1. Package Types & Packaging Design Consideration

2. INTRODUCTION
PACKAGE DESIGN CONSIDERATIONS
No. of
Electrical Thermal Reliability Testability
terminals
PACKAGE TYPES
Through Hole Packaging Surface Mounted Packaging

3. •What is packaging?
•What is the need for packaging?
•What are the various packaging requirements?

4. • Packaging?
1. science and the art of establishing
interconnections
2. a suitable operating environment for electrical
circuits.
•Need for Packaging?
1.Supplies wires to distribute signals and power
2. Removes the heat generated by the circuits
3. Provides physical support and environmental
protection.

5. •Electronic Packaging Requirements?

6. •The Basic Rule
•Various Package Parameters
Number of Terminals
Electrical Design Considerations
Thermal Design Considerations
Reliability
Testability

7.  As a rule, application requirements prescribe:
1. The number of logic circuits and/or bits of
storage that must be
2. packaged (interconnected),
3. supplied with electric power,
4. kept within a proper temperature range,
5. mechanically supported, and
6. protected against the environment.

8. 1. No. of Terminals
- Major cost factor
- Dependent on the function of VLSI device
- The smallest pin-out memory IC(stream
of data can be limited to a single bit)
- Larger pin-outs  groups of logic
circuits(result from a random partitioning of
a computer.)

9. 2. Electrical Design Considerations
- As a signal propagates, it is degraded due
to reflections and line resistance.
- Controlling the resistance and the
inductance  Controls switching noise
- Controlling the impedance  Controls
reflection-related noise
- Controlling the capacitive coupling 
Reduces crosstalk

10. 3. Thermal Design Considerations:
- Keep the operating junction temperature
low prevents triggering the temperature-
activated failure
- General recommendation  junction
temperature < 150°C
- Heat transfer :
chip surface (by conduction )
package surface the ambient (by
convection and radiation)

11. 4. Reliability:
- Good thermo-mechanical performance 
Good reliability
- Interfaces are subject to relatively high
process temperatures as the device is
powered ON/OFF  residual stresses are
created  Reliability problems in the
packages.

12. 5. Testability:
- Assumption: a zero defect manufacturing.
- Rarely practiced because of the high costs.
- Several tests are employed to assess the
reliability .

13. • Basic difference between surface mount(SM) and
through hole(TH) technology
• TH: DIP, QFP and PGA
•SMT: SOP, PLCC and LCCC
• Chip Size Packaging
•Multi Chip Moldules

14.  Through Hole: uses  Surface Mount: a chip
precision holes drilled carrier is soldered to the
through the board and pads on the surface of a
plated with copper. board.
 Advantages:  Advantages:
- a sturdy support for the - smaller component
chip carrier. sizes,
- resists stresses caused - lack of through holes,
by the expansions of - possibility of mounting
components at raised chips on both sides of the
temperatures. PC board.

15. A generic schematic diagram showing the difference between the surface-
mount technology (upper) and through hole technology.

16.  Dual-in-Line Packages (DIPs): rectangular
package with two rows of pins in its two sides.
 Quad-Flat Packages (QFPs): pins are provided on
all four sides.
 Pin Grid Arrays (PGA): has leads on its entire
bottom surface rather than only at its periphery.

17.  Small-Outline Packages (SOPs): has gull-wing
shaped leads;
Advantage: requires less pin spacing
 Plastic-leaded chip carriers(PLCCs):
Advantage: offer higher pin counts than SOP as
J-leaded chip carriers pack denser.
 Leadless Ceramic Chip Carriers (LCCCs): The
conductors are left exposed around the package;
Advantage: Uses multilayer ceramic technology
which has high thermal conductivity.

18. Small outline Plastic leaded Leadless ceramic