KEY FEATURES OF THE REPORT
The report provides essential patent data for FD-SOI including:
• Time evolution of patent publications and countries of patent filings.
• Current legal status of patents.
• Ranking of main patent applicants.
• Joint developments and IP collaboration network of main patent applicants.
• Segmentation by architecture (planar FD-SOI, SOI FinFET) and process level (transistor, device, circuit).
• Key patents.
• Granted patents near expiration.
• Relative strength of main companies IP portfolio.
• Matrix applicants / technology segments.
• FD-SOI IP profiles of major companies with key patents, patented technologies, partnerships, and IP strength and strategy.
The report also provides an extensive Excel database with all patents analyzed in the study.
OBJECTIVE OF THE REPORT
• Provide an overview of FD-SOI technology.
• Review context for FD-SOI technology.
• Understand the patent landscape for FD-SOI.
• Identify key patents of FD-SOI technology.
• Understand trends in FD-SOI IP.
• Identify the major players in FD-SOI IP and the relative strength of their patent portfolio.
• Identify new players in FD-SOI IP.
• Identify IP collaboration networks between key players.
Nanowire LED Patent Investigation
New nanowire LED startups compete with Asian LED giants in the IP landscape
KEY FEATURES OF THE REPORT
- Nanowire LED IP landscape
- Focus on key technology issues: deposition method, substrate type, active material type, PN junction type, passive material type
- Main patent applicants' IP collaboration network
- IP collaboration network of main patent applicants
- Matrix patent applicants/technology segments
- Relative strength of main key players' IP
- Key patents and current patents nearing expiration
- "Nanowire LED IP" profiles of six key players incl. their patenting activity, key patents, patented technologies, partnerships, and patents nearing expiration
- Excel database with all patents analyzed incl. technology segmentation
- LED market and industry trends: data and forecasts
- Nanowire LED – Pure-players and their roadmap
This document provides an analysis of Honeywell's microbolometer patent portfolio. It includes information on the technology overview, market forecast, intellectual property overview including statistics on patent publications, granted patents and applications by country and over time, main technical issues addressed, inventors, most cited patent families, and competitive intellectual property landscape. The analysis also discusses Honeywell's key patents, strengths and weaknesses, and provides conclusions on Honeywell's leadership position in microbolometer technology.
To this date, fingerprint sensing technology is the most reliable and widespread biometric technology and fingerprint sensors are well developed. This patent landscape focuses on fingerprint sensors using capacitive sensing technology. The domain of capacitive fingerprint sensors is closely linked to the development of electronic devices, especially smartphones and the like, and the growing demand for security. Capacitive fingerprint sensors of a new generation have been incorporated in the most recent smartphones of companies like Apple or Samsung. The capacitive fingerprint sensing technologies involve more than 100 different applicants, mainly semiconductor and electronics companies. The main IP holders in the domain are Seiko Epson, AuthenTec, Sony and STMicroelectronics. The pioneer patents on capacitive fingerprint sensing technology are no longer in force and more than 200 granted patents are expected to expire by 2020. However, the number of new patent publications is increasing again since 2012, underlying a new enthusiasm for capacitive fingerprint sensors.
KEY FEATURES OF THE REPORT
The report provides essential patent data for fingerprint sensors of the capacitive type including:
- Time evolution of patent publications and countries of patent filings.
- Current legal status of patents.
-Ranking of main patent applicants.
- Joint developments and IP collaboration network of main patent applicants.
- Key patents.
- Granted patents near expiration.
- Relative strength of main companies IP portfolio.
- Overview of patent litigations
- Capacitive fingerprint sensor IP profiles of 15+ major companies with key patents, partnerships, and IP strength and strategy.
- The report also provides an extensive Excel database with all patents analyzed in the study.
OBJECTIVE OF THE REPORT
- Understand the IP landscape for capacitive fingerprint sensors.
- Identify key patents.
- Understand trends in capacitive fingerprint sensors IP.
- Identify the major players in capacitive fingerprint sensors IP and the relative strength of their patent portfolio.
- Identify new players in capacitive fingerprint sensors IP.
- Identify IP collaboration networks between key players.
- Identify main patent litigations.
The report provides essential patent data for ReRAM and Memristor including:
• Time evolution of patent publications and countries of patent filings.
• Ranking of main patent applicants.
• Joint developments and IP collaboration network of main patent applicants.
• Key patents.
• Granted patents near expiration.
• Relative strength of main companies IP portfolio.
• Matrix applicants/patented technology for more than 15 companies.
• The “Resistive Memory IP” profiles of 15+ major companies is presented, with key patents, recent patents, technological issues, partnerships and last market news.
The report also provides an extensive Excel database with all patents analyzed in the study.
Status and Prospects for the Advanced Packaging Industry in China - 2016 Repo...Yole Developpement
This report analyzes the advanced packaging industry in China. It finds that the advanced packaging market in China is expected to grow at a CAGR of 16% to reach $4.6 billion by 2020, driven by long-term growth in the China IC industry and aggressive M&As. Total wafer bumping capacity in China is forecasted to reach 8 million 12-inch wafers per year by 2020, with Cu pillar bumping capacity growing at a CAGR of 19.7% as key Chinese OSATs ramp up 12-inch Cu pillar production. The report also examines the equipment infrastructure, materials market, and role of the Chinese government and investment funds in supporting the development of the local advanced packaging supply
Next generation power modules - patent landscape 2021- flyerKnowmade
The advent of EV/HEV technology has acted as a catalyst for innovation, leading to an acceleration in applications for power module related patents since 2010. Who are the main IP players? How do they address the new challenges? Who are the new players and IP challengers taking the big opportunities arising from the emerging EV/HEV market?
Nanowire LED Patent Investigation
New nanowire LED startups compete with Asian LED giants in the IP landscape
KEY FEATURES OF THE REPORT
- Nanowire LED IP landscape
- Focus on key technology issues: deposition method, substrate type, active material type, PN junction type, passive material type
- Main patent applicants' IP collaboration network
- IP collaboration network of main patent applicants
- Matrix patent applicants/technology segments
- Relative strength of main key players' IP
- Key patents and current patents nearing expiration
- "Nanowire LED IP" profiles of six key players incl. their patenting activity, key patents, patented technologies, partnerships, and patents nearing expiration
- Excel database with all patents analyzed incl. technology segmentation
- LED market and industry trends: data and forecasts
- Nanowire LED – Pure-players and their roadmap
This document provides an analysis of Honeywell's microbolometer patent portfolio. It includes information on the technology overview, market forecast, intellectual property overview including statistics on patent publications, granted patents and applications by country and over time, main technical issues addressed, inventors, most cited patent families, and competitive intellectual property landscape. The analysis also discusses Honeywell's key patents, strengths and weaknesses, and provides conclusions on Honeywell's leadership position in microbolometer technology.
To this date, fingerprint sensing technology is the most reliable and widespread biometric technology and fingerprint sensors are well developed. This patent landscape focuses on fingerprint sensors using capacitive sensing technology. The domain of capacitive fingerprint sensors is closely linked to the development of electronic devices, especially smartphones and the like, and the growing demand for security. Capacitive fingerprint sensors of a new generation have been incorporated in the most recent smartphones of companies like Apple or Samsung. The capacitive fingerprint sensing technologies involve more than 100 different applicants, mainly semiconductor and electronics companies. The main IP holders in the domain are Seiko Epson, AuthenTec, Sony and STMicroelectronics. The pioneer patents on capacitive fingerprint sensing technology are no longer in force and more than 200 granted patents are expected to expire by 2020. However, the number of new patent publications is increasing again since 2012, underlying a new enthusiasm for capacitive fingerprint sensors.
KEY FEATURES OF THE REPORT
The report provides essential patent data for fingerprint sensors of the capacitive type including:
- Time evolution of patent publications and countries of patent filings.
- Current legal status of patents.
-Ranking of main patent applicants.
- Joint developments and IP collaboration network of main patent applicants.
- Key patents.
- Granted patents near expiration.
- Relative strength of main companies IP portfolio.
- Overview of patent litigations
- Capacitive fingerprint sensor IP profiles of 15+ major companies with key patents, partnerships, and IP strength and strategy.
- The report also provides an extensive Excel database with all patents analyzed in the study.
OBJECTIVE OF THE REPORT
- Understand the IP landscape for capacitive fingerprint sensors.
- Identify key patents.
- Understand trends in capacitive fingerprint sensors IP.
- Identify the major players in capacitive fingerprint sensors IP and the relative strength of their patent portfolio.
- Identify new players in capacitive fingerprint sensors IP.
- Identify IP collaboration networks between key players.
- Identify main patent litigations.
The report provides essential patent data for ReRAM and Memristor including:
• Time evolution of patent publications and countries of patent filings.
• Ranking of main patent applicants.
• Joint developments and IP collaboration network of main patent applicants.
• Key patents.
• Granted patents near expiration.
• Relative strength of main companies IP portfolio.
• Matrix applicants/patented technology for more than 15 companies.
• The “Resistive Memory IP” profiles of 15+ major companies is presented, with key patents, recent patents, technological issues, partnerships and last market news.
The report also provides an extensive Excel database with all patents analyzed in the study.
Status and Prospects for the Advanced Packaging Industry in China - 2016 Repo...Yole Developpement
This report analyzes the advanced packaging industry in China. It finds that the advanced packaging market in China is expected to grow at a CAGR of 16% to reach $4.6 billion by 2020, driven by long-term growth in the China IC industry and aggressive M&As. Total wafer bumping capacity in China is forecasted to reach 8 million 12-inch wafers per year by 2020, with Cu pillar bumping capacity growing at a CAGR of 19.7% as key Chinese OSATs ramp up 12-inch Cu pillar production. The report also examines the equipment infrastructure, materials market, and role of the Chinese government and investment funds in supporting the development of the local advanced packaging supply
Next generation power modules - patent landscape 2021- flyerKnowmade
The advent of EV/HEV technology has acted as a catalyst for innovation, leading to an acceleration in applications for power module related patents since 2010. Who are the main IP players? How do they address the new challenges? Who are the new players and IP challengers taking the big opportunities arising from the emerging EV/HEV market?
Report’s Key Features
• PDF with > 80 slides
• Excel file > 1,000 patents
• IP trends, including time-evolution of published patents, countries of patent filings, etc.
• Ranking of main patent assignees
• Key players’ IP position and relative strength of their patent portfolios
• Patent segmentation per application:
– CMOS image sensor (CIS)
– Memory
– MEMS
– LED
• Key patent identification and details
• IP profile of key players: Xperi, TSMC, YMTC
• Excel database containing all patents analyzed in the report, including technology and application segmentations
The document provides an overview of the technology landscape and patent analysis for organic photodiodes applicable to sensors and detectors. It introduces the objective of analyzing the technology segmentation, trends, key players, and illustrative patents. The summary identifies that most patenting activity is in the US, with applications in optical sensing, imaging, radiation detection, and other areas. Patent filings increased until 2013, with over 70 key players identified.
KEY FEATURES OF THE REPORT
• IP trends including time evolutions and countries of patent filings
• Current legal status of patents
• Ranking of main patent applicants
• Joint developments and IP collaboration network of main patent applicants
• Key patents and granted patents near expiration
• Relative strength of main companies’ IP portfolios
• Matrix showing patent applicants and their patented technologies
• Segmentation of patents by
- Technology (primary and secondary batteries w/o lithium)
- Design (micro-batteries, solid thin film, flexible, 3D …)
- Components/materials (anode, cathode, electrolyte, barrier layer ...)
- Manufacturing method (CVD, ALD, PVD, sputtering, electrodeposition …)
- Claimed invention (method, product, apparatus)
• Microbattery IP profiles of 10 major companies, with key patents, technological issues, partnerships, IP strength, IP strategy and latest market news
• Excel database with all patents analyzed in the report (3000+ patents), including technology segmentation
Report’s Key Features
• PDF with > 230 slides
• Excel file > 3,000 patent families
• Main IP dynamics and key trends.
• IP leaders, most active players and newcomers.
• IP portfolio strength of key players, and their technology/application focus.
• Time evolution of patents filings by company, countries, and technology.
• IP collaborations and IP transfers between key organizations.
• Insights into the status of RF GaN patented technologies, identifying trends for each technology and application.
• Extensive Excel database of over 3,000 patent families with all patent information and technology segmentation.
Fan-Out and Embedded Die: Technologies & Market Trends 2015 Report by Yole De...Yole Developpement
Fan-Out and Embedded Die: Two promising Wafer/Panel-Level-Packaging technologies. What are the next steps for the growth?
Fan-Out Wafer Level Packaging is already in high-volume – but it’s about to grow even more strongly
Fan-Out Wafer Level Packaging (FOWLP) started volume commercialization in 2009/2010 and started promisingly, with initial push by Intel Mobile. However, it was limited to a narrow range of applications – essentially single die packages for cell phone baseband chips – reaching its limit in 2011. In 2012 big fab-less wireless/mobile players started slowly volume production after qualifying the technology...
glass substrates for semiconductor manufacturing 2013 Report by Yole Developp...Yole Developpement
This document provides a summary of a report analyzing glass substrates for semiconductor manufacturing applications. It includes an executive summary with market forecasts for glass substrates broken down by functionality, end application, and wafer size through 2018. It also outlines the scope of the report, companies cited, and key objectives. The report examines opportunities for glass substrates in applications such as MEMS, CIS, LEDs, memory, and more. It evaluates the 2012-2018 market and provides breakdowns by functionality and end application with both shipment and revenue forecasts.
Growth, supply chain, new applications: inverter industry is about to redefine itself.
The inverter market is heavily application dependent. However, there are some cross-fertilization trends — companies with a good position within one inverter market segment are researching entry into other segments. Companies like Alstom, ABB, Ingeteam, Siemens, and General Electric already offer products in two or more inverter segments.
Some players have chosen vertical integration to optimize their internal cost structure to better target commodity-like markets, as well as to meet the severe cost requirements of the automotive industry. Other players have bet on horizontal integration to offer complete solutions to customers.
Driven by application diversification, IPDs (integrated passive devices) continue their promising
growth.
Today, miniaturization and integration are key drivers in electronic devices. This is even more critical in several consumer applications, where thinner devices mean higher integration levels, necessitating low-profile components.
More information on that report at http://www.i-micronews.com/reports.html
Phosphors and Quantum Dots 2017: LED downconverters for Lighting and Displays...Yole Developpement
This document provides an overview and analysis of LED downconverters (phosphors and quantum dots) for lighting and display applications. It discusses key requirements for downconverters, major material families and compositions, as well as trends in applications driving new phosphor needs. The document also includes a competitive analysis of suppliers, price trends, and volume and revenue forecasts for the market from 2015-2022 for both phosphors and quantum dots.
The document provides a teardown analysis of the Texas Instruments AWR1642 79 GHz radar chipset. It includes:
- An overview of the chipset's features and TI's portfolio.
- A physical analysis of the package and die, identifying key blocks and the RF CMOS process.
- A cost analysis estimating wafer costs, die costs, and the packaged component cost.
- A comparison to other TI mmWave devices and a Delphi radar solution.
- An estimated selling price for the AWR1642 chipset based on its manufacturing costs and TI's financial parameters.
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
Advanced Substrates Overview: From IC Package to Board - 2017 Report by Yole ...Yole Developpement
How can advanced substrates and boards bridge the gap created by front-end scaling?
Advanced substrates as a key enabler of future products and markets
In an uncertain, transformative semiconductor market, advanced packaging is one of the key technologies offering stability and a long-term solution. On one hand it can adapt to product diversification, offering more functionality, system integration, and performance, as well as potentially lower manufacturing cost; and on the other hand it can adhere to future scaling requirements. Advanced substrates are the key interconnect component of advanced packaging architectures and are critical in enabling future products and markets. For this reason, Yole has established this stand-alone dedicated advanced substrate activity, focused on exploring the market and technologies of PCBs, package substrates and RDLs. This first report will serve as an overview of advanced substrate technologies, markets, and supply chain, to be supported by subsequent in-depth reports.
Today’s advanced substrates in volume are Flip Chip (FC) substrates, 2.5D/3D TSV assemblies, and thin-film RDLs (Fan-Out WLP, or “FOWLP”) below an L/S resolution of 15/15 um and with transition below L/S < 10/10 um. These advanced substrates are traditionally linked to higher-end logic (CPUs/GPUs, DSPs, etc.) driven by ICs in the latest technology nodes in the computing, networking, mobile, and high-end consumer market segments (gaming, HD/Smart TV). However, due to additional form factor and low power demands, WLP and advanced FC substrates are also widespread in majority of smartphone functions: application processors, baseband, transceivers, filters, amplifiers, WiFi modules, drivers, codecs, power management, etc.
For more information, please visit our website: http://www.i-micronews.com/reports.html
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
Littelfuse and Monolith Semiconductors, in collaboration with X-Fab, have released a 1st-generation, high-reliability MOSFET with the hope of making this silicon carbide product mainstream.
The market outlook for SiC devices is promising, with a compound annual growth rate (CAGR) of 28% from 2016 – 2020. This will increase to 40% from 2020 – 2022 due to growth among automotive and industrial applications. In total, the SiC market will exceed $1B in 2022. In the energy conversion sector, SiC devices have an actual value of $250M, which will increase by around 28% in 2022. The reason for this relates to market forces pushing for loss reduction, not only for the sake of improved efficiency but also for smaller packages.
More information on that report a http://www.systemplus.fr/reverse-costing-reports/littelfuse-silicon-carbide-mosfet-lcis1mo120e0080-1200v-25a-80mohms/
This document discusses Nokia's efforts to realize value from its large patent portfolio through patent monetization, specifically patent licensing and patent sales. It notes that Nokia has 30,000 patents and applications based on €50 billion in R&D spending. Patent monetization has become more important given rising patenting costs and examples of large patent settlements. The US patent licensing market is estimated at $50-500 billion annually and involves many major tech companies. While patent licensing is sophisticated, patent sales are also a key strategy, though average per-patent prices have declined from the Nortel transaction and supply is increasing from various sources. In conclusion, Nokia focuses on financial returns through quality, scale and creativity in licensing, as well
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
The report provides a market analysis of the GaAs wafer and epiwafer markets from 2019 to 2025. It forecasts that the GaAs wafer market will increase from $200 million in 2019 to $348 million in 2025, with the largest application segments being RF, photonics, and LED. The open epiwafer market is also analyzed, with IQE and VPEC together comprising almost 80% of the $262 million total market in 2019. Key drivers of growth are discussed for various applications such as 5G adoption for RF and increasing use of VCSELs for 3D sensing and LiDAR.
Radar and Wireless for Automotive: Market and Technology Trends 2019 report b...Yole Developpement
The radar and 5G/V2X markets will both grow – one through market pull, the other through prospective enablement.
More information on https://www.i-micronews.com/products/radar-and-v2x-for-automotive-technologies-and-market-trends-2019/
MarketResearchReprots.com has announced the addition of “Forecast of Global Semiconductor Inspection Equipment Players Market 2023” research report to their offering. See more at- http://mrr.cm/w3C
The integration limit of flash memories is approaching, and emerging Non-Volatile Memories (eNVM) to replace conventional Flash Memories have been proposed. Ferroelectric RAMs (FeRAMs), Magnetoresistive RAMs (MRAMs), Resistive-change RAMs (ReRAMs) or Phase-Change Random-Access Memories (PCRAMs) are promising to change the memory landscape. The field of eNVM has shown an intensive patenting activity since early 1990s, with a substantial increase during the past decade. Currently, there are more than 8,600 relevant patent families filed all over the world. Patent families were filed by more than 800 patent applicants mainly located in USA, Japan, Taiwan and China. From a quantitative point of view, the most active companies are SK Hynix, Samsung, Toshiba, Micron Technology and IBM. In addition, startup firms do not file many patents and their main strategy is to license or sell their intellectual property. The patents related to MRAM technology account for more than 40% of filings. The main patent applicants are Toshiba, Samsung and Renesas Electronics which represent together almost 30% of the patents. The MRAM technology was growing between 2003-2007 with more than 50% of patents published during these years. Currently, the number of patents filed has remained stable, with about 200 patents filed per year. About 30% of patent families are related to PCRAM technology. They were mainly filed by SK Hynix and Samsung, they represent almost 40% of published patents. The PCRAM technology was increasing between 2002 and 2009, with more than 450 patent families published in 2009. Publication patents is decreasing these last 4 years, however more than 200 patents are still published every year. Patent filings will continue on PCRAM technology to further improve memory applications. The patents dedicated to FeRAM technology represent 20% of filings. They were mainly filed by SK Hynix, Samsung and Seiko Epson which represent almost 50% of published patents. FeRAM is a mature technology, and FeRAM is not an active patent field yet. Patents related to ReRAM technology account for almost 10% of new patent filings. ReRAM is the newest patented technology and the number of patent publications will continue to increase in the coming years. With over 100 patent families already filed, Samsung will play a significant role in this emerging technology development. Several players are focusing on all types of memories, alone or by joint developments. An overview is given for more than 50 companies. A focus is also realized on main 10 players (SK Hynix, Samsung, Toshiba, Micron Technology, IBM…) to summarize all the data set, such as key patents, expiring patents, acquisitions, joint developments and key industrial applications for each eNVM.
Report’s Key Features
• PDF with > 80 slides
• Excel file > 1,000 patents
• IP trends, including time-evolution of published patents, countries of patent filings, etc.
• Ranking of main patent assignees
• Key players’ IP position and relative strength of their patent portfolios
• Patent segmentation per application:
– CMOS image sensor (CIS)
– Memory
– MEMS
– LED
• Key patent identification and details
• IP profile of key players: Xperi, TSMC, YMTC
• Excel database containing all patents analyzed in the report, including technology and application segmentations
The document provides an overview of the technology landscape and patent analysis for organic photodiodes applicable to sensors and detectors. It introduces the objective of analyzing the technology segmentation, trends, key players, and illustrative patents. The summary identifies that most patenting activity is in the US, with applications in optical sensing, imaging, radiation detection, and other areas. Patent filings increased until 2013, with over 70 key players identified.
KEY FEATURES OF THE REPORT
• IP trends including time evolutions and countries of patent filings
• Current legal status of patents
• Ranking of main patent applicants
• Joint developments and IP collaboration network of main patent applicants
• Key patents and granted patents near expiration
• Relative strength of main companies’ IP portfolios
• Matrix showing patent applicants and their patented technologies
• Segmentation of patents by
- Technology (primary and secondary batteries w/o lithium)
- Design (micro-batteries, solid thin film, flexible, 3D …)
- Components/materials (anode, cathode, electrolyte, barrier layer ...)
- Manufacturing method (CVD, ALD, PVD, sputtering, electrodeposition …)
- Claimed invention (method, product, apparatus)
• Microbattery IP profiles of 10 major companies, with key patents, technological issues, partnerships, IP strength, IP strategy and latest market news
• Excel database with all patents analyzed in the report (3000+ patents), including technology segmentation
Report’s Key Features
• PDF with > 230 slides
• Excel file > 3,000 patent families
• Main IP dynamics and key trends.
• IP leaders, most active players and newcomers.
• IP portfolio strength of key players, and their technology/application focus.
• Time evolution of patents filings by company, countries, and technology.
• IP collaborations and IP transfers between key organizations.
• Insights into the status of RF GaN patented technologies, identifying trends for each technology and application.
• Extensive Excel database of over 3,000 patent families with all patent information and technology segmentation.
Fan-Out and Embedded Die: Technologies & Market Trends 2015 Report by Yole De...Yole Developpement
Fan-Out and Embedded Die: Two promising Wafer/Panel-Level-Packaging technologies. What are the next steps for the growth?
Fan-Out Wafer Level Packaging is already in high-volume – but it’s about to grow even more strongly
Fan-Out Wafer Level Packaging (FOWLP) started volume commercialization in 2009/2010 and started promisingly, with initial push by Intel Mobile. However, it was limited to a narrow range of applications – essentially single die packages for cell phone baseband chips – reaching its limit in 2011. In 2012 big fab-less wireless/mobile players started slowly volume production after qualifying the technology...
glass substrates for semiconductor manufacturing 2013 Report by Yole Developp...Yole Developpement
This document provides a summary of a report analyzing glass substrates for semiconductor manufacturing applications. It includes an executive summary with market forecasts for glass substrates broken down by functionality, end application, and wafer size through 2018. It also outlines the scope of the report, companies cited, and key objectives. The report examines opportunities for glass substrates in applications such as MEMS, CIS, LEDs, memory, and more. It evaluates the 2012-2018 market and provides breakdowns by functionality and end application with both shipment and revenue forecasts.
Growth, supply chain, new applications: inverter industry is about to redefine itself.
The inverter market is heavily application dependent. However, there are some cross-fertilization trends — companies with a good position within one inverter market segment are researching entry into other segments. Companies like Alstom, ABB, Ingeteam, Siemens, and General Electric already offer products in two or more inverter segments.
Some players have chosen vertical integration to optimize their internal cost structure to better target commodity-like markets, as well as to meet the severe cost requirements of the automotive industry. Other players have bet on horizontal integration to offer complete solutions to customers.
Driven by application diversification, IPDs (integrated passive devices) continue their promising
growth.
Today, miniaturization and integration are key drivers in electronic devices. This is even more critical in several consumer applications, where thinner devices mean higher integration levels, necessitating low-profile components.
More information on that report at http://www.i-micronews.com/reports.html
Phosphors and Quantum Dots 2017: LED downconverters for Lighting and Displays...Yole Developpement
This document provides an overview and analysis of LED downconverters (phosphors and quantum dots) for lighting and display applications. It discusses key requirements for downconverters, major material families and compositions, as well as trends in applications driving new phosphor needs. The document also includes a competitive analysis of suppliers, price trends, and volume and revenue forecasts for the market from 2015-2022 for both phosphors and quantum dots.
The document provides a teardown analysis of the Texas Instruments AWR1642 79 GHz radar chipset. It includes:
- An overview of the chipset's features and TI's portfolio.
- A physical analysis of the package and die, identifying key blocks and the RF CMOS process.
- A cost analysis estimating wafer costs, die costs, and the packaged component cost.
- A comparison to other TI mmWave devices and a Delphi radar solution.
- An estimated selling price for the AWR1642 chipset based on its manufacturing costs and TI's financial parameters.
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
Advanced Substrates Overview: From IC Package to Board - 2017 Report by Yole ...Yole Developpement
How can advanced substrates and boards bridge the gap created by front-end scaling?
Advanced substrates as a key enabler of future products and markets
In an uncertain, transformative semiconductor market, advanced packaging is one of the key technologies offering stability and a long-term solution. On one hand it can adapt to product diversification, offering more functionality, system integration, and performance, as well as potentially lower manufacturing cost; and on the other hand it can adhere to future scaling requirements. Advanced substrates are the key interconnect component of advanced packaging architectures and are critical in enabling future products and markets. For this reason, Yole has established this stand-alone dedicated advanced substrate activity, focused on exploring the market and technologies of PCBs, package substrates and RDLs. This first report will serve as an overview of advanced substrate technologies, markets, and supply chain, to be supported by subsequent in-depth reports.
Today’s advanced substrates in volume are Flip Chip (FC) substrates, 2.5D/3D TSV assemblies, and thin-film RDLs (Fan-Out WLP, or “FOWLP”) below an L/S resolution of 15/15 um and with transition below L/S < 10/10 um. These advanced substrates are traditionally linked to higher-end logic (CPUs/GPUs, DSPs, etc.) driven by ICs in the latest technology nodes in the computing, networking, mobile, and high-end consumer market segments (gaming, HD/Smart TV). However, due to additional form factor and low power demands, WLP and advanced FC substrates are also widespread in majority of smartphone functions: application processors, baseband, transceivers, filters, amplifiers, WiFi modules, drivers, codecs, power management, etc.
For more information, please visit our website: http://www.i-micronews.com/reports.html
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
Littelfuse and Monolith Semiconductors, in collaboration with X-Fab, have released a 1st-generation, high-reliability MOSFET with the hope of making this silicon carbide product mainstream.
The market outlook for SiC devices is promising, with a compound annual growth rate (CAGR) of 28% from 2016 – 2020. This will increase to 40% from 2020 – 2022 due to growth among automotive and industrial applications. In total, the SiC market will exceed $1B in 2022. In the energy conversion sector, SiC devices have an actual value of $250M, which will increase by around 28% in 2022. The reason for this relates to market forces pushing for loss reduction, not only for the sake of improved efficiency but also for smaller packages.
More information on that report a http://www.systemplus.fr/reverse-costing-reports/littelfuse-silicon-carbide-mosfet-lcis1mo120e0080-1200v-25a-80mohms/
This document discusses Nokia's efforts to realize value from its large patent portfolio through patent monetization, specifically patent licensing and patent sales. It notes that Nokia has 30,000 patents and applications based on €50 billion in R&D spending. Patent monetization has become more important given rising patenting costs and examples of large patent settlements. The US patent licensing market is estimated at $50-500 billion annually and involves many major tech companies. While patent licensing is sophisticated, patent sales are also a key strategy, though average per-patent prices have declined from the Nortel transaction and supply is increasing from various sources. In conclusion, Nokia focuses on financial returns through quality, scale and creativity in licensing, as well
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
The report provides a market analysis of the GaAs wafer and epiwafer markets from 2019 to 2025. It forecasts that the GaAs wafer market will increase from $200 million in 2019 to $348 million in 2025, with the largest application segments being RF, photonics, and LED. The open epiwafer market is also analyzed, with IQE and VPEC together comprising almost 80% of the $262 million total market in 2019. Key drivers of growth are discussed for various applications such as 5G adoption for RF and increasing use of VCSELs for 3D sensing and LiDAR.
Radar and Wireless for Automotive: Market and Technology Trends 2019 report b...Yole Developpement
The radar and 5G/V2X markets will both grow – one through market pull, the other through prospective enablement.
More information on https://www.i-micronews.com/products/radar-and-v2x-for-automotive-technologies-and-market-trends-2019/
MarketResearchReprots.com has announced the addition of “Forecast of Global Semiconductor Inspection Equipment Players Market 2023” research report to their offering. See more at- http://mrr.cm/w3C
The integration limit of flash memories is approaching, and emerging Non-Volatile Memories (eNVM) to replace conventional Flash Memories have been proposed. Ferroelectric RAMs (FeRAMs), Magnetoresistive RAMs (MRAMs), Resistive-change RAMs (ReRAMs) or Phase-Change Random-Access Memories (PCRAMs) are promising to change the memory landscape. The field of eNVM has shown an intensive patenting activity since early 1990s, with a substantial increase during the past decade. Currently, there are more than 8,600 relevant patent families filed all over the world. Patent families were filed by more than 800 patent applicants mainly located in USA, Japan, Taiwan and China. From a quantitative point of view, the most active companies are SK Hynix, Samsung, Toshiba, Micron Technology and IBM. In addition, startup firms do not file many patents and their main strategy is to license or sell their intellectual property. The patents related to MRAM technology account for more than 40% of filings. The main patent applicants are Toshiba, Samsung and Renesas Electronics which represent together almost 30% of the patents. The MRAM technology was growing between 2003-2007 with more than 50% of patents published during these years. Currently, the number of patents filed has remained stable, with about 200 patents filed per year. About 30% of patent families are related to PCRAM technology. They were mainly filed by SK Hynix and Samsung, they represent almost 40% of published patents. The PCRAM technology was increasing between 2002 and 2009, with more than 450 patent families published in 2009. Publication patents is decreasing these last 4 years, however more than 200 patents are still published every year. Patent filings will continue on PCRAM technology to further improve memory applications. The patents dedicated to FeRAM technology represent 20% of filings. They were mainly filed by SK Hynix, Samsung and Seiko Epson which represent almost 50% of published patents. FeRAM is a mature technology, and FeRAM is not an active patent field yet. Patents related to ReRAM technology account for almost 10% of new patent filings. ReRAM is the newest patented technology and the number of patent publications will continue to increase in the coming years. With over 100 patent families already filed, Samsung will play a significant role in this emerging technology development. Several players are focusing on all types of memories, alone or by joint developments. An overview is given for more than 50 companies. A focus is also realized on main 10 players (SK Hynix, Samsung, Toshiba, Micron Technology, IBM…) to summarize all the data set, such as key patents, expiring patents, acquisitions, joint developments and key industrial applications for each eNVM.
The document is a project report on Silicon on Insulator (SOI) devices submitted by two students, Kashish Grover and Sanket Gawade, to their professor. The report provides an overview of SOI technology, including the different manufacturing methods like SIMOX, Smart Cut, and ELTRAN processes. It describes the two main types of SOI devices - partially depleted SOI and fully depleted SOI. The students conducted simulations of SOI MOSFETs in SENTAURUS software and obtained the ID-VG characteristics. The report summarizes the key advantages of SOI devices like lower parasitic capacitance and better performance compared to conventional silicon substrates.
Purchase Order Boilerplate/Standard Terms ExamplesBill Kohnen
Top performing purchasing organizations incorporate standard “boilerplate” PO terms into every transaction. Discussion of best practice, practical steps and examples
Debjit Paul is a QA Analyst with over 6 years of experience in testing distributed applications. He has worked as a Senior Testing Engineer at HCL Technologies and as a Software Tester at CIBER Sites India Pvt. Ltd. He has expertise in automated testing using tools like QTP and manual testing. He is proficient in testing web, mobile, and client-server applications in domains like banking, retail, and telecom. He has experience in all phases of the SDLC and testing life cycle.
The document discusses the need for total IP solutions in modern SoC design. It describes how SoC complexity requires the use of third-party IP cores, analog front-ends (PHYs), and complete solutions including RTL IP, PHY IP, verification IP, software stacks, and hardware platforms. It provides Arasan Chip Systems as a case study, outlining their portfolio of standards-based IP, verification tools, hardware development kits, and design services to deliver comprehensive IP solutions.
Join Stacey Brown, President of MindLink Resources, for a webinar that will examine the top 10 qualities of a quality assurance (QA) tester. Learn how to bring out these traits in your current QA staff and how to watch for these soft skills when screening new candidates.
When localizing products, the QA step is essential in confirming the translation and making sure the product was successfully prepared for the target market. Managers trust the QA staff to catch translation and engineering errors and ensure product readiness to avoid quality issues caught by the end customer. Many managers make the mistake of assigning this critical role to a linguist who may not have the right characteristics of a good tester. When selecting QA staff, it is important to consider skills beyond just linguistic and technical. There are many “soft skills” to watch for in a candidate that will give localization managers the confidence that even small errors will be reported by their tester.
In this webinar, Stacey will discuss the top 10 qualities of a quality assurance (QA) tester, how to bring out these traits in current QA staff, and how to watch for these soft skills when screening new candidates.
About the presenter
Stacey Brown is the Talent Management Specialist and President of Mindlink Resources, LLC.. She has a passion for surrounding herself with talented people. For the past 15 years she has successfully built teams of contractors providing a variety of services at large fortune 500 companies in the Pacific Northwest. She specifically has over 12 years of experience recruiting, training and managing QA specialists. Stacey has a degree in Communications and an MBA in Technology Management.
This document discusses ultra thin body SOI FETs. Some key points:
- SOI uses a thin silicon layer on an insulating substrate to reduce parasitic capacitance and improve performance over bulk silicon. Fully depleted SOI is preferred for its thin size and reduced leakage/power consumption.
- Benefits of SOI include lower capacitance, resistance to latch-up, higher performance at lower voltages, reduced temperature effects, better yields, and reduced leakage currents.
- Ultra thin body SOI FETs have even better gate control and mobility due to thin channel thickness, lower parasitic capacitance, and reduced leakage currents, making them useful for applications like memory, microelectronics, RF devices,
Girish Bharadwaj is seeking a position as a physical design engineer where he can contribute to growth while advancing. He has over 4 years of experience in physical design closure, verification, and low power techniques. His skills include placement and routing, timing analysis, custom layout, and scripting. He has worked on blocks up to 14.5mm^2 and completed tapeout of SoCs at TSMC 28nm. Girish holds an M.Tech in VLSI design and has published work in conferences.
Analog Mixed-Signal Design in FinFET Processes Design World
While industry pundits have forecasted the end of analog design in the next leading edge process, the reality is that the practice is still going strong, and there’s no end in sight. Not only are teams still designing data converters, PLLs, filters, and other analog goodies in the latest processes (including FinFET), but design teams are reaching higher levels of performance than they did in yesterday’s processes. The new processes have, without a doubt, changed the task of analog design, and the designer’s toolkit has had to undergo a major revision. Many of our old techniques have become a lot less relevant, and today’s designer needs to have a good handle on a broad set of new techniques.
Some of the changes are a result of designers targeting processes for very digital applications (supply voltages of 0.8V and less). Others are a result of the size of the devices (matching of small devices is poor, matching of very small devices is worse). Changes are also a result of the new fabrication techniques that must be used to make the devices (unit-sized devices and no mixing of different device types - resistor and I/O device ghettos are required). Of course, there’s great news: the transistors are wonderfully fast and the digital is almost free.
View this webinar to:
-Gain an understanding of the challenges of analog design in the new world of leading-edge processes
-Learn about design techniques that take advantage of the characteristics of today’s design reality
Ultra-thin body SOI MOSFETs: Term Paper_class presentation on Advanced topics...prajon
This document discusses ultra-thin body SOI MOSFETs. It describes how SOI technology uses a layered silicon-insulator-silicon substrate to improve performance and reduce short-channel effects compared to conventional silicon. Ultra-thin body SOI can further suppress short-channel effects and reduce sub-threshold gate leakage. The document examines the effects of body doping, buried oxide thickness, inversion charge, and mobility on ultra-thin body SOI MOSFET performance. It concludes that ultra-thin body SOI with high-k gate dielectrics can improve scaling and performance for high-density, low-power applications.
Fabrication of silicon on insulator (soi)Pooja Shukla
The document discusses the fabrication of photonic crystals using 248 nm deep UV lithography. It involves using a SOI wafer and performing lithography to selectively pattern and etch the silicon layer to create a photonic crystal structure. Deep UV lithography allows fabrication of wavelength-scale nanostructures but can be impacted by optical proximity effects between neighboring patterns which can alter feature sizes. Proximity correction techniques are discussed to help mitigate these effects and allow mass production of photonic integrated circuits using this method.
The twin well process allows for separate optimization of n-type and p-type transistors. It involves depositing a lightly doped epitaxial layer on an n+ or p+ substrate, then forming n-wells and p-wells in this layer through independent doping steps. This allows the dopant concentrations to be carefully tuned to produce desired device characteristics for both transistor types. The key steps are tub formation through n-well and p-well implantation and diffusion, polysilicon gate formation, and contact definition and metallization to connect the transistors. The main advantage is obtaining balanced performance from n-type and p-type transistors through separate well optimization.
Moore's Law states that the number of transistors on integrated circuits doubles approximately every 18 months, leading to increased computing power at reduced cost over time. This advancement in computer hardware and software enabled the development of ERP systems by making the required technology affordable. ERP systems provide integrated management of business processes and information across functional areas like finance, HR, supply chain, and customers. Moore's Law continues to be an important driver of technological progress and the evolution of ERP systems.
This document discusses silicon on insulator (SOI) technology. It begins by defining SOI as using a layered silicon-insulator-silicon substrate instead of conventional silicon substrates in semiconductor manufacturing. It then explains the differences between bulk silicon MOSFETs and SOI MOSFETs. The document discusses several manufacturing methods for SOI, including SIMOX, wafer bonding, and Smart Cut. It also covers the benefits of SOI such as lower parasitic capacitance and resistance to latch-up. Finally, it distinguishes between partially depleted SOI and fully depleted SOI devices.
The document summarizes a presentation on simulating an NMOS transistor using TCAD tools. It introduces the topics covered, which include an overview of TCAD tools like Sentaurus Structure Editor, Process, Device, and Workbench. It then describes the fabrication process of the NMOS transistor through simulations in Sentaurus Process. The device is then simulated in Sentaurus Device to obtain electrical characteristics. Analytical results are discussed by varying device parameters. Future work aims to simulate more advanced devices like FinFETs and CNTFETs using 3D tools.
KEY FEATURES OF THE REPORT
• IP trends including time evolution of patent publications and patent filings countries
• Current legal status of patents (granted, pending application, abandoned, expired)
• Main patent assignees (ranking, time evolution, geographical coverage) • Joint developments and IP collaboration network of main patent assignees
• Profile of 5 key players (Samsung, Toshiba, Micron Technology, SK Hynix, Intel), including:
- Technology and market data for TSV stacked memory
- Key patents
- Cross link analysis between teardown analysis, process flow and patents
- Technical challenges and relevant solutions found in the patents
- Patent litigations (ELM 3DS vs SK Hynix/Micron/Samsung)
• Excel database with all patents analyzed for the 5 key players, including technology segmentation
Non invasive Glucose Patent Landscape sampleKnowmade
The report provides essential patent data for non-invasive glucose monitoring including:
• Time evolution of patent publications and countries of patent filings
• Current legal status of patents
• Ranking of main patent applicants
• Joint developments and IP collaboration network of main patent applicants
• Key patents
• Granted patents near expiration
• Relative strength of main companies IP portfolio
• Non-invasive glucose monitoring IP profiles of 15 major companies with key patents, partnerships, and IP strength and strategy
The report also provides an extensive Excel database with all patents analyzed in the study
Photoacoustic imaging technologies in the biomedical domain are in full growth from an IP point of view, and have began to move in the clinical field. If Japanese companies Canon and Fujifilm are the main IP holder, the market is held by US actors : ENDRA Life Sciences, VisualSonics, Seno Medical Instruments, OptoSonics or TomoWave Laboratories.
This patent landscape focuses on photoacoustic imaging in biomedicine. Photoacoustic imaging is a safe, non-invasive, non-ionizing imaging technique. The technique offers several advantages and represents a great alternative to traditional medical imaging approaches. The innovation of photoacoustic imaging for biomedical purposes is mainly driven by the need to enhance the efficiency of the detection and diagnostic of cancer.
KEY FEATURES OF THE REPORT
The report provides essential patent data for biomedical photoacoustic imaging including:
Time evolution of patent publications and countries of patent filings.
Current legal status of patents.
Ranking of main patent applicants.
Joint developments and IP collaboration network of main patent applicants.
Key patents.
Granted patents near expiration.
Relative strength of main companies IP portfolio.
Photoacoustic imaging IP profiles of 15 major companies with key patents, partnerships, and IP strength and strategy.
The report also provides an extensive Excel database with all patents analyzed in the study.
Microfluidic technologies for diagnostic applications - SampleKnowmade
The report provides essential patent data for microfluidic technologies for diagnostic applications including:
• Time evolution of patent publications and countries of patent filings
• Current legal status of patents
• Ranking of main patent applicants
• Joint developments and IP collaboration network
• Key patents and granted patents near expiration
• Relative strength of main companies IP portfolio
• IP profiles of 15 major companies
Yole led phosphor_qd_ip_january_2016_sampleClotilde Fabre
This document provides an overview of the patent landscape report on phosphors and quantum dots for LED applications. The report analyzes over 7,500 relevant patent families and provides an in-depth examination of the major patent holders, key technologies, litigation and licensing activities, and emerging trends. It identifies the leading companies in different patent segments, such as phosphor compositions and quantum dots, and analyzes the strengths and weaknesses of their intellectual property portfolios.
LED phosphor patent investigation 2013 Report by Yole DeveloppementYole Developpement
Phosphor related intellectual property has been and remains a major driving force with strong impact on the shape of the LED industry.
LED phosphor IP is shaping the industry
The first commercial GaN-based blue LEDs were produced in Japan in the mid 90’s after researchers Shuji Nakamura at Nichia and Professor Akasaki at Nagoya University (IP assigned to Toyoda Gosei) succeeded in removing some of the major remaining roadblocks associated with this technology (p-doping, epitaxy quality…).
Quickly leveraging on this success, some fundamental patents describing the use of a blue LED combined with a phosphor to produce white LEDs were filed by Nichia, Osram, ATMI and others. Those fundamental patents were rapidly followed by a fast growing number of applications through 2005 as an increasing number of companies started to compete in the LED market and new applications in cell phone, laptop and LCD TV display, and general lighting were being addressed.
Phosphor IP is a major force in the LED industry. With more than 40 litigation cases, it is also used as leverage by companies which have negotiated close to 70 licensing and supply agreements to date. It can also be argued that in the first half of the 2000 decade, the strict enforcement and lack of license grants for some fundamental IP related to the design and manufacturing of white LEDs might also have slowed down the progress of the industry by preventing more efficient competition that would allow prices to decrease.
The report identifies the key players with the most relevant IP. It provides an overview, of phosphor related IP litigation and licensing, that has shaped the industry since the mid 90s, as well as a detailed analysis for the major players involved.
A vast number of relevant patents
Our search strategy combines automated and manual screenings that have led to the selection of more than 4,500 relevant patent families. Those have been segmented by type (composition patent or phosphor configuration patents) and organized in various technology segments that are analyzed in detail: garnets, silicates, nitrides and oxynitrides, quantum dots. The report also includes a special focus on the emerging LED phosphor IP in China.
For each segment, the report provides a detailed analysis including the time evolution of patent filings, identification of the key players, collaborations and citation networks, as well as the identification of the key patents based-on citation and impacts in litigations.
The report also includes a companion excel database with all patents of the company profiled in the report. This database includes abstracts and hyperlinks to the original documents and allows multi-criteria searches (patent publication number, priority date, title, applicants, technological segments…)
More information on the report at http://www.i-micronews.com/reports/LED-Phosphors-Down-Converters-Patent-Investigation/14/392/
GaN-on-Silicon Substrate Patent Investigation 2014 Report by Yole DeveloppementYole Developpement
More players on the playground, business is starting: when will the IP battle begin?
GaN-ON-Si IS ENTERING PRODUCTION: WHAT IS THE PATENT SITUATION?
GaN-on-Si technology appeared naturally as an alternative to GaN-on-Sapphire—the main stream technology for LED applications. Today, despite potential cost benefits, the mass adoption of GaN-on-Si technology for LED applications remains unclear. Most major LED makers have a patenting activity related to GaN-on-Si technology, but so far, few have made it the core of their strategy and technology roadmap. Contrary to the LED industry, we expect GaN-on-Si to be widely adopted by Power Electronics and RF applications because of its lower cost and CMOS compatibility.
The growth of GaN-on-silicon substrate was first reported in the early-1970s (T. L. Chu et al., J. Electrochemical Society, Vol. 118, page 1200), since the early 1990s more and more academics and industrials have been involved in developing this technology. GaN-on-Si technology is now poised for a list of technical challenges. The high lattice mismatch between GaN and Si results in a high defect density in epitaxial layers (dislocations). The high thermal expansion coefficient (TCE) mismatch between GaN and Si leads to a large tensile stress during cooling from the growth temperature to room temperature. The tensile stress causes film cracking and a concave bending of the wafer (warpage). These factors combine to make both dislocation density and crack/warpage reduction a challenging task.
This patent investigation covers patents published worldwide up to December, 2013. The patents addressing the above mentioned challenges have been selected, and an in-depth analysis of patent holders and corresponding patented technologies is provided. This report does not include patents related to active layers or GaN-based devices.
Fundamental patents describing a gallium-nitride-based compound semiconductor grown on a silicon substrate were filed before the 1990s with the most significant assigned to TDK and Fujitsu. In the early 1990s, Toyoda Gosei and the University of Nagoya filed the first concepts of a buffer layer for improving the crystallinity of GaN. Those fundamental patents have been followed by an ever increasing number of applications since 1995 as more companies competed in GaN-on-Si technology to meet the technological challenges, the market demand and to lower manufacturing costs. Currently, the patented technologies reflect the significant improvements that have been made on key material issues such as dislocation density reduction and stress management for preventing cracks and warpage of the wafer. According to our analysis, GaN-on-Si IP is mature enough to initiate mass production.
More information on that report at http://www.i-micronews.com/reports/GaN-on-Silicon-Substrate-Patent-Investigation/3/431/
This report provides a detailed picture of the patent landscape for III-nitride materials grown on silicon substrate.
This report covers patents published worldwide up to December 2013. More than 560 patent families relevant to the scope of this report have been selected. Those have been manually segmented by type and organized in various technology segments as described below.
Market data from Yole Développement are also provided to add some context regarding business trends and metrics.
The report provides essential patent data for GaN on Silicon substrate related to main material issues such as dislocation
density reduction and stress management for preventing crack generation and warpage of the wafer.
It identifies more than 50 holders of GaN-on-Si related intellectual property. It provides in-depth analysis of key technology
segments and key players including:
– Time evolution of patent publications and countries of patent filings.
– Current legal status of patents.
– Ranking of main patent applicants.
– Joint developments and IP collaboration network of main patent applicants.
– Key patents.
– Granted patents near expiration.
– Relative strength of main companies IP portfolio.
– Overview of patent litigations.
– Matrix applicants/technology issues for more than 20 companies.
A special focus is provided on key issues and approaches:
– Buffer type
– Defect reduction
– Stress management
– Non/Semi polar
– (001)-oriented silicon substrate
– Layer Transfer Technology
Capsule Endoscopy Patent Landscape 2014 Sample
Olympus and Given Imaging are leading intellectual property in the capsule endoscopy industry, but for how long?
KEY FEATURES OF THE REPORT
The report provides essential patent data for capsule endoscopy. It identifies more than 30 major holders of capsule endoscopy related intellectual property. It provides in-depth IP analysis and industrial key players including:
-Time evolution of patent publications and countries of patent filings.
-Current legal status of patents.
-Ranking of main patent applicants.
-Joint developments and IP collaboration network of main patent applicants.
-Key patents.
-Granted patents near expiration.
-Relative strength of main companies IP portfolio.
-Overview of patent litigations.
-Matrix applicants/technology issues for more than 15+ companies.
The “capsule endoscopy IP” profiles of 15+ major companies is presented, with key patents, technological issues, litigations, licenses, partnerships, and IP strength and strategy.
The report also provides an extensive Excel database with all patents analyzed in the report.
OBJECTIVE OF THE REPORT
•Understand the IP landscape for capsule endoscopy.
•Identify key patents.
•Understand trends in capsule endoscopy IP.
•Identify the major players in capsule endoscopy IP and the relative strength of their patent portfolio.
•Identify new players in capsule endoscopy IP.
•Identify IP collaboration networks between key players (industrial and academics).
•Identify main patent litigations.
This document provides a summary of an emerging MEMS patent investigation report by Knowmade and Yole Développement. The report analyzes over 1,300 patent families related to 7 types of emerging MEMS technologies: AOC MEMS, Autofocus, Chemical Sensors, Micro-Speakers, Scanning Micro-Mirrors, Si Microfluidics, and Ultrasonic MEMS. For each technology, the report provides an overview of the market and key patents, including rankings of major patent applicants and analysis of their patent portfolios and networks. It also includes timelines of patent publications and key findings on the leading IP holders for each emerging MEMS technology.
Software Defined Networks Network Function Virtualization Pivotal TechnologiesOpen Networking Summits
The document discusses software defined networks (SDN) and network function virtualization (NFV). It provides an agenda for a presentation on SDN and NFV including an overview of NFV and its synergy with SDN, standardization efforts, and the role of open source. The presentation will also cover spreading NFV through use cases, network virtualization experiences from operators, challenges of network virtualization for mobile networks, and vendor perspectives on deploying SDN and NFV.
Miniaturized Gas Sensors Patent Landscape 2016 SampleKnowmade
KEY FEATURES OF THE REPORT
• IP trends including time evolutions and countries of patent filings
• Current legal status of patents
• Ranking of main patent applicants
• Joint developments and IP collaboration network of main patent applicants
• Key patents and granted patents near expiration
• Relative strength of main companies’ IP portfolios
• Matrix showing patent applicants and their patented technologies
• Segmentation of patents by gas sensor technology: Electrical detector (FET, CMOS, MOS/MIS), chemical sensor, optical detector, acoustic detector, gas chromatography, electro-chemical gas sensor, thermal gas sensor, gas sensor with CNTs/Graphene, electro-mechanical gas sensors
• IP position vs. market positions for each key players
• MEMS gas sensor IP profiles of 19 key companies, with key patents, technological issues, partnerships, IP strength, IP strategy and latest market news
• Excel database with all patents analyzed in the report (2000+ patents), including technology segmentation
Safe Nests in Global Nets - Innovation and IPAlberto Minin
This document discusses innovation and intellectual property (IP) management strategies of multinational companies. It presents research on the globalization of research and development (R&D) activities in the wireless telecommunications industry. The study finds that while the industry has strong drivers for globalization, large companies still concentrate much of their inventive activities related to essential patents in their home countries and headquarters. Reasons for this "non-globalization" of R&D include accumulated knowledge at headquarters, organizational inertia, maturation effects of internationalizing R&D, and the importance of centralized IP management. The conclusions discuss developing centers of excellence globally while maintaining "safe nests" of appropriable knowledge at headquarters through international R&D organization and local
The document compares the LTE standard essential patent portfolios of Nokia and InterDigital. It finds that Nokia's portfolio contains 96 total patents related to LTE, with 17 identified as potential standard essential patents. InterDigital's portfolio contains 78 total patents, with 15 identified as potential standard essential patents. The analysis shows that Nokia's patent portfolio covers more of the key LTE standard specifications and technology components compared to InterDigital's more narrowly distributed portfolio.
Patent investigation on LED phosphors and down-convertersKnowmade
The document discusses the history and development of LED phosphor technology and intellectual property (IP). It summarizes that the first commercial blue LEDs were created in the 1990s by researchers in Japan, enabling the development of white LEDs by combining blue LEDs with phosphors. This led to many foundational patents on using phosphors with LEDs. It notes that phosphor IP has played a major role in shaping the LED industry, with over 40 litigation cases and around 70 licensing agreements related to phosphor patents. The report aims to analyze the key players, technologies, litigation, and licensing deals related to LED phosphor IP over time.
Group III nitride semiconductors are recognized as having great potential for short wave length emission (LEDs, LDs, UV detectors) and high-temperature electronics devices. The field of III-N semiconductors has shown an intensive patenting activity since early 1990s, with a substantial increase during the past decade. Today, there are more than 27,000 patent families filed all over the world. The most active companies are Panasonic, Toshiba, Samsung, Sumitomo and Hitachi. The patents related to LED technology account for more than 40% of filings, followed by those related to GaN substrates (5%) and RF & Advanced Electronics (<5%).
More than 1,570 new patent families were published between early April 2012 and late March 2013. They were filed by about 350 patent applicants mainly located in Japan, Korea, USA and China. The main patent applicants are Sumitomo, Toshiba, Samsung, Sharp and Mitsubishi which represent together almost 25% of the patents published the last 12 months. The academic organisms account for almost 15% of new patent filings and they are mainly located in China. The data set was segmented by type of application (Substrates, Epi-wafers, LED & Laser, Power Devices, RF & Advanced Electronics, Photovoltaics, Sensors-Detectors-MEMS). About 45% of new patent families published the last 12 months are related to LED technology.
They were mainly filed by Toshiba, LG and Samsung, while Chinese companies are increasing their patent activity (Tongfang, Sanan Optoelectronics). The patents claiming an invention related to III-N Substrates and Power Devices represent 20% and 14% of new filings respectively. The patents dedicated to Substrate technology were mainly filed by Sumitomo, Hitachi and Mitsubishi, while University of California and Soitec filed 15 and 8 new patents respectively. The patents dedicated to Power Devices were mainly filed by Advanced Power Device Research Association, Samsung and Sumitomo and the patent filings remain dominated by Japanese companies. Numerous patent applications published this year are offered for sale or for license. This year, the most relevant offers are the ones from the University of California (e.g. Ammonothermal growth technique, CAVET for High Power Application, Defect reduction of semi-polar III-N, GaN substrates, III-N tandem solar cells .
Rudi Bekkers shares with the AOM audience the ideas of his paper authored with Simon den Uijl and Henk de Vries, whose focus is on Patent Pools. Their work examines the experiences with three generations of patent pools in the optical disc industry.
den Uijl, S., Bekkers, R., & de Vries, H. (2013). Managing intellectual property using patent pools: Lessons from three generations of pools in the optical disc industry. California Management Review, 55(4), 31-50.
FieldComm Group - NAMUR press conference 2017 final nov. 6FieldComm Group
The document summarizes activities from the FieldComm Group's presentation at the NAMUR Conference 2017. The FieldComm Group owns and develops major process automation standards including HART, FOUNDATION Fieldbus, and FDI. At the conference, they discussed the adoption of FDI technology, ongoing standardization work, and a demonstration of the NAMUR Open Architecture using FDI to connect field devices to cloud applications. They also described partnerships with other standards groups to further develop FDI and ensure interoperability.
The report analyzes the patent landscape related to antenna integrated in package (AiP). Over 140 entities have filed AiP patents, with the main assignees being SJ Semiconductor, TSMC, Samsung Electro-Mechanics, Huawei, MediaTek, IBM, ASE, SPIL, NCAP, Qualcomm, and Murata. The report provides a detailed analysis of these players' patent portfolios, technologies, strategies, and key patents. It also includes an Excel database of over 1,500 analyzed AiP patents. The report finds the IP landscape is dominated by foundries/OSATs and major companies, with newcomers being Chinese firms focusing on wafer-level packaging for integrated antennas. The IP
GaN Technology Top-100 IP profiles - SampleKnowmade
The field of III-N semiconductors has shown an intensive patenting activity since early 1990s, with a substantial increase during the past decade. Today, more than 76,200 patents and patent applications related to over 39,700 inventions on GaN technology have been published worldwide through November 2016. This fact is correlated with a rapid growth of the industrial activity related to GaN, mainly due to light-emitting diodes, but also to the emergence of lasers and high-power/high-frequency electronics. Moreover, the current diversification of GaN-related research activities is remarkable, ranging from advanced optical sources and single-electron devices to physical, chemical, and biological sensors, optical detectors, and energy converters. In this dynamic and large context, it is necessary to have a clear overview of main companies and research laboratories involved in this technology domain.
The report provides essential patent data for IP players related to GaN technology. It identifies 100 major patent holders involved in GaN technology, and its provides in a single slide the IP profile of each main patent holder including: time evolution of patent publications, geographic map of patenting activity, technical segments, highly cited patents, main IP competitors and IP collaborators.
The report provides essential patent data for FLUIDIGM’s portfolio including:
• Time evolution of patent publications and countries of patent filings
• Current legal status of patents
• Citation network, IP collaboration and competitive networks
• Inventor identification
• Key patent analysis
• Patents recently expired
• Granted patents near expiration
The report also provides an extensive Excel database with all patents analyzed in the study.
This document outlines TechIPm's methodology for analyzing wireless and mobile patents. It discusses their approaches to patent landscaping, essentiality analysis, portfolio evaluation, valuation, acquisition feasibility analysis, and developing essential patents. The methodologies involve searching patent databases, categorizing patents by technology and standards, comparing claims to specifications, and evaluating portfolios for quality, strengths/weaknesses, market value, and risks. The overall aim is to provide clients insights into technology innovations, competitive landscapes, intellectual property strategies, and business acquisition opportunities in wireless industries.
KnowMade is specialized in analysis of patents and scientific information. We provide patent search, IP landscape, patent valuation, IP due diligence, scientific literature landscape, identification of technologies available for transfer/licensing/sale, alerts and updates.
Our service offer consists of custom studies, analysis reports, on-demand tracking and strategy consulting. Knowmade combines information search services, scientific expertise, powerful analytics and visualization tools, and proprietary methodologies for analyzing patents and scientific information.
With a solid focus on Microelectronics, Nanotechnology and Biotechnology, KnowMade supports research laboratories, industrial companies and investors in their business development.
Emerging MEMSPatent Investigation 2014 Report by Yole DeveloppementYole Developpement
Who owns key patents for high-growth emerging MEMS innovations?
The report provides essential patent data, technology analysis and market forecasts for 7 selected Emerging MEMS (eMEMS) technologies that we believe will soon reach the marketplace: autofocus, AOC MEMS, chemical sensors, micro-speakers, scanning micro-mirrors, Si microfluidic and ultrasonic MEMS. The market for emerging MEMS covered in this report is expected to grow from US$171M in 2013 to US$2.8B in 2019, corresponding to a 58.2% CAGR.
UNDERSTAND WHICH COMPANIES OWN THE KEY PATENTS FOR THE FUTURE OF EMERGING MEMS
Patent activity related to eMEMS began in the 1990s and we observe a takeoff of patent publications for AutoFocus (AF), scanning micro-mirrors and ultrasonic MEMS technologies since the mid-2000s.
MEMS AF patent activity is new, but has increased since its emergence in 2009. This period also corresponds to the growth of the CMOS image sensor market for consumer applications, requiring more compact camera modules with more functionalities. Cambridge Mechatronics and DigitalOptics are currently the leading patent holders, but Korean giant LG has become a major force since 2010. Today MEMS AF is still a hot topic especially for cell phones and tablets, but wasn’t adopted in 2013. Although MEMS AF has promising market potential, it still faces strong market and technical challenges, which might explain the increasing patent activity of recent years.
More information on that report at http://www.i-micronews.com/mems-sensors-report/product/emerging-mems-patent-investigation-2014.html
Next generation power modules - patent landscape 2021 - sampleKnowmade
The advent of EV/HEV technology has acted as a catalyst for innovation, leading to an acceleration in applications for power module related patents since 2010. Who are the main IP players? How do they address the new challenges? Who are the new players and IP challengers taking the big opportunities arising from the emerging EV/HEV market?
Cancer diagnostics startup identification 2020 sampleKnowmade
Report’s Key Features
• PDF with > 430+ slides
• Identification & mapping of the startups that recently started to work in the field of cancer diagostics.
• Identification & mapping of the startups that recently started to work in the field of cancer diagnostics.
• Segmentation by technology (Medical imaging, Software, AI-based tool, Biochemical analysis, Molecular diagnostics, Lab-on-chip, Liquid biopsy etc.)
• Description of the startups and their current stage of product development, funding rounds and subsidies.
• Presentation of all their relevant published patent families.
• Description of key people and their background.
Cancer diagnostics startup identification 2020 flyerKnowmade
Report’s Key Features
• PDF with > 430+ slides
• Identification & mapping of the startups that recently started to work in the field of cancer diagostics.
• Identification & mapping of the startups that recently started to work in the field of cancer diagnostics.
• Segmentation by technology (Medical imaging, Software, AI-based tool, Biochemical analysis, Molecular diagnostics, Lab-on-chip, Liquid biopsy etc.)
• Description of the startups and their current stage of product development, funding rounds and subsidies.
• Presentation of all their relevant published patent families.
• Description of key people and their background.
Microneedles for drug delivery patent landscape 2020 flyerKnowmade
Report’s Key Features
• PDF with > 140 slides
• Excel file > 2,450 patent families
• IP trends, including time-evolution of published patents, and countries of patent filings
• Patents’ legal status
• Ranking of main patent assignees
• Key players’ IP position and relative strength of their patent portfolios
• Summary of the IP related to applications: Cancer therapy, Cosmetic, Diabetes, Ophthalmic, Pain management and Vaccine.
• Summary of the IP related to technologies: Applicators, housing, Coated, Hollow, Porous, Soluble, Hydrogel and Solid microneedles.
• Analysis of patent oppositions (Europe) and review of key patents.
• Excel database containing all patents analyzed in the report, including applications and technologies segmentations
Report’s Key Features
• PDF with > 80 slides
• Excel file > 4,350 patents
• Overview of the most recent patents published in 2019 by MEMS players.
• Main patent applicants.
• Main MEMS technologies and devices analyzed:
– Inertial sensors (accelerometers, gyroscopes, IMUs)
– Microphones
– Microspeakers
– Ultrasonic sensors
– Gas sensors
– Pressure sensors
– Micromirrors
– MEMS Packaging
• IP dynamics and trends of the different MEMS devices.
• Comparison of recent IP and market activities.
• Noticeable 2019 patents from main players.
• Excel database containing all patents analyzed in the report, including technology and application segmentation.
Report’s Key Features
• PDF with > 80 slides
• Excel file > 4,350 patents
• Overview of the most recent patents published in 2019 by MEMS players.
• Main patent applicants.
• Main MEMS technologies and devices analyzed:
– Inertial sensors (accelerometers, gyroscopes, IMUs)
– Microphones
– Microspeakers
– Ultrasonic sensors
– Gas sensors
– Pressure sensors
– Micromirrors
– MEMS Packaging
• IP dynamics and trends of the different MEMS devices.
• Comparison of recent IP and market activities.
• Noticeable 2019 patents from main players.
• Excel database containing all patents analyzed in the report, including technology and application segmentation.
Report’s Key Features
• PDF with > 280+ slides
• Identification & mapping of the startups that recently started to work in the field of Onco-Immunotherapy.
• Segmentation by technology (Immune check point inhibitor, Adoptive cell transfer, Bispecific antibody, Vaccine etc.)
• Description of the startups and their pipeline, funding rounds and subsidies.
• Presentation of all their published patent families.
• Description of key people and their background.
Report’s Key Features
• PDF with > 280+ slides
• Identification & mapping of the startups that recently started to work in the field of Onco-Immunotherapy.
• Segmentation by technology (Immune check point inhibitor, Adoptive cell transfer, Bispecific antibody, Vaccine etc.)
• Description of the startups and their pipeline, funding rounds and subsidies.
• Presentation of all their published patent families.
• Description of key people and their background.
Report’s Key Features
• PDF with > 310+ slides
• Identification of the startups that recently started to work in the field of Microfluidics
• Mapping of the new startups
• Segmentation by technology and application
• Focused analysis of the projects aiming at Oncology, Diabetes and Neurology.
• Description of the startups and their microfluidic-related projects
• Presentation of all their published patent families.
• Description of key people and their background.
• Excel database containing all patents analyzed in the report
Report’s Key Features
• PDF with > 310+ slides
• Identification of the startups that recently started to work in the field of Microfluidics
• Mapping of the new startups
• Segmentation by technology and application
• Focused analysis of the projects aiming at Oncology, Diabetes and Neurology.
• Description of the startups and their microfluidic-related projects
• Presentation of all their published patent families.
• Description of key people and their background.
• Excel database containing all patents analyzed in the report
Report’s Key Features
• PDF with > 160 slides
• Excel file > 5,500 patents
• IP trends, including time-evolution of published patents, and countries of patent filings
• Patents’ legal status
• Ranking of main patent assignees
• Key players’ IP position and relative strength of their patent portfolios
• Summary of the IP related to the physical isolation: size, deformability, electrical charges or density.
• Summary of the IP related to the biological isolation: positive or negative enrichment.
• Summary of the IP related to the CTC detection: nucleic acid, protein or functional assay.
• Analysis of patent litigations and review of key patents.
• Excel database containing all patents analyzed in the report, including biological and physical isolation and detection segmentations
Report’s Key Features
• PDF with > 200 slides
• Excel file > 2,500 patents
• IP trends, including time-evolution of published patents, countries of patent filings, etc.
• Patent segmentation per application: Optoelectronics and Photonics, Power, RF, PV and Sensors
• Ranking of main patent assignees
• Key players’ IP position and relative strength of their patent portfolios
• Established players and new entrants
• IP profile of key players, their key patents and their recent IP activity
• Patents recently expired and patents near expiration date
• Excel database containing all patents analyzed in the report, including technology and application segmentations
Report’s Key Features
• PDF with > 270 slides
• Excel file > 9,500 patents
• IP trends, including time-evolution of published patents, countries of patent filings, etc.
• Ranking of main patent assignees
• Key players’ IP position and relative strength of their patent portfolios
• Patent segmentation:
– Vertical power device (vertical transistor, vertical diode),
– Normally-off (E-mode transistor, cascode topology),
– Integration (monolithic E/D-mode, SiP/SoC, power IC),
– GaN-on-Si,
– GaN-on-Sapphire,
– Selective area p-type doping (ion implantation, p-GaN regrowth),
– Current collapse,
– Thermal management,
– Stray inductance,
– EV/HEV,
– fast charging,
– wireless charging.
• Key patent identification and details
• IP profile of 40 key players: Infineon, Panasonic, Toshiba etc.
• Excel database containing all patents analyzed in the report, including technology and application segmentations
Solid electrolytes for lithium ion solid state batteries patent landscape 201...Knowmade
Report’s Key Features
• PDF with > 250 slides
• Excel file > 5,800 patents
• IP trends, including time-evolution of published patents, legal status, countries of patent filings, etc.
• Ranking of main patent assignees
• Patent categorization by type of electrolyte (polymer, inorganic, inorganic/polymer) and inorganic electrolyte materials (sulfide glass ceramics, Thio-LISICON, argyrodite, oxide glass ceramics, NASICON, perovskite, garnet, anti-perovskite, hydride)
• For each technical segment: IP dynamics, ranking of main patent assignees, newcomers, key IP players (leadership, blocking potential, portfolio strength), key patents, and recent development trends
• For each key IP player (100+ companies): Time-evolution of patenting activity, legal status of patents and countries of patent filings, patent segmentation by electrolyte material, IP strengths and weaknesses by electrolyte material
• Excel database containing all patents analyzed in this report, including technology and material segmentations
Report’s Key Features
• PDF >160 slides
• Excel file >18,500 patents
• IP trends, including time-evolution of published patents, countries of patent filings, etc.
• Ranking of main patent assignees
• Main technologies IP analysis:
– Temperature-compensated acoustic wave filters
– Packaging (flip-chip, wafer-level packaging
– Functions and modules (duplexers, multiplexers)
• IP players’ key patents
• Key players’ IP position and relative strength of their patent portfolios
• IP profile of key players: Murata, TDK, Taiyo Yuden, Skyworks, Qualcomm, Broadcom, Qorvo, Samsung Electro Mechanics, Akoustis, Resonant, Infineon, CETC
• Excel database containing all patents analyzed in the report, including technology and application segmentations
Artifical intelligence in medical diagnostics 2019 patent landscape sampleKnowmade
Report’s Key Features
• PDF >170 slides
• Excel file >22,600 patents
• IP trends, including time-evolution of published patents, and countries of patent filings
• Ranking of main patent assignees
• Identifications of over 90 start-up firms and IP newcomers
• Summary of the IP related to the medical exams: ECG, EEG, EMG, MRI, CT scan, PET scan, facial analysis, speech analysis, OCT, etc.
• Summary of the IP related to the clinical areas involved: Cardiology, Oncology, Diabetes, Osteology, etc.
• Key patents & main litigations analysis
• Excel database containing all patents analyzed in this report, including technology and application segmentations
Artifical intelligence in medical diagnostics 2019 patent landscape flyerKnowmade
Report’s Key Features
• PDF >170 slides
• Excel file >22,600 patents
• IP trends, including time-evolution of published patents, and countries of patent filings
• Ranking of main patent assignees
• Identifications of over 90 start-up firms and IP newcomers
• Summary of the IP related to the medical exams: ECG, EEG, EMG, MRI, CT scan, PET scan, facial analysis, speech analysis, OCT, etc.
• Summary of the IP related to the clinical areas involved: Cardiology, Oncology, Diabetes, Osteology, etc.
• Key patents & main litigations analysis
• Excel database containing all patents analyzed in this report, including technology and application segmentations
Antenna for 5G patent landscape 2019 sampleKnowmade
Report’s Key Features
• PDF >120 slides
• Excel file >3,600 patents
• IP trends, including time-evolution of published patents, and countries of patent filings
• Ranking of main patent assignees
• Patent analysis for main applications (handsets, infrastructures & networks, vehicles) and technologies (MIMO, beamforming, antenna array, mm-wave, monopole antenna, dipole antenna, microstrip antenna, etc.)
• Key patents
• Key players’ IP position, and relative strength of their patent portfolios
• Key players’ IP profile: Samsung Electronics, Oppo Mobile, Huawei, and Intel
• Excel database containing all patents analyzed in this report, including technology and application segmentations
Antenna for 5G patent landscape 2019 flyerKnowmade
Report’s Key Features
• PDF >120 slides
• Excel file >3,600 patents
• IP trends, including time-evolution of published patents, and countries of patent filings
• Ranking of main patent assignees
• Patent analysis for main applications (handsets, infrastructures & networks, vehicles) and technologies (MIMO, beamforming, antenna array, mm-wave, monopole antenna, dipole antenna, microstrip antenna, etc.)
• Key patents
• Key players’ IP position, and relative strength of their patent portfolios
• Key players’ IP profile: Samsung Electronics, Oppo Mobile, Huawei, and Intel
• Excel database containing all patents analyzed in this report, including technology and application segmentations
This document provides a summary of a patent landscape analysis report on nanopore sequencing technologies. The analysis found that patent publications on nanopore sequencing have significantly increased from 2008-2013, following early work proving the concept. While industrial players are increasingly active, Harvard University's portfolio remains the strongest, followed by Illumina, Agilent, University of California, and Roche. Oxford Nanopore Technologies' portfolio is not the strongest but the company benefits from university partnerships. Several microelectronics companies have also recently filed solid-state nanopore patents. Most major assignees have an international IP strategy with a strong US and European presence. The report provides a detailed analysis of patents segmented by nanopore technology and application, as well as profiles of key
Best 20 SEO Techniques To Improve Website Visibility In SERPPixlogix Infotech
Boost your website's visibility with proven SEO techniques! Our latest blog dives into essential strategies to enhance your online presence, increase traffic, and rank higher on search engines. From keyword optimization to quality content creation, learn how to make your site stand out in the crowded digital landscape. Discover actionable tips and expert insights to elevate your SEO game.
How to Interpret Trends in the Kalyan Rajdhani Mix Chart.pdfChart Kalyan
A Mix Chart displays historical data of numbers in a graphical or tabular form. The Kalyan Rajdhani Mix Chart specifically shows the results of a sequence of numbers over different periods.
Fueling AI with Great Data with Airbyte WebinarZilliz
This talk will focus on how to collect data from a variety of sources, leveraging this data for RAG and other GenAI use cases, and finally charting your course to productionalization.
Your One-Stop Shop for Python Success: Top 10 US Python Development Providersakankshawande
Simplify your search for a reliable Python development partner! This list presents the top 10 trusted US providers offering comprehensive Python development services, ensuring your project's success from conception to completion.
Salesforce Integration for Bonterra Impact Management (fka Social Solutions A...Jeffrey Haguewood
Sidekick Solutions uses Bonterra Impact Management (fka Social Solutions Apricot) and automation solutions to integrate data for business workflows.
We believe integration and automation are essential to user experience and the promise of efficient work through technology. Automation is the critical ingredient to realizing that full vision. We develop integration products and services for Bonterra Case Management software to support the deployment of automations for a variety of use cases.
This video focuses on integration of Salesforce with Bonterra Impact Management.
Interested in deploying an integration with Salesforce for Bonterra Impact Management? Contact us at sales@sidekicksolutionsllc.com to discuss next steps.
Skybuffer AI: Advanced Conversational and Generative AI Solution on SAP Busin...Tatiana Kojar
Skybuffer AI, built on the robust SAP Business Technology Platform (SAP BTP), is the latest and most advanced version of our AI development, reaffirming our commitment to delivering top-tier AI solutions. Skybuffer AI harnesses all the innovative capabilities of the SAP BTP in the AI domain, from Conversational AI to cutting-edge Generative AI and Retrieval-Augmented Generation (RAG). It also helps SAP customers safeguard their investments into SAP Conversational AI and ensure a seamless, one-click transition to SAP Business AI.
With Skybuffer AI, various AI models can be integrated into a single communication channel such as Microsoft Teams. This integration empowers business users with insights drawn from SAP backend systems, enterprise documents, and the expansive knowledge of Generative AI. And the best part of it is that it is all managed through our intuitive no-code Action Server interface, requiring no extensive coding knowledge and making the advanced AI accessible to more users.
leewayhertz.com-AI in predictive maintenance Use cases technologies benefits ...alexjohnson7307
Predictive maintenance is a proactive approach that anticipates equipment failures before they happen. At the forefront of this innovative strategy is Artificial Intelligence (AI), which brings unprecedented precision and efficiency. AI in predictive maintenance is transforming industries by reducing downtime, minimizing costs, and enhancing productivity.
Letter and Document Automation for Bonterra Impact Management (fka Social Sol...Jeffrey Haguewood
Sidekick Solutions uses Bonterra Impact Management (fka Social Solutions Apricot) and automation solutions to integrate data for business workflows.
We believe integration and automation are essential to user experience and the promise of efficient work through technology. Automation is the critical ingredient to realizing that full vision. We develop integration products and services for Bonterra Case Management software to support the deployment of automations for a variety of use cases.
This video focuses on automated letter generation for Bonterra Impact Management using Google Workspace or Microsoft 365.
Interested in deploying letter generation automations for Bonterra Impact Management? Contact us at sales@sidekicksolutionsllc.com to discuss next steps.
Building Production Ready Search Pipelines with Spark and MilvusZilliz
Spark is the widely used ETL tool for processing, indexing and ingesting data to serving stack for search. Milvus is the production-ready open-source vector database. In this talk we will show how to use Spark to process unstructured data to extract vector representations, and push the vectors to Milvus vector database for search serving.
Main news related to the CCS TSI 2023 (2023/1695)Jakub Marek
An English 🇬🇧 translation of a presentation to the speech I gave about the main changes brought by CCS TSI 2023 at the biggest Czech conference on Communications and signalling systems on Railways, which was held in Clarion Hotel Olomouc from 7th to 9th November 2023 (konferenceszt.cz). Attended by around 500 participants and 200 on-line followers.
The original Czech 🇨🇿 version of the presentation can be found here: https://www.slideshare.net/slideshow/hlavni-novinky-souvisejici-s-ccs-tsi-2023-2023-1695/269688092 .
The videorecording (in Czech) from the presentation is available here: https://youtu.be/WzjJWm4IyPk?si=SImb06tuXGb30BEH .
Dive into the realm of operating systems (OS) with Pravash Chandra Das, a seasoned Digital Forensic Analyst, as your guide. 🚀 This comprehensive presentation illuminates the core concepts, types, and evolution of OS, essential for understanding modern computing landscapes.
Beginning with the foundational definition, Das clarifies the pivotal role of OS as system software orchestrating hardware resources, software applications, and user interactions. Through succinct descriptions, he delineates the diverse types of OS, from single-user, single-task environments like early MS-DOS iterations, to multi-user, multi-tasking systems exemplified by modern Linux distributions.
Crucial components like the kernel and shell are dissected, highlighting their indispensable functions in resource management and user interface interaction. Das elucidates how the kernel acts as the central nervous system, orchestrating process scheduling, memory allocation, and device management. Meanwhile, the shell serves as the gateway for user commands, bridging the gap between human input and machine execution. 💻
The narrative then shifts to a captivating exploration of prominent desktop OSs, Windows, macOS, and Linux. Windows, with its globally ubiquitous presence and user-friendly interface, emerges as a cornerstone in personal computing history. macOS, lauded for its sleek design and seamless integration with Apple's ecosystem, stands as a beacon of stability and creativity. Linux, an open-source marvel, offers unparalleled flexibility and security, revolutionizing the computing landscape. 🖥️
Moving to the realm of mobile devices, Das unravels the dominance of Android and iOS. Android's open-source ethos fosters a vibrant ecosystem of customization and innovation, while iOS boasts a seamless user experience and robust security infrastructure. Meanwhile, discontinued platforms like Symbian and Palm OS evoke nostalgia for their pioneering roles in the smartphone revolution.
The journey concludes with a reflection on the ever-evolving landscape of OS, underscored by the emergence of real-time operating systems (RTOS) and the persistent quest for innovation and efficiency. As technology continues to shape our world, understanding the foundations and evolution of operating systems remains paramount. Join Pravash Chandra Das on this illuminating journey through the heart of computing. 🌟
Unlock the Future of Search with MongoDB Atlas_ Vector Search Unleashed.pdfMalak Abu Hammad
Discover how MongoDB Atlas and vector search technology can revolutionize your application's search capabilities. This comprehensive presentation covers:
* What is Vector Search?
* Importance and benefits of vector search
* Practical use cases across various industries
* Step-by-step implementation guide
* Live demos with code snippets
* Enhancing LLM capabilities with vector search
* Best practices and optimization strategies
Perfect for developers, AI enthusiasts, and tech leaders. Learn how to leverage MongoDB Atlas to deliver highly relevant, context-aware search results, transforming your data retrieval process. Stay ahead in tech innovation and maximize the potential of your applications.
#MongoDB #VectorSearch #AI #SemanticSearch #TechInnovation #DataScience #LLM #MachineLearning #SearchTechnology
Nunit vs XUnit vs MSTest Differences Between These Unit Testing Frameworks.pdfflufftailshop
When it comes to unit testing in the .NET ecosystem, developers have a wide range of options available. Among the most popular choices are NUnit, XUnit, and MSTest. These unit testing frameworks provide essential tools and features to help ensure the quality and reliability of code. However, understanding the differences between these frameworks is crucial for selecting the most suitable one for your projects.
5th LF Energy Power Grid Model Meet-up SlidesDanBrown980551
5th Power Grid Model Meet-up
It is with great pleasure that we extend to you an invitation to the 5th Power Grid Model Meet-up, scheduled for 6th June 2024. This event will adopt a hybrid format, allowing participants to join us either through an online Mircosoft Teams session or in person at TU/e located at Den Dolech 2, Eindhoven, Netherlands. The meet-up will be hosted by Eindhoven University of Technology (TU/e), a research university specializing in engineering science & technology.
Power Grid Model
The global energy transition is placing new and unprecedented demands on Distribution System Operators (DSOs). Alongside upgrades to grid capacity, processes such as digitization, capacity optimization, and congestion management are becoming vital for delivering reliable services.
Power Grid Model is an open source project from Linux Foundation Energy and provides a calculation engine that is increasingly essential for DSOs. It offers a standards-based foundation enabling real-time power systems analysis, simulations of electrical power grids, and sophisticated what-if analysis. In addition, it enables in-depth studies and analysis of the electrical power grid’s behavior and performance. This comprehensive model incorporates essential factors such as power generation capacity, electrical losses, voltage levels, power flows, and system stability.
Power Grid Model is currently being applied in a wide variety of use cases, including grid planning, expansion, reliability, and congestion studies. It can also help in analyzing the impact of renewable energy integration, assessing the effects of disturbances or faults, and developing strategies for grid control and optimization.
What to expect
For the upcoming meetup we are organizing, we have an exciting lineup of activities planned:
-Insightful presentations covering two practical applications of the Power Grid Model.
-An update on the latest advancements in Power Grid -Model technology during the first and second quarters of 2024.
-An interactive brainstorming session to discuss and propose new feature requests.
-An opportunity to connect with fellow Power Grid Model enthusiasts and users.
Let's Integrate MuleSoft RPA, COMPOSER, APM with AWS IDP along with Slackshyamraj55
Discover the seamless integration of RPA (Robotic Process Automation), COMPOSER, and APM with AWS IDP enhanced with Slack notifications. Explore how these technologies converge to streamline workflows, optimize performance, and ensure secure access, all while leveraging the power of AWS IDP and real-time communication via Slack notifications.