimer Laser  Uses a combination of an inert gas and reactive gas  Excimer is form of Ultraviolet Chemical Laser  Excimer is short for ‘excited dimer’ 12 Source: Google Images
  13. 13. Dye & Semiconductor Laser  Dye Laser  use complex organic dyes, such as rhodamine 6G  Semiconductor Laser  sometimes called diode lasers  very small and use low power. 13
  14. 14. Operation: Laser Cutting  Cutting starts by drilling a hole by moving beam  Cutting speed depends on material and thickness  Both pulsed and continuous laser is used  Thickness ranges from 0.5-1 inch  Used for cutting complex geometry and for clean cutting operation 14 Source: sciencedirect.com
  15. 15. Laser Welding  For welding ceramics and dissimilar materials like steel and aluminum  Produces maximum penetration and minimum distortion in materials  Beam can be easily shaped, focused and directed  Application  Razor Blade  Electronic Circuit 15
  16. 16. Laser Cladding  Used to improve surface quality by applying a corrosion resistant layer on product  Laser Beam is used to create a shallow melt pool  Metal powder is supply using an inert gas flow  Application  Chemical industry  Mining and marine application 16 Source: Wikipedia
  17. 17. Laser Application Heavy Manufacturing Seam & spot welding Cladding & drilling Light Manufacturing Engraving Drilling Electronics Skiving of circuits Wire stripping Medical Cosmetic Surgery Hair removal 17
  18. 18. Parameter Affecting LBM• Working Material • Assist Gases • Focusing Lenses • Laser Beam • Environment Laser Beam Machining 18
  19. 19. Advantages  Non Contact  No solvent chemical  Selective material removal  Flexibility  Fully automated 19
  20. 20. Disadvantages  Requires specially trained operators  Not for mass metal removal processes  Requires greater control of joint tolerances  Expensive equipment  Consumes much energy 20
  21. 21. References  http://www.google.com  http://www.sciencedirect.com  http://en.wikipedia.org/wiki/laser_cutting  http://www.gobookee.org/powerpoint-of-laser-beam-machining/  Laser beam machining (LBM), state of the art and new opportunities/Johan Meijer  http://science.howstuffworks.com/laser.htm 21
  22. 22. THANK YOU 22

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